List of Measurement and Analysis products
- classification:Measurement and Analysis
3811~3825 item / All 55155 items
High-performance and simple strip machine.
- Other processing machines
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
The molecular weight distribution of hyaluronic acid can be evaluated by electrophoresis.
- Contract measurement
It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.
- Contract measurement
- Transistor
- Memory
Lipid mapping of mouse brain using MALDI-MS.
- Contract measurement
- Animal cells
- Imaging and image analysis equipment
It is effective for checking the impact of packaging materials on samples and the residues before and after changes to equipment.
- Contract measurement
- Paper and pulp
Simultaneous measurement of inorganic and organic components in minute specific areas.
- Contract measurement
- Wafer
- Memory
Observation of SIM images is possible with high resolution (accelerating voltage 30kV: 4nm).
- Contract Analysis
- Contract measurement
- Contract Inspection
Reduce the impact of foreign object surrounding information with appropriate sampling.
- Contract Analysis
Lattice image analysis using the FFTM method
- Contract Analysis
Capable of observing large-area surface shapes.
- Contract Analysis
Evaluate organic EL elements with good depth direction resolution.
- Contract Analysis
X-ray reflectivity measurement (XRR) allows for non-destructive analysis of film thickness and density.
- Contract Analysis
Evaluation of nitrogen in SiON with a film thickness of approximately 1 nm is possible.
- Contract Analysis
Measurement avoiding the effects of surface irregularities and high concentration layers using SSDP-SIMS.
- Contract Analysis
Evaluation of dopant distribution and junctions is possible even in extremely shallow regions.
- Contract Analysis
Waveform analysis and evaluation of the depth distribution of bonding states by Ar sputtering.
- Contract Analysis