List of Manufacturing and processing machinery products

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• Sensors

We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

• Other semiconductors
• Processing Contract
• Wafer

Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.

• Bonding Equipment

Processing capacity of 60,000 units per hour. Contributes to quality assurance and productivity improvement by performing six-sided inspections of dies without reducing speed.

• Bonding Equipment

Equipped with two chromatic confocal line sensors. Achieves high-speed and high-precision dual-side thickness analysis at 2×384,000 data points per second.

• Bonding Equipment

Achieves high-resolution 3D optical measurement within a maximum range of 350×350mm². Supports extensive surface analysis with six types of sensor technologies.

• Bonding Equipment

Turn waste paint into waste plastic! It can be easily processed just by mixing in a chemical.

• Painting Machine
• paint

Achieving a very simple and compact wastewater treatment system! It meets various needs with excellent coagulation ability and high versatility.

• Glass
• Grinding Machine
• Casting Machine

Cleaning the circulating water will make both cleaning and disposal easier! It reduces unpleasant odors and keeps it consistently clear.

• Painting Machine
• spray
• paint

Assist CA is a liquid pH adjuster specifically designed for the circulation water in wet paint booths. Unlike caustic soda, it is not classified as a hazardous substance and can be used safely.

• Painting Machine
• spray
• paint

Can be treated with just one agent! Contributes to reducing the total running costs, including the disposal costs of generated sludge.

• Bag making machine/slitter
• Paper and pulp products
• Paper Converting Machinery

Achieving high-speed processing of over 40,000 units per hour and high precision of less than 5μm. Supports multi-faceted assembly such as face-up and flip chip.

• Bonding Equipment