List of Embedded Systems products
- classification：Embedded Systems
181～225 item / All 12912 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
NVIDIA RTX ADA 3500 built-in MXM GPU module
- Embedded Board Computers
3.5-inch single-board computer equipped with Intel Core Ultra processor
- Embedded Board Computers
ADLINK releases a new 3.5-inch single-board computer for scalable edge AI and robust embedded applications.
●3.5 "Expanding the SBC Portfolio: ADLINK has announced the SBC35-MTL and SBC35-ASL, targeting both high-performance AI and robust embedded edge applications. ●AI Compatibility and Robust Design: The SBC35-MTL is equipped with an Intel Core Ultra featuring an NPU for real-time inference, while the SBC35-ASL is powered by the Intel Atom x7000RE, providing a wide temperature range and fanless operation. ●Flexible I/O with SBC-FM Modules: Both models support ADLINK's SBC-FM expansion modules, enabling customized I/O to accelerate deployment across various industries.
3.5-inch single board computer equipped with Intel x7835RE/x7433RE/x7211RE processors
- Embedded Board Computers
ADLINK releases a new 3.5-inch single-board computer for scalable edge AI and robust embedded applications.
●3.5 "Expanding the SBC Portfolio: ADLINK has announced the SBC35-MTL and SBC35-ASL, targeting both high-performance AI and robust embedded edge applications. ●AI Compatibility and Robust Design: The SBC35-MTL is equipped with an Intel Core Ultra featuring an NPU for real-time inference, while the SBC35-ASL is powered by the Intel Atom x7000RE, providing a wide temperature range and fanless operation. ●Flexible I/O with SBC-FM Modules: Both models support ADLINK's SBC-FM expansion modules, enabling customized I/O to accelerate deployment across various industries.
Wide voltage Mini-ITX supporting H610 chipset and 14th/13th/12th generation Intel Core CPUs.
- Embedded Board Computers
ADLINK releases wide voltage compatible Mini-ITX motherboards for industrial embedded applications.
●Wide voltage input: Supports 12-28V DC input, ensuring stable operation even in environments with unstable power. ●Balanced performance: Supports Intel Core CPUs with a maximum of 65W using PCIe 4.0, DDR4, and dual 2.5GbE. ●Ideal design for industrial applications: The Mini-ITX form factor and rich expandability enable seamless integration into embedded systems.
Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module
- Embedded Board Computers
SMARC short-size module equipped with NXP i.MX 8M Mini SoC
- Embedded Board Computers
Mini type COM-HPC module equipped with Intel Core Ultra processor (Meteor Lake)
- Embedded Board Computers
Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module
- Embedded Board Computers
OSM R1.1 Size L module equipped with MediaTek Genio 510 series processor.
- Embedded Board Computers
Autonomous Driving AI Decision-Making Controller (ECU)
- Embedded Board Computers
ADLINK's 7 products won the 2026 Taiwan Excellence Award, showcasing outstanding research and development innovation leadership.
●ADLINK wins 7 products at the 34th Taiwan Excellence Awards: This demonstrates the company's advanced research and development capabilities in edge AI computing and intelligent applications. The award-winning products span industrial computers, AI platforms, and medical and transportation solutions, showcasing the company's comprehensive innovation strength. ●AI drives smart industries and accelerates modular innovation: Products such as the EMP-520, SP2-MTL, and Ampere Altra Dev Kit leverage high-performance AI inference and modular design to help companies expedite the adoption of smart manufacturing and automation applications. ●New milestones in smart transportation and medical applications: The ADM-AL30, AVA series, and MLC-S medical panel PC provide highly stable AI computing and robust security protection in autonomous driving, railways, and clinical medical environments, realizing a reliable intelligent ecosystem.
Scalable T2G onboard gateway
- Embedded Board Computers
ADLINK's 7 products won the 2026 Taiwan Excellence Award, showcasing outstanding research and development innovation leadership.
●ADLINK wins 7 products at the 34th Taiwan Excellence Awards: This demonstrates the company's advanced research and development capabilities in edge AI computing and intelligent applications. The award-winning products span industrial computers, AI platforms, and medical and transportation solutions, showcasing the company's comprehensive innovation strength. ●AI drives smart industries and accelerates modular innovation: Products such as the EMP-520, SP2-MTL, and Ampere Altra Dev Kit leverage high-performance AI inference and modular design to help companies expedite the adoption of smart manufacturing and automation applications. ●New milestones in smart transportation and medical applications: The ADM-AL30, AVA series, and MLC-S medical panel PC provide highly stable AI computing and robust security protection in autonomous driving, railways, and clinical medical environments, realizing a reliable intelligent ecosystem.
CEB server board equipped with Intel Xeon 600 processors for workstations.
- server
- Embedded Board Computers
ADLINK releases next-generation server boards equipped with Intel Xeon 600 processors for workstations and 2U/4U edge AI servers.
● Comprehensive portfolio expansion: ADLINK has introduced the Intel Xeon 6 series for workstations. This lineup, which includes the ISB-W890 board and AXE GPU server, enables the expansion of edge AI from traditional workloads to real-time generative AI and advanced analytics. ● Versatile high-performance architecture: A lineup designed for compute-intensive tasks such as intelligent automation and large-scale visual processing, ranging from flexible CEB server boards to 2U/4U GPU servers. ● Rapid deployment: Streamlines the transition from AI development to full-scale edge deployment with mission-critical reliability, reducing time to market.
Value Family 9th Generation Intel Xeon/Core i7/i5/i3 Processor Equipped Expandable Edge GPU Computer
- Industrial PCs
- Embedded Board Computers
A must-see for those interested in the deployment of edge AI! ADLINK will be presenting at GTC 21 (April 12-16)!
Artificial Intelligence (AI) heralds the arrival of a new era in computing, enabling greater innovation, productivity, and cost reduction. For edge applications where time and safety are critical, such as medical imaging and industrial-grade intelligent video analysis, edge AI solutions can better meet the stringent response times than cloud AI. By attending ADLINK's on-demand session at the NVIDIA GPU Technology Conference (GTC) held online from April 12 (Monday) to April 16 (Friday), 2021, you can learn how to accelerate edge AI development. - You will learn how edge AI is advancing medical and industrial applications. - You will gain insights into overcoming the challenges of edge AI. - You will hear about AI models and tools for video analysis. *Please note that ADLINK's session will be in English.
Mini-ITX embedded board equipped with 8th/9th generation Intel Core desktop processor.
- Embedded Board Computers
NVIDIA RTX A1000 built-in mobile PCI Express module
- Embedded Board Computers
ADLINK releases the first embedded MXM graphics module featuring the NVIDIA Ampere architecture for edge computing and AI.
● ADLINK's EGX-MXM-A1000, EGX-MXM-A2000, and EGX-MXM-A4500 are the first modules to adopt NVIDIA's embedded GPU based on the NVIDIA Ampere architecture. ● ADLINK's MXM graphics modules provide high-performance GPU acceleration in a compact and power-efficient MXM form factor, bringing edge computing and embedded AI to many vertical markets such as healthcare, manufacturing, and transportation. ● Robust design that withstands harsh temperature environments, shock, vibration, and corrosion under severe conditions.
NVIDIA RTX A500 built-in mobile PCI Express module
- Embedded Board Computers
![CPU module "SMARC" [LEC-MTK-I1200]](https://image.mono.ipros.com/public/product/image/e53/2000717097/IPROS58706350873575624420.jpeg?w=280&h=280){kind=small}
SMARC short-size module equipped with MediaTek Genio 1200 platform.
- Embedded Board Computers
ADLINK has released an AIoT SMARC module featuring the MediaTek SoC, equipped with an 8-core CPU and a 5-core GPU, known as the Genio 1200.
●A short-sized module based on the MediaTek Genio 1200 processor, designed to drive AIoT and 4K graphics applications at the edge, compliant with the SMARC 2.1 specification. ●It features a 2.2GHz octa-core (Cortex-A78 x4 + Cortex-A55 x4) CPU, a 5-core GPU for advanced 3D graphics, an integrated APU (AI Processor Unit) for on-device AI, and supports multiple 4K displays and camera inputs, all configured for excellent power efficiency.
Fanless computer equipped with 12th generation Intel processors from the Value Family.
- Industrial PCs
- Embedded Board Computers
ADLINK's next-generation IPC will revolutionize industrial use cases at the edge with its scalable design and custom function modules.
●Unmatched Performance: Equipped with 12th/13th generation Intel Core i9/i7/i5/i3 processors, achieving class-leading performance. ●Ultimate Flexibility: Modular and scalable design that is easy to expand, with optional FM modules to meet domain-specific requirements. ●AI-Ready Edge Platform: With built-in GPU power and machine vision capabilities, the ADLINK MVP-5200/6200 can instantly deploy AI-enabled applications.
Arm-based application-ready and programmable IoT gateway
- Industrial PCs
- Embedded Board Computers
ADLINK, application-compatible IIoT gateway, easily enables powerful end-to-end connectivity.
● The EMU-200 series comes with a built-in EGiFlow web console, simplifying data communication across different network systems. ● It supports major industrial communication protocols, meeting cross-industry requirements. ● It offers a rich variety of I/O interfaces and wireless support, making it suitable for monitoring decentralized or unmanned sites. ● It accommodates a wide temperature range of 40 to 70°C and can adapt to many harsh environments with diverse installation options.
Industrial ATX motherboard equipped with 12th/13th/14th generation Intel Core i9/i7/i5/i3 processors.
- Embedded Board Computers
ADLINK announces support for 14th generation Intel processors in cutting-edge industrial and AI solutions.
ADLINK adds support for the 14th generation Intel Core processors to its main product line, enhancing the performance and AI capabilities of diverse computing systems. This upgrade includes the IMB-M47, IMB-M47H motherboards, and NuPRO-E47 SBC, with the MVP-5200/MVP-6200 series scheduled for release in late 2024. The upgrade to the 14th generation processors demonstrates ADLINK's commitment to innovation in edge computing and AI, providing customers with advanced and future-proof technology.
Mini-ITX embedded board equipped with 8th/9th generation Intel Core i7/i5/i3 processors.
- Embedded Board Computers
3.5-inch single-board computer equipped with 13th generation Intel Core i7/i5/i3/Celeron processors.
- Embedded Board Computers
ADLINK releases a new 3.5-inch single-board computer for scalable edge AI and robust embedded applications.
●3.5 "Expanding the SBC Portfolio: ADLINK has announced the SBC35-MTL and SBC35-ASL, targeting both high-performance AI and robust embedded edge applications. ●AI Compatibility and Robust Design: The SBC35-MTL is equipped with an Intel Core Ultra featuring an NPU for real-time inference, while the SBC35-ASL is powered by the Intel Atom x7000RE, providing a wide temperature range and fanless operation. ●Flexible I/O with SBC-FM Modules: Both models support ADLINK's SBC-FM expansion modules, enabling customized I/O to accelerate deployment across various industries.
NXP i.MX95 series processor equipped OSM R1.2 Size L module
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
NVIDIA RTX ADA 5000 built-in MXM GPU module
- Embedded Board Computers
3U CompactPCI Quad-Core Intel Atom Processor X Series Blade
- Embedded Board Computers
- Expansion Boards
Robust 3UVPX Intel Xeon and 9th generation Core i3 processor blade
- Embedded Board Computers
SMARC module equipped with NXP i.MX95, ideal for drone flight control.
- Embedded Board Computers
SMARC short-size module equipped with MediaTek Genio 1200 platform
- Embedded Board Computers
Scalable T2G onboard gateway
- Embedded Board Computers
ADLINK's 7 products won the 2026 Taiwan Excellence Award, showcasing outstanding research and development innovation leadership.
●ADLINK wins 7 products at the 34th Taiwan Excellence Awards: This demonstrates the company's advanced research and development capabilities in edge AI computing and intelligent applications. The award-winning products span industrial computers, AI platforms, and medical and transportation solutions, showcasing the company's comprehensive innovation strength. ●AI drives smart industries and accelerates modular innovation: Products such as the EMP-520, SP2-MTL, and Ampere Altra Dev Kit leverage high-performance AI inference and modular design to help companies expedite the adoption of smart manufacturing and automation applications. ●New milestones in smart transportation and medical applications: The ADM-AL30, AVA series, and MLC-S medical panel PC provide highly stable AI computing and robust security protection in autonomous driving, railways, and clinical medical environments, realizing a reliable intelligent ecosystem.
