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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. Mirror Polishing Machine "SMAP-IV Type"

Mirror Polishing Machine "SMAP-IV Type"

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last updated:Sep 26, 2023

東洋研磨材工業 本社
東洋研磨材工業 本社
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Shortening processing time with overwhelming projection power! Capable of handling large workpieces that other models cannot.

The "SMAP-IV type" is a mirror shot machine designed for large workpieces. Compared to the "SMAP-II type," the working space and projection volume are more than four times greater. It can handle large workpieces that other models cannot. Please feel free to contact us when you need assistance. 【Specifications (excerpt)】 ■ Input power supply: Three-phase 200V 50/60Hz 15A ■ Air inlet/usage: Φ6 150L/min (0.6MPa) ■ Body dimensions (excluding side door): W1200×H1900×D1125 (mm) ■ Weight: 270kg ■ Power: Main motor 2.2kW, elevator motor 60W, dust collector 0.4kW ■ Media usage: 12L *For more details, please refer to the PDF materials or feel free to contact us.

    Wafer processing/polishing equipment
SMAP-IV型.jpg

Mirror Polishing Machine "SMAP-IV Type"

SMAP-IV型.jpg
SMAP-IV型.jpg
  • Related Link - https://toyo-kenmazai-kogyo.jp/smap-4/

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New Generation Type / Mirror Shot Machine (SMAP)

New Generation Type / Mirror Shot Machine (SMAP)

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東洋研磨材工業

東洋研磨材工業 本社

Industrial Machinery

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Toyo Grinding Materials Co., Ltd. provides carefully selected products that achieve high-precision surface processing and polishing finishing of various parts, which are essential for a wide range of industrial products such as automobiles, electrical equipment, and precision instruments. To meet the diverse needs of our users, we deliver products from leading grinding and polishing material manufacturers in Japan.

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