List of connector products

  • classification:connector

46~90 item / All 4286 items

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Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!

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  • Glass

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Flip lock connector

  • Other Connectors
  • Terminal Blocks
  • Other network tools

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High precision. Balancing reliability with short delivery times, low prices, and ease of use. Cartridge-type test socket <T3P>.

  • Other Connectors
  • Terminal Blocks
  • Other network tools

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DLC - Conductive hard thin film coating technology utilizing diamond-like carbon technology.

  • Other Connectors
  • Terminal Blocks
  • Other network tools

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Implementation IC socket

  • Other Connectors

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Implementation IC socket

  • Other Connectors

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Implementation IC socket

  • Other Connectors
  • Terminal Blocks
  • Other network tools

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Ultra-low profile H=1.40mm small manual connector

  • Other Connectors

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High-speed transmission connector compatible with ASIC proximity connections for the 112G BiPass solution!

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  • Other Connectors
  • cable

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Achieve superior signal integrity and system performance compared to using PCB traces!

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  • Other Connectors
  • cable

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Meets the 6th generation PCIe standard and is compatible with upgrades to the 7th generation PCIe!

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  • Other Connectors
  • cable

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

A connector that achieves both downward and upward compatibility, supporting data rates of up to 56Gbps!

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  • Other Connectors
  • cable

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

The RF coaxial connector has been newly added to the Same Sky connector product line.

  • Coaxial Connectors
  • Waterproof Connector
  • connector

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The RF coaxial connector has been newly added to the Same Sky connector product line.

The RF coaxial connector product line from Same Sky has been newly launched. We offer SMA type plugs and receptacles in various mounting types, including reverse polarity types and IP67 waterproof rated products. Type: SMA Plug / SMA Receptacle (Standard Polarity / Reverse Polarity) Mounting Form: Board Edge Mount, Panel Mount, Through Hole, SMT, Cable Mount Orientation: Horizontal (Right Angle) / Vertical (Straight) Frequency Range: 0~3GHz, 0~6GHz, 0~18GHz, 0~26.5GHz Nominal Impedance: 50Ω Voltage Standing Wave Ratio: 1.15~1.5 Compliance Standards: MIL-STD-348, MIL-C-39012, CECC 22110/111 https://samesky.co.jp//SS-Products-connector-RFconnector.html

The Same Sky connector product line has newly introduced pin headers, pin sockets, and box headers.

  • Board to Board Connectors
  • connector

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The Same Sky connector product line now features new pin headers, pin sockets, and box headers.

The Same Sky connector product line now features new pin headers, pin sockets, and box headers. We offer 1 to 2 row types with a pitch of 2.54mm, available in 1 to 40 pins. Type: Pin Header / Pin Socket / Box Header Pitch: 2.54mm Direction: Vertical (Straight) Number of Pins: 1 to 40 Rated Voltage: 250Vdc Rated Current: 3A Mounting Type: Through Hole https://samesky.co.jp//SS-Products-connector-RectangularConnector.html

High-strength, high-conductivity beryllium copper standard sheets optimal for connectors are available for the shortest delivery time.

  • Other metal materials
  • Non-ferrous metals
  • Other Connectors

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Ideal for aerospace applications. Beryllium copper alloy C1720 with excellent high strength and wear resistance.

  • Other metal materials
  • Non-ferrous metals
  • Other Connectors

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Beryllium copper alloy is ideal for mold inserts and gas vent chill vents. It improves mold life with high hardness, high thermal conductivity, and wear resistance.

  • Other metal materials
  • Non-ferrous metals
  • Other Connectors

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Lightweight, disposable connector to maintain the cleanliness of endoscopes.

  • connector
  • Rectangular Connector

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A comparative explanation of technological evolution and the latest solutions. A free webinar hosted by Molex introducing advanced technologies for the rapidly expanding data center market.

  • Seminar
  • Wiring materials
  • Other Connectors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

I will briefly explain how to connect optical fibers.

  • Optical Connector

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Introducing high-performance, high-efficiency products that meet strict industry standards!

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  • Other Connectors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Significantly improved design flexibility in applications with space constraints!

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  • Other Connectors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Additional board maintenance is possible! Ensures minimization of contact resistance between the wire and crimp barrel.

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  • Other Connectors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Provides essential power efficiency for cost management! Designed for manufacturing flexibility and excellent electrical performance.

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  • Other Connectors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Multiple types of circuit board stacking designs are possible, providing flexibility in design!

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  • Other Connectors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Maximize high-speed transmission processing performance and clean routing away from the connector installation area!

  • Other Connectors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

The flexible cable link provides relaxed tolerances and architectural flexibility!

  • Other Connectors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Cost reduction through hermaphroditic design! Shortened lead time and simplified product matrix.

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  • Other Connectors

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Providing a high-density and slim solution for interconnecting with SI performance!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

An OCP-recommended internal I/O connector solution designed specifically for boot drive applications!

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  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Designed for internal wiring, enabling support for artificial intelligence (AI) and machine learning applications!

  • Board to Board Connectors
  • connector
  • connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Achieving streamlined integration and rapid implementation through a male-female dual-body design!

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  • Other Connectors
  • cable

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Equipped with 101 pairs of high-density modular interfaces per square inch!

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  • Other Connectors
  • cable

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Our local subsidiary in Thailand supports your business! - A trading company known for its flexibility.

  • Other semiconductor manufacturing equipment
  • others
  • Other Connectors

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It is a conversion connector from U.FL-LP-066 to SMA-J.

  • Coaxial Connectors

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Quickly catch the needs! We respond with a wealth of partners and reliable technical expertise.

  • Other machine elements
  • Resin mold
  • Other Connectors

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Fusion Box (CFP Series)

  • Other electronic parts
  • LAN/Optical cable
  • Optical Connector

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Lightweight portable type tool changer for loads up to 55kg! Made from high-strength aluminum for reduced weight! High positional repeatability, suitable for high-precision tasks!

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  • Other industrial robots
  • Other Connectors
  • Other machine tools

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Connector solutions for the automotive industry! Press, die casting, body shop, painting, final assembly, powertrain, e-mobility, etc.

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  • Hydraulic Equipment
  • Rectangular Connector
  • Other industrial robots

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EV cars can be charged with regular and fast charging, and they can also be used outdoors.

  • Automotive Connectors

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Devices/equipment for outdoor use can also be connected via LAN! Waterproof cable gland with Ethernet locknut (waterproof connector).

  • Other Connectors
  • Wiring materials
  • Other machine elements

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Waterproof cable gland (waterproof connector) made of flame-retardant UL94V-0 material.

  • Other electronic parts
  • Other Connectors
  • Wiring materials

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Waterproof cable gland (waterproof connector) made of polypropylene (PP), the lightest and most chemical-resistant among general-purpose plastics.

  • Other electronic parts
  • Other Connectors
  • Wiring materials

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