List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
2311～2325 item / All 5179 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
We will accurately capture our customers' needs, provide optimal services, and continue to make progress.
- Other semiconductor manufacturing equipment
Easy operation! Results such as wire trajectories are displayed visually!
- Bonding Equipment
Repair, improve, and overhaul high-frequency power supplies, transport robots, RF matching boxes, and more! We capture customer needs and provide services.
- Other semiconductor manufacturing equipment
If you are having trouble with laser repairs for stepper devices, please consult us.
- Semiconductor inspection/test equipment
Main roller groove shape inspection machine for wire cutting machines. The inspection device is mounted on the roller, allowing for measurement of the groove shape profile monitor and shape images.
- Semiconductor inspection/test equipment
The 1 light band represents a flatness of 0.00029mm! The surface is finished through various polishing processes.
- Other measurement, recording and measuring instruments
- Wafer processing/polishing equipment
Self-standing spin coater ACT-700AII, compatible with 360mm and 20-inch substrates, is available from the manufacturer Active!
- Other semiconductor manufacturing equipment
〇Catalog updated〇 Active product: Manual dripping spin coater
We have updated the catalog content for the manual drop-coater made by Active. If you are interested, please contact our company, Active.
Not only can we create films on flat surfaces, but we can also apply films to three-dimensional objects! Please let us know the areas where you would like the film to be applied.
- Evaporation Equipment
- Sensors
- Contract manufacturing
An automatic polishing machine specialized for "reproducibility"! It is a single unit that also excels in maintainability.
- Wafer processing/polishing equipment
A sample polishing machine equipped with a powerful motor controlled by an inverter.
- Wafer processing/polishing equipment
A simple and efficient grinder! Easy maintenance with removable parts, etc.
- Wafer processing/polishing equipment
The price is back at a low cost! Introducing the upgraded automatic polishing machine MECATECH 334.
- Wafer processing/polishing equipment
Real-time adjustable vibration frequency and amplitude! A sample polishing machine capable of accommodating a 305mm diameter flat plate.
- Wafer processing/polishing equipment
Adopting precision ball screws enables high-accuracy positioning!
- Other semiconductor manufacturing equipment
- Press Dies
Ideal for prototyping and small-scale production! Desktop servo press device RMS750 enables high-precision positioning!
"High precision positioning is possible with the adoption of precision ball screws!" "Features" - Energy-saving achieved with the use of AC servo motors - Digital adjustment of open height allows for compatibility with a variety of molds - High precision positioning is possible with the adoption of precision ball screws - