List of Electronic Components and Modules products
- classification:Electronic Components and Modules
2341~2385 item / All 59410 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).
- Contract Analysis
- Transistor
The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.
- Contract Analysis
- magnet
- Memory
Microscopic structural analysis of amorphous films is possible through simulation.
- Contract Analysis
- Memory
Evaluation of particle size and crystal orientation of living materials, atomic-level observation is possible.
- Charger
- Contract measurement
This is a method for conducting elemental analysis and compositional analysis by detecting fluorescent X-rays generated by irradiating with X-rays and spectrally analyzing them using energy or a spect...
- Contract Analysis
- Other contract services
- Circuit board design and manufacturing
It is a method for measuring the energy and intensity of ions scattered backward by Rutherford scattering after irradiating a solid sample with an ion beam.
- Contract Analysis
- Other contract services
- Circuit board design and manufacturing
It is possible to confirm the stress distribution in the sample cross-section.
- Contract Analysis
- Wafer
It is possible to evaluate trace metals in ppm orders.
- Contract Analysis
- Ceramics
- Wafer
Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.
- Contract Analysis
- Transistor
- Power storage device
Reverse engineering of smartphone components
- Contract Analysis
- lens
Quantitative evaluation of the quality of sensory products is possible.
- Contract Analysis
- LCD display
Non-destructive three-dimensional observation of the internal structure of a discrete package.
- Contract Analysis
- Other semiconductors
Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.
- Contract Analysis
- Other semiconductors
Evaluation of microscopic atomic structures is possible through computational simulation.
- Contract Analysis
- Other semiconductors
Reverse engineering of DRAM on the product's internal substrate.
- Contract Analysis
- Memory
It is possible to obtain insights into the size and distribution of crystal grains in metallic polycrystals.
- Contract Analysis
- Memory
Case studies observed using X-ray CT.
- Contract Analysis
- Secondary Cells/Batteries
The temperature dependence evaluation of the desorption of specific organic components is possible through composite analysis.
- Contract Analysis
- Secondary Cells/Batteries
- LCD display
Detailed illustrations of the schematic diagram near the electrolyte interface and the solvation structure in the electrolyte are provided!
- Lithium-ion battery
It is possible to evaluate the shape change and strain energy when external forces are applied to nanomaterials.
- Contract Analysis
- others
- Secondary Cells/Batteries
We will evaluate the internal structure of the device in a comprehensive manner.
- Contract Analysis
- Other electronic parts
It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.
- Contract measurement
- Transistor
- Memory
Simultaneous measurement of inorganic and organic components in minute specific areas.
- Contract measurement
- Wafer
- Memory
Not only the surface, but also up to a depth of 30nm - Quantitative evaluation of the chemical state at the surface and inside the material at the same location and non-destructively!
- Secondary Cells/Batteries
We evaluate abnormalities inside the device non-destructively.
- Contract Analysis
- Other electronic parts
- Transistor
Composite approach to the cross-sectional structure and surface shape of the negative electrode, as well as elemental mapping images of the active material cross-section!
- Secondary Cells/Batteries
- Contract measurement
Impurities in films and interfaces such as plating can be evaluated using TOF-SIMS.
- Wafer
- Contract measurement
- Other semiconductors
Shape observation and simple quantitative analysis using SEM-EDX.
- Contract Inspection
- Wafer
- Other semiconductor manufacturing equipment
You can evaluate the p/n polarity and carrier concentration distribution of the diffusion layer in SiC devices.
- Contract Analysis
- Other electronic parts
It is effective to differentiate between the two methods depending on the surface structure of interest.
- Contract Analysis
- Memory
Quantitative evaluation of the guest in the light-emitting layer and film thickness is possible.
- LCD display
High-sensitivity analysis of various solutions, such as pure water and wafer cleaning liquids, is possible.
- Contract Analysis
- Wafer
- Water quality testing
It is possible to evaluate the degree of curing of the resin by capturing changes in functional groups.
- Contract Analysis
- Other electronic parts
It is possible to evaluate the competitive adsorption of multiple molecules using the focus parameters for film formation (temperature, pressure).
- Contract Analysis
- Other electronic parts
- Memory
It is possible to predict and evaluate the diffusion behavior of ions by changing the composition and temperature.
- Lithium-ion battery
Just wrap it around to protect the wiring! Excellent wear resistance, safe even in moving parts.
- Other cable related products
- tube
Lightweight, disposable connector to maintain the cleanliness of endoscopes.
- connector
- Rectangular Connector
A lineup of standard products that can be used in various industries and applications! You can choose from your desired polarization, directivity, and shape to solve your challenges.
- antenna
[Model Number Change] The coaxial connector of the UHF band RFID sheet antenna "FZSH200J/FZSH400J" has been changed to an SMA plug.
Based on customer requests, the coaxial connector of the UHF band RFID sheet antenna "FZSH200J/FZSH400J" has been changed from [SMA jack] to [SMA plug]. Consequently, the model number suffix has been changed from "J" to "P," resulting in "FZSH200P/FZSH400P." For details, please download the catalog and check.
Maspower_S012-1D_12W_Constant Voltage AC Adapter
- power supply
We deliver target materials for PVD and materials for vacuum deposition in small quantities and with short lead times!
- Other metal materials
- Other electronic parts
【New Feature】Automating the leveling of 3D printer tables! We will explain the "automatic adjustment function" that balances the quality and efficiency of large-scale printing!
- 3D Printer
- Stepping motor
- shaft
Not only the power supply, but also the AC power cord, please leave it to us.
- power supply
- AC adapter
AC cord / AC power cable [In stock] PSE, etc.
【Aiko Electronic Stock Items】 3-Pin Cable with Ground Rod (3P-3P) 1800MM 2-Pin Cable with Ground Wire (3P-2P Ground Wire) 1800MM 2-Pin Cable (2P-2P) 1800MM 【Manufacturer Stock Items】 3-Pin Cable with Ground Rod (3P-3P) 500MM 3-Pin Cable with Ground Rod (3P-3P) 1000MM 3-Pin Cable with Ground Rod (3P-3P) 1500MM 3-Pin Cable with Ground Rod (3P-3P) 2000MM 3-Pin Cable with Ground Rod (3P-3P) 3000MM *For detailed specifications, stock status, prices, and MOQ, please inquire. We also handle AC power cables from various countries. Feel free to contact us!
Maspower_S018A1D_18W_Constant Voltage AC Adapter
- power supply
Achieve high-precision control while minimizing energy loss! A comparison table with other methods is also included.
- Circuit board design and manufacturing