List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
196～210 item / All 5103 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.
- Wafer processing/polishing equipment
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
- Bonding Equipment
Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.
- Other semiconductor manufacturing equipment
Notice of Participation in "Semicon Japan 2018"
We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009
![[Compact & Lightweight] UV-LED Irra...](https://image.mono.ipros.com/public/product/image/41b/2000460215/IPROS62495294798517871344.png?w=280&h=280){kind=small}
A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
A Comprehensive Explanation of the Benefits and Applications of Formic Acid Reduction (Manufactured by Unitec Japan)
- Annealing furnace
Manual flip chip bonder suitable for small-scale production and various experiments.
- Bonding Equipment
Dust removal device compatible with thin plates. Equipped with a magnetic gear in the drive unit! This single unit can accommodate a wide range of substrate thicknesses.
- Printed Circuit Board
- LCD display
- Other semiconductor manufacturing equipment
Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.
- Assembly Machine
- Other semiconductor manufacturing equipment
By conducting a complete visual inspection of the chips before implementation, we can reduce losses in subsequent processes and improve yield! Ideal for acceptance inspection and screening in module a...
- Semiconductor inspection/test equipment
A compact LED curing device that can be used on a tabletop. It offers irradiation capabilities and is attractively priced! *Demo units available for loan.
- Other semiconductor manufacturing equipment
Reliable solder ball repairs are performed by a repair unit that has accumulated unique image processing and proven results.
- Semiconductor inspection/test equipment
Supports high-speed image transmission and long-distance wiring. Offers a lineup of 10 million pixels and 21 million pixels.
- Semiconductor inspection/test equipment
Efficiently enhance polishing power with low vibration design! We offer three models of sanders with speed control.
- Wafer processing/polishing equipment
Insulation coating for chip inductors
- Inductor Coil
- Other semiconductor manufacturing equipment
If you are troubled by corrosion from acids and alkalis, use Shine Kogei's Blue Armor!
- Surface treatment contract service
- Other plant design, development and maintenance
- Other semiconductor manufacturing equipment