![Medical Panel PC [MLC-S Series]](https://image.mono.ipros.com/public/product/image/323835/IPROS5430026957169428517.png?w=280&h=280){kind=small}
12th/13th Generation Intel Core Processor Equipped, Multi-Purpose All-in-One Medical Panel PC Family
- Touch Panel
- Embedded Board Computers
ADLINK's 7 products won the 2026 Taiwan Excellence Award, showcasing outstanding research and development innovation leadership.
●ADLINK wins 7 products at the 34th Taiwan Excellence Awards: This demonstrates the company's advanced research and development capabilities in edge AI computing and intelligent applications. The award-winning products span industrial computers, AI platforms, and medical and transportation solutions, showcasing the company's comprehensive innovation strength. ●AI drives smart industries and accelerates modular innovation: Products such as the EMP-520, SP2-MTL, and Ampere Altra Dev Kit leverage high-performance AI inference and modular design to help companies expedite the adoption of smart manufacturing and automation applications. ●New milestones in smart transportation and medical applications: The ADM-AL30, AVA series, and MLC-S medical panel PC provide highly stable AI computing and robust security protection in autonomous driving, railways, and clinical medical environments, realizing a reliable intelligent ecosystem.
11th Generation Intel Core Processor Equipped, Slim and Lightweight All-in-One Medical Panel Computer Family
- Touch Panel
- Embedded Board Computers
COM Express Type 6 Compact with AMD Ryzen Embedded 8000 series processor
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
COM Express compact size Type 6 module equipped with AMD Ryzen Embedded V2000 APU.
- Embedded Board Computers
ADLINK releases COM Express module compatible with AMD Ryzen Octa-Core V2000 APU.
ADLINK Technology has launched the first octa-core COM Express Type 6 compact module equipped with the new AMD Ryzen V2000 APU, which integrates Radeon graphics (cExpress-AR). With double the core count, the cExpress-AR is ideal for demanding graphic-based applications such as: • Ultrasound image processing • 4K high-speed video encoding and streaming • Embedded gaming and infotainment • AI inference at the edge "The AMD Ryzen V2000 APU features high-performance graphics computing cores, allowing it to be used in AI inference applications without the need for an additional GPU. This is one way the cExpress-AR contributes to overall system cost reduction," commented Alex Wang, ADLINK's COM Express product manager.
![[Case Study] Computer-on-Module Acc...](https://image.mono.ipros.com/public/product/image/323835/IPROS10668290574489247974.jpg?w=280&h=280){kind=small}
Computer-on-module addresses the challenges of time-to-market and scalability for next-generation drone startups.
- Embedded Board Computers
NVIDIA RTX PRO 500 Blackwell equipped embedded MXM GPU module
- Embedded Board Computers
NVIDIA RTX PRO 4000 Blackwell equipped embedded MXM GPU module
- Embedded Board Computers
3U VPX GPGPU blade equipped with NVIDIA RTX Ada5000 or Ada2000
- Embedded Board Computers
Industrial Mini-ITX motherboard equipped with Intel Core series 2 and 14th/13th/12th generation Core processors.
- Embedded Board Computers
Mini-ITX embedded board equipped with AMD Ryzen Embedded 8000 APU
- Embedded Board Computers
7th Generation Intel Atom x7433RE Quad-Core SoC Based I-Pi SMARC IoT Development Kit
- Embedded Board Computers
NXP i.MX 95 SoC equipped I-Pi OSM development kit
- Embedded Board Computers
NXP i.MX 93 Dual-Core Arm Cortex-A55 & M33 Based I-Pi OSM Development Kit
- Embedded Board Computers
MediaTek Genio 510 series processor equipped OSM development kit
- Embedded Board Computers
Support for up to 8 independent displays, including 4K UHD, equipped with AMD Ryzen Embedded R1000/V1000 series.
- Embedded Board Computers
Compact gaming platform equipped with AMD Ryzen Embedded 8000 APU.
- Embedded Board Computers