List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
1711～1725 item / All 5074 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
Introducing the ion beam sputtering device equipped with a maximum of 5 targets (220mm diameter) or 4 targets (300mm diameter)!
- Sputtering Equipment
Maximum 200mm diameter substrate! Double ring magnetron (Fraunhofer FEP)
- Sputtering Equipment
Mechanical clamp or electrostatic chuck compatible! Sub-nanometer etching mechanism.
- Etching Equipment
Supports wafers up to 150 or 200 mm! Etching angle and stage tilt/rotation mechanism.
- Etching Equipment
Interlock covers are also available! We have achieved further efficiency in polishing operations.
- Wafer processing/polishing equipment
- Other processing machines
Ideal for sample preparation for research and development! Successfully reduced vibration and noise significantly.
- Wafer processing/polishing equipment
- Other processing machines
High-precision angular bearings are adopted as the main axis! Achieving a flatness accuracy of ±10μm on the reference table.
- Wafer processing/polishing equipment
- Other processing machines
We offer a wide range of products, including vacuum chuck holders and adhesive holders!
- Wafer processing/polishing equipment
- Other processing machines
- Other machine elements
High-precision and high-efficiency polishing technology! A comprehensive catalog of precision polishing equipment is available as a gift.
- Wafer processing/polishing equipment
We will introduce a wide variety of grinding wheels, from fixed abrasive wheels to free abrasive wheels and polishing cloths.
- CMP Equipment
- Wafer processing/polishing equipment
- Other processing machines
More economical than manually spraying diamond liquid onto the grinding wheel! Introducing the automatic spraying device.
- Wafer processing/polishing equipment
- Other processing machines
- Other physicochemical equipment
There is no edge sagging, and there are no detachments of foreign substances, making it suitable for evaluation using methods such as EPMA!
- Wafer processing/polishing equipment
- Other processing machines
Samples for cross-sectional observation can be created precisely and easily! There is no need to touch or hold the samples directly by hand.
- Wafer processing/polishing equipment
- Other processing machines
Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.
- Wafer processing/polishing equipment
- CMP Equipment
- Other processing machines
A must-see for those struggling with precision and delivery deadlines! We utilize ultra-finishing techniques centered on polishing to achieve ultra-fine and ultra-smooth surfaces.
- Wafer processing/polishing equipment
[Newsletter Distribution] "Manufacturing Coating Heads for the Film, LCD, and Battery Industries" / OKD Corporation
A must-see for those struggling with precision and delivery times! We utilize ultra-finishing techniques centered on polishing to achieve ultra-fine and ultra-smooth surfaces for fine precision and smooth surfaces required for coating heads used in FDP and various film and battery manufacturing equipment. Materials such as SUS can be manufactured. We guarantee the requested precision through our processing technology. For delivery times, we can accept partial contracts for each process. For example, we can shorten the time by focusing only on polishing or only on machining! 【Precision List】 ■ Total Length: 4000mm or less ■ Tip Straightness: 0.001mm to 0.010mm or less ■ Inner Surface Flatness: 0.001mm to 0.010mm or less ■ Tip Surface Roughness: 0.1S or less ■ Inner Surface Roughness: 0.05S to 0.2S or less We are currently offering a document summarizing key points to check when requesting coating heads (die coaters)! *For more details, please contact us or download the catalog.