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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. Mirror Polishing Machine "SMAP-III Type"

Mirror Polishing Machine "SMAP-III Type"

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last updated:Sep 26, 2023

東洋研磨材工業 本社
東洋研磨材工業 本社
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A larger indoor space than the SMAP-II type! The workspace is more than three times larger, and both rough and finished work can be done with this one machine.

The "SMAP-III type" is a medium-sized mirror shot machine that excels in balance. The workspace is more than three times that of the "SMAP-II type," and it can handle both rough and finishing work with this one machine. There are also power-type and finishing-specialized models available in the same size. Please feel free to contact us when you need assistance. 【Specifications (excerpt)】 ■ Input power supply: Three-phase 200V 50/60Hz 9A ■ Air inlet/usage: Φ6 100L/min (0.6MPa) ■ Body dimensions (excluding side doors): W865×H1900×D975 (mm) ■ Weight: 200kg ■ Power: Main motor 400W, elevator motor 40W, dust collector 400W ■ Media usage: 6L *For more details, please refer to the PDF document or feel free to contact us.

    Wafer processing/polishing equipment
SMAP-III型.jpg

Mirror Polishing Machine "SMAP-III Type"

SMAP-III型.jpg
SMAP-III型.jpg
  • Related Link - https://toyo-kenmazai-kogyo.jp/smap-3/

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New Generation Type / Mirror Shot Machine (SMAP)

New Generation Type / Mirror Shot Machine (SMAP)

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東洋研磨材工業

東洋研磨材工業 本社

Industrial Machinery

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Toyo Grinding Materials Co., Ltd. provides carefully selected products that achieve high-precision surface processing and polishing finishing of various parts, which are essential for a wide range of industrial products such as automobiles, electrical equipment, and precision instruments. To meet the diverse needs of our users, we deliver products from leading grinding and polishing material manufacturers in Japan.

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