List of Manufacturing and processing machinery products
- classification：Manufacturing and processing machinery
91～135 item / All 102080 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
![[Column] Episode 2 Part 2 - Solve t...](https://image.mono.ipros.com/public/product/image/43c/2000894173/IPROS92238813014816664627.jpeg?w=280&h=280){kind=small}
~Me, Kenma, and IMT~
- Wafer processing/polishing equipment
![[Introduction] Sample Lab Center](https://image.mono.ipros.com/public/product/image/3bb/2000721861/IPROS98872278153279056483.png?w=280&h=280){kind=small}
We will make proposals centered around polishing machines, polishing devices, and sample polishing machines, utilizing the know-how of all precision polishing technologies.
- Wafer processing/polishing equipment
Production of holders that meet your requests! We can create holders that respond to customer needs based on in-house design, and we are also capable of producing special shapes such as porous types a...
- Wafer processing/polishing equipment
Contributing to the simplification of inspection tasks with air-free semi-automatic polishing.
- Wafer processing/polishing equipment
![[Column] Episode 3 Part 1 - Manual ...](https://image.mono.ipros.com/public/product/image/51a/2000939251/IPROS69540763987577600618.jpeg?w=280&h=280){kind=small}
~Me, Kenma, and IMT~
- Wafer processing/polishing equipment
![[Column] Episode 3 Part 2 - Manual ...](https://image.mono.ipros.com/public/product/image/159/2000939252/IPROS28817244719473077497.jpeg?w=280&h=280){kind=small}
~Me, Kenma, and IMT~
- Wafer processing/polishing equipment
Perfect for creating high-precision samples! We are currently giving away a technical book that reveals the best polishing conditions, leading to process reduction and improved accuracy!!
- Wafer processing/polishing equipment
Ideal for high-precision sample preparation! We also propose optimal polishing conditions! Reliable domestic machines with comprehensive after-sales support!
- Wafer processing/polishing equipment
We respond to our customers' needs with a consistent production system that encompasses everything from design to assembly, with meticulous attention and a sense of speed.
- Wafer processing/polishing equipment
Presentation of Materials: Comprehensive Catalog of Grinding Machines for Integrated Production from Design to Assembly / IMT Corporation
IMT Corporation is a precision grinding equipment manufacturer headquartered in Wakayama. We previously had sales offices in Tokyo, Osaka, and Nagoya, but we have now decided to finally expand into Kyushu. Our company has been providing production equipment for the semiconductor and liquid crystal panel industries, as well as equipment for preparing materials for microscopic observation, for many years. Through our "domestic sample grinding machines" and "consumables for microscope sample preparation and grinding materials," we will consult on our customers' quality assurance operations. 【Features】 - Consistent support: A comprehensive production system from design to assembly in-house - Speedy response: Detailed and prompt service *For more details, please download the materials or contact us directly.
This is a new silicon wafer edge polishing device developed with the concept of space-saving and high throughput.
- Wafer processing/polishing equipment
Input various settings and can memorize 20 conditions! At the end, it will notify you with an electronic sound.
- Special Processing Machinery
High-Spec Dedicated Load Grinding Device
- Wafer processing/polishing equipment
A final polishing compound that enables the achievement of the highest level of polished surface when used in conjunction with the polishing cloth "Silica Final"!
- Wafer processing/polishing equipment
- Other abrasives
Particle size 0.045μm! A polishing agent that is difficult to agglomerate and settle, and can be dispersed in various organic solvents such as alcohol!
- Wafer processing/polishing equipment
- Other abrasives
Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.
- Wafer processing/polishing equipment
- Other abrasives
The table is rotatable! We have types available for use with a vacuum pump or a compressor!
- Vacuum Equipment
- Vacuum forming machine
Realization of low Ra using high-quality grinding tape.
- Wafer processing/polishing equipment
[Made in Japan] Precision Grinding Tape Used
- Wafer processing/polishing equipment
The stock table can be custom-made up to a maximum of 90 pieces! You can also input conditions for the gas release during embedding.
- Special Processing Machinery
- Other processing machines
Prevents rust without moisture! Using diamond abrasives with a uniform particle size distribution, it can be spread cleanly.
- spray
- Rust Inhibitor
Automatic packing machine (line) compatible with maximum size for mail delivery, automating box making, sealing, and label attachment with a processing capacity of 1000 units per hour!
- Other packaging machines
- Box making machine
We support components for dust collectors and dust removal machines with long-length processing and high cross-sectional precision!
- Dust collector
- Processing Contract
- stainless
1000 items per hour! Fully automated packaging and labeling! Automatic packaging line compatible with Nekoposu and Yu-Packet.
- Binding/Packing Machine
- Other packaging machines
Can package 800 items in one hour! Automatically selects the appropriate box size!
- Binding/Packing Machine
- Other packaging machines
- Shrink Wrapping Machine
Cost reduction through changes in the coating of guide components in the feeding mechanism of the packaging machine.
- Processing Contract
We support components for water treatment facilities with long-length molding and high cross-sectional precision!
- Water treatment equipment
- stainless
- Processing Contract
Pull-out products are actively used for green space maintenance machinery!
- Processing Contract
- Special Steel
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Annealing furnace
The catalog for the MiniLab Flexible Thin Film Experimental Device has been renewed!
We have completely renewed the catalog for the MiniLab series thin film experimental equipment. 【Features of the MiniLab Series】 ◉ Supports sputtering, evaporation (resistive heating, organic, EB), annealing, plasma etching, etc. ◉ Modular design allows for flexible combinations of components (source hybrid types and multi-chamber configurations are possible) ◉ Compact, space-saving design (width 1,200 x depth 560 mm) ◉ Excellent operability: intuitive interface allows for centralized management of all operations via a touch panel without dispersion. We are confident that this will be of great assistance in research and development settings. Please consider it.
Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
MiniLab-WCF Ultra High Temperature Wafer Annealing Furnace Max 2000℃_Dedicated for High-Temperature Wafer Sintering (6inch to 8inch)
Max 2000℃ Φ6〜8 inch wafer dedicated high-temperature annealing device, capable of small-scale production multi-atmosphere wafer annealing device. ◾️ Max 2000℃ ◾️ Effective heating range: Φ6〜Φ8 inch single wafer type or batch type (multi-stage 5 wafer cassette) ◾️ Heater control: 1 zone or 2 zones (cascade control) ◾️ Heater materials: ・C/C composite: Φ6〜Φ8 inch ・PG coating high-purity graphite: Φ6〜Φ8 inch ◾️ Operating atmosphere: ・Vacuum (1x10-2Pa), inert gas (Ar, N2) ◾️ PLC semi-automatic operation ・Automatic sequence control for vacuum/purge cycle and venting ・Fully automatic operation (optional) ・Touch panel operation, allowing centralized management without dispersed operations. ◾️ Process pressure control ・APC control (MFC flow or automatic opening adjustment valve PID loop control) ・Maximum 3 systems of MFC flow automatic control, or manual adjustment of float meter/needle valve ◾️ PLOT screen graph display, CSV data output
Clamp the handle! This one device can transport various containers.
- crane
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
◉Mini-BENCH-prism Semi-Automatic Ultra-High Temperature Experimental Furnace Max 2000℃
◉ Maximum operating temperature Max 2000℃ ◉ PLC semi-automatic control A higher model of the tabletop Mini-BENCH with semi-automatic control Automatically controls each process of "vacuum/purge cycle," "gas replacement," and "venting" Maximum operating temperature 2000℃ Semi-automatic control ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace ◉ Effective heating range (crucible dimensions) - Planar heater heating range: Φ2 inch to Φ6 inch - Cylindrical heater heating range: Φ30 to Φ80 x Depth Max 100(H) mm ◉ Up to 3 MFC systems for automatic flow control (or manual adjustment) ◉ APC automatic pressure control ◉ Ensures safety during operation Monitors abnormal cooling water, chamber temperature, and overpressure. Made of SUS, the robust water-cooled chamber can be safely used even during continuous operation at maximum temperature. ◉ Compact and space-saving Width 603 x Depth 603 x Height 1,160 mm (*Installed inside rotary pump housing) Various sample heating experiments, such as ultra-high temperature heating of small samples and new material research and development, can be easily performed with simple operations. The main unit is compact yet can be used for research and development in various fields.
Max 1000℃, maximum 3 systems for MFC, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
- Annealing furnace
◉Mini-BENCH-prism Semi-Automatic Ultra-High Temperature Experimental Furnace Max 2000℃
◉ Maximum operating temperature Max 2000℃ ◉ PLC semi-automatic control A higher model of the tabletop Mini-BENCH with semi-automatic control Automatically controls each process of "vacuum/purge cycle," "gas replacement," and "venting" Maximum operating temperature 2000℃ Semi-automatic control ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace ◉ Effective heating range (crucible dimensions) - Planar heater heating range: Φ2 inch to Φ6 inch - Cylindrical heater heating range: Φ30 to Φ80 x Depth Max 100(H) mm ◉ Up to 3 MFC systems for automatic flow control (or manual adjustment) ◉ APC automatic pressure control ◉ Ensures safety during operation Monitors abnormal cooling water, chamber temperature, and overpressure. Made of SUS, the robust water-cooled chamber can be safely used even during continuous operation at maximum temperature. ◉ Compact and space-saving Width 603 x Depth 603 x Height 1,160 mm (*Installed inside rotary pump housing) Various sample heating experiments, such as ultra-high temperature heating of small samples and new material research and development, can be easily performed with simple operations. The main unit is compact yet can be used for research and development in various fields.
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
- Other semiconductor manufacturing equipment
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
The professional-grade sliding saw from European FELDER, equipped with the advanced non-contact safety device "PCS," is now available at a standard price range. Uncompromising quality for the job site...
- Wood processing machinery
We provide support for various lot sizes from prototype to mass production!
- Processing Contract
- Special Steel
- stainless
For safety management in environments used by various people. A non-contact safety device that detects hazards before contact and retracts the blade prevents serious accidents before they occur.
- Wood processing machinery
Providing a safe environment for inexperienced workers. Supporting the hiring, training, and retention of diverse talent with a sliding saw that retracts the blade before contact.
- Wood processing machinery
The advanced non-contact safety device "PCS" can now be equipped on standard machines. The investment in safety for professional-grade sliding saws is now achievable at a realistic price.
- Wood processing machinery
Our products are adopted in various fields such as aircraft and automobiles!
- Special Steel
- stainless
- Processing Contract
Our products are being used with the tools!
- Steel
- Special Steel
- Processing Contract
Our products are being used in architectural hardware!
- Steel
- Special Steel
- Processing Contract