List of Electronic Components and Modules products
- classification：Electronic Components and Modules
2566～2610 item / All 59410 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
USB interface high-speed DA converter unit (Resolution: 14bit Conversion rate: 1MHz)
- converter
[New Product] USB Interface High-Speed DA Converter Unit (Resolution: 14bit Conversion Rate: 1MHz) 'TUSB-0214DAM' Now Available!
This unit is a USB interface DA converter with a resolution of 14 bits and a conversion rate of 1 MHz. The analog output is available through 2 channels of BNC connectors, allowing for continuous waveform output without limitation in combination with FIFO memory and USB, in addition to high-resolution DC voltage output. It can also be used as a variable reference voltage source, function generator, arbitrary waveform generator, etc. Please note that this product is a cost-effective version of the TUSB-0416DAM.
The optical relay adapter [female/female] is used to connect two optical fiber cables.
- Other network tools
- Optical Experimental Parts
I can understand the differences between tin plating, silver plating, and nickel plating.
- transformer
The participation in the JECAFAIR 2026 Electrical Industry Exhibition has been confirmed.
We have decided to exhibit at "JECAFAIR 2026 Electric Construction Industry Exhibition," which will be held at Tokyo Big Sight from May 27 (Wednesday) to May 29 (Friday). We will be exhibiting right at the entrance of booth number 1-54 in Hall 1 East. On the final day, our on-site workers, who process 150 tons of copper busbars annually, will share insights about the characteristics of copper, the challenges of processing, and information that only those on-site would know during the exhibitor seminar! For more details, please visit the official website! We sincerely look forward to your visit!
High-power optical fiber cables necessary for laser processing! An explanation from applications to structure.
- LAN/Optical cable
For thermal management of medium-sized devices. You can specify the ideal length in 1mm increments, without being constrained by the fixed sizes in the catalog, to match the enclosure space.
- Other semiconductors
It is used for measuring distortions, temperature, pressure, vibrations, and other factors of structures.
- Other measurement, recording and measuring instruments
- Sensors
Not constrained by fixed catalog sizes. You can specify the ideal length in millimeters to match thermal design and enclosure space. Additional processing can also be handled in bulk!
- Other semiconductors
A microwave process that achieves high-speed, internal, and selective heating. A systematic explanation from its principles to measures against thermal runaway and hotspots, equipment design, and prac...
- microwave oven
- High frequency/microwave parts
- Technical Seminar
Small yet high precision! Accuracy 3/10000 (non-linearity, hysteresis, repeatability) Compact tension and compression dual-purpose load cell.
- Sensors
- Sensors
I will briefly explain how to connect optical fibers.
- Optical Connector
We will comprehensively introduce practical examples such as optical fibers and optical modules, covering everything from the basics to applications and future development trends.
- Other optical parts
I will explain the features and basic structure of OCT, as well as its applications.
- Other optical parts
Minimum shape dimension 0.2μm Innovate your business with ultra-fine 3D printing services!!
- lens
- Microscope
- Microarrays and DNA chips
Utilizing lost-wax technology that handles various materials. Leave the prototypes aimed at weight reduction to us!
- Other industrial robots
- Other machine elements
- Other electronic parts
I was involved in the production of the "touchable" model of Kencho-ji Temple in Kamakura City.
The "touchable" model of Kenchoji Temple was conceived by the Universal Picture Book Library UniLeaf (represented by Toshie Oshima, located in Hayama, Kanagawa Prefecture) with the concept of allowing visually impaired individuals to feel historical buildings with their hands, enabling them to share the excitement of travel together. Subsequently, it received support from many donors through grants from the "Support Each Other Fund" and crowdfunding, leading to its production. To realize the concept of feeling historical buildings by touch, a 1/50 scale miniature of the Kenchoji Temple Buddha Hall was meticulously recreated in bronze, paying close attention to detail. Our company was responsible for the production of the castings, which consist of approximately 30 parts. This in-house technology utilizes a casting method called "Digital Cast," which excels in producing unique, one-of-a-kind items without the need for mold fabrication. The model has been permanently installed in front of the Kenchoji Temple Buddha Hall since the day after the ceremony, allowing visitors to touch it freely. If you visit Kenchoji Temple in Kamakura, please take a look. [Manufacturing Responsible] Prototype resin model production and casting machining: JMC Corporation Casting (moldless casting "Digital Cast"): Castem Corporation
Applications in position, distance, and shape measurement are expected in various scenarios.
- Other optical parts
We will accurately fulfill your wishes for vision installation in a one-stop service!
- LCD display
No machining is required for the production of ultra-small pin nozzles. Precision metal parts are manufactured using "MIM," which also accommodates medical device components.
- nozzle
- Piezoelectric Devices
- High frequency/microwave parts
Castem Co., Ltd. will exhibit simultaneously at the Manufacturing World Nagoya, Mechanical Elements Technology Exhibition, and Next-Generation 3D Printer Exhibition.
The "Monozukuri World Nagoya" will be held at Port Messe Nagoya from April 8 (Wednesday) to April 10 (Friday), 2026, where we will exhibit simultaneously at the "Mechanical Components Technology Exhibition" and the "Next Generation 3D Printer Exhibition." "We have high cutting costs for complex shapes," and "We cannot decide on mass production methods after prototyping"... We will showcase optimal solutions for customers troubled by prototyping and mass production of metal parts. If you are struggling with selecting methods for mass-produced items or reducing costs, please visit the "Mechanical Components Technology Exhibition." If you are having difficulties with single-item or one-off production, please come to the "Next Generation 3D Printer Exhibition." We sincerely look forward to your visit. 【Exhibition Overview】 ■ Event Name: Monozukuri World Nagoya ■ Dates: April 8 (Wednesday) to April 10 (Friday), 2026, 10:00 AM to 5:00 PM ■ Venue: Port Messe Nagoya (2-2 Kinjo-futo, Minato Ward, Nagoya) ■ Exhibition Content and Booth Numbers: Lost wax precision casting, MIM (casting demonstrations included) ➔ Mechanical Components Technology Exhibition… Hall 1, Booth 7-9 Mold-less casting digital cast ➔ Next Generation 3D Printer Exhibition… Hall 1, Booth 12-10
I will explain the types and principles of important devices that amplify light at high speeds.
- Other optical parts
Looking for the appropriate PD. An explanation of the types of photodiodes and their structural characteristics!
- diode
Explanation of the basic principles and applications of "saturable absorption materials" and "saturable absorption mechanisms."
- Laser Components
Pin fin heat sink, width 40mm, height 20mm, length 40mm, material: Al99.5.
- Other semiconductors
Square pin fin heat sink, width 50mm, height 25mm, length 50mm, material: Al99.5.
- Other semiconductors
Fiber optic cables with a heat resistance temperature of up to 250℃! You can choose from three types of transmission wavelengths according to your measurement content and application.
- LAN/Optical cable
- Other electronic parts
Maspower_E096-1A_96W_Constant Voltage AC Adapter
- power supply
faytech, ultra-thin casing, optical bonding compatible, supports power, video, and touch signals with a single USB Type-C, capacitive touch.
- LCD display
Introducing high-performance, high-efficiency products that meet strict industry standards!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Significantly improved design flexibility in applications with space constraints!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Additional board maintenance is possible! Ensures minimization of contact resistance between the wire and crimp barrel.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Provides essential power efficiency for cost management! Designed for manufacturing flexibility and excellent electrical performance.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Multiple types of circuit board stacking designs are possible, providing flexibility in design!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
faytech, ultra-thin casing, supports optical bonding, powered and video transmission via a single USB Type-C cable.
- LCD display
Maspower S100-1A 100W Constant Voltage AC Adapter
- power supply
Maximize high-speed transmission processing performance and clean routing away from the connector installation area!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
The flexible cable link provides relaxed tolerances and architectural flexibility!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Cost reduction through hermaphroditic design! Shortened lead time and simplified product matrix.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Providing a high-density and slim solution for interconnecting with SI performance!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
An OCP-recommended internal I/O connector solution designed specifically for boot drive applications!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Designed for internal wiring, enabling support for artificial intelligence (AI) and machine learning applications!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.