List of Electronic Components and Modules products

  • classification:Electronic Components and Modules

91~105 item / All 944 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

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  • air conditioning

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Selected eight specific methods to streamline inventory management and provide a detailed explanation of key points for system implementation in the manufacturing industry.

  • PDAs and handheld terminals
  • RFID/IC tags

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A comprehensive explanation covering the basics of RFID inventory management systems, including the advantages and disadvantages of implementation, costs, and various successful case studies across di...

  • RFID related products and IC tag services
  • RFID/IC tags

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We will exhibit our products at the Natek Inc. booth.

  • RFID related products and IC tag services
  • RFID/IC tags

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You can see the RFID demonstration up close!

  • RFID related products and IC tag services
  • RFID/IC tags

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Automation with RFID and IC tags improves productivity through automatic recognition. It supports management of item withdrawal/loan, inventory management, performance collection, and process manageme...

  • Process Control System
  • RFID related products and IC tag services
  • RFID/IC tags

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Pure titanium, compatible with Ti-6Al-4V. Proven results in aerospace and medical devices!

  • Screw
  • fastener
  • connector

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We will exhibit at the International Medical Imaging Exhibition (ITEM2026) with MRI room-compatible LED Magluminas, emergency lighting, high-brightness LED Cathex, and more.

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  • EMC countermeasure products
  • LED lighting
  • LED

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Providing a high-density and slim solution for interconnecting with SI performance!

  • Board to Board Connectors
  • connector
  • connector

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Molex WEBセミナー.png

Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

An OCP-recommended internal I/O connector solution designed specifically for boot drive applications!

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  • OCP 対応 KickStartコネクターシステム6.png
  • Board to Board Connectors
  • connector
  • connector

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Molex WEBセミナー.png

Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Designed for internal wiring, enabling support for artificial intelligence (AI) and machine learning applications!

  • Board to Board Connectors
  • connector
  • connector

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Molex WEBセミナー.png

Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

TELEC certified! High-performance UHF band smartphone-mounted reader made by IDRO in South Korea.

  • UHF帯スマホ装着型RFIDリーダ『IDRO900H-BT』_2.png
  • UHF帯スマホ装着型RFIDリーダ『IDRO900H-BT』_3.png
  • UHF帯スマホ装着型RFIDリーダ『IDRO900H-BT』_4.png
  • RFID/IC tags

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Protect irrigation operations from power outages! A tough portable power source that works even at -30℃.

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  • power supply
  • power supply
  • Cells and batteries

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Medium-sized HF band IC tag. Recommended for label processing.

  • RFID/IC tags
  • IC tag reader/writer

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Gas monitoring in Zone 2 environment. 22-inch wide touch panel PC.

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  • Touch Panel
  • Industrial PCs
  • FPD/Touch Panel

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