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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. Mirror Polishing Machine "SMAP-W Type"

Mirror Polishing Machine "SMAP-W Type"

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last updated:Sep 26, 2023

東洋研磨材工業 本社
東洋研磨材工業 本社
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Successfully developed a movable nozzle that leverages the characteristics of SMAP media! It accommodates polishing for sizes that cannot be held by hand.

The "SMAP-W Type" is a mirror shot machine designed for heavy workpieces. By combining it with a rotating platform on casters, it is possible to polish while also moving the workpiece. We have successfully developed a movable nozzle that takes advantage of the characteristics of SMAP media. Please feel free to contact us when you need assistance. 【Specifications (Excerpt)】 ■ Input power supply: Three-phase 200V 50/60Hz 15A ■ Air outlet/usage: Φ6 10L/min (0.6MPa) ■ Main body dimensions (excluding side door): W1060×H1850×D990 (mm) ■ Weight: 280kg ■ Power: Main motor 2.2kW, elevator motor 60W (conveyor motor) ■ Media usage: 15L *For more details, please refer to the PDF document or feel free to contact us.

    Wafer processing/polishing equipment
SMAP-W型.jpg

Mirror Polishing Machine "SMAP-W Type"

SMAP-W型.jpg
SMAP-W型.jpg
  • Related Link - https://toyo-kenmazai-kogyo.jp/smap-w/

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New Generation Type / Mirror Shot Machine (SMAP)

New Generation Type / Mirror Shot Machine (SMAP)

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東洋研磨材工業

東洋研磨材工業 本社

Industrial Machinery

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Toyo Grinding Materials Co., Ltd. provides carefully selected products that achieve high-precision surface processing and polishing finishing of various parts, which are essential for a wide range of industrial products such as automobiles, electrical equipment, and precision instruments. To meet the diverse needs of our users, we deliver products from leading grinding and polishing material manufacturers in Japan.

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