List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
1801～1815 item / All 5127 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Various plasma sources can be equipped! Customized design for CVD, MOCVD, and ALD equipment.
- CVD Equipment
Minimize radioactive contamination! Capable of proposing plasma excitation technology tailored to specific applications.
- Ion implantation equipment
We propose fine processing technology for next-generation package substrates using KrF excimer lasers!
- Other semiconductor manufacturing equipment
Metal, dielectric, and organic film deposition! Introducing the thermal evaporation device.
- Evaporation Equipment
The maximum film-forming temperature is 800°C! It can accommodate up to 4x DLI evaporators with the chamber heating mechanism.
- CVD Equipment
Due to lamp heating, RTP and RTCVD processing is possible! Quartz tube-type chamber.
- Annealing furnace
Turbo pump compatible! Low temperature (1100°C) / high temperature (1300°C) pyrometer.
- Annealing furnace
Supports a maximum substrate size of 156mm x 156mm! Compatible with vacuum or atmospheric transport systems and can be equipped with a load lock.
- Annealing furnace
Rapid cooling mechanism after annealing! Introducing the high-speed heat treatment equipment from Annealsys.
- Annealing furnace
Compatible with SI 500-1M, SI 500 PPD-1M, etc.! The transport chamber is available in three types.
- CVD Equipment
Control of ion density by ICP power! Achieving low-temperature film formation, low damage, and high conformality.
- CVD Equipment
High-selectivity etching! Optimization of radical supply by adjusting the spacing between the ICP source and the substrate electrode.
- Other semiconductor manufacturing equipment
Top-class throughput! Flexible modular design.
- Other semiconductor manufacturing equipment
Many safety measures specifications necessary for mass production! Compact device size with a film formation temperature of 50 to 285°C.
- Other semiconductor manufacturing equipment
500℃ wafer stage! Adoption of a remote ICP source with no plasma damage.
- Other semiconductor manufacturing equipment