List of Design and production support products
- classification：Design and production support
556～570 item / All 12679 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
IRONCAD's Power Booster, which can add 180 types of functions.
- 3D CAD
[Customizable] Simulation software that can visualize magnetic field distribution and eddy current density distribution! Also analyzes eddy current deep flaw detection method. *[Web consultations are ...
- Magnetic field analysis/electromagnetic wave analysis
- Analysis Services
- Contract Analysis
![[Analysis Case] Analysis Case of Hi...](https://image.mono.ipros.com/public/product/image/7c8/2000060401/IPROS09775813543743015527.gif?w=280&h=280){kind=small}
The subject of analysis is a hinge-type electromagnetic relay switch.
- Magnetic field analysis/electromagnetic wave analysis
- Analysis Services
- Contract Analysis
Production efficiency has improved, achieving cost performance that can respond to overseas markets while still being domestically produced!
- Prototype Services
Utilizing a wealth of knowledge as a printer manufacturer, we are promoting the development of new semiconductor processing tape!
- Prototype Services
The introduction of our screen printing machine has made it possible to receive orders for mass production projects, achieving business scale expansion!
- Prototype Services
Achieving high-precision overlay of approximately 30μm, as per the customer's printing conditions, through automatic correction!
- Prototype Services
A non-traditional concept of "collaborative manufacturing support"! An explanation of a development method that considers everything from prototyping to mass production.
- Prototype Services
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
The prototype environment is shifting from "having" to "utilizing external resources"! Introducing the approach to prototyping that leads to mass production.
- Prototype Services
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
We specialize in proposal-based support for materials, design, and processes from prototype to mass production!
- Prototype Services
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Responding to "sudden increases in production" with zero capital investment in our own facilities. Three "process integration" steps achieved with external partners.
- Prototype Services
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
An explanation of the basic knowledge and use cases of flexible hybrid electronics (FHE). Introducing technologies that are useful for the development of next-generation electronic devices.
- Prototype Services
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Explaining the basic knowledge of FHE to address challenges such as the communication limits of printing and the rigidity of ICs for vehicle-mounted and wearable curved surfaces.
- Prototype Services
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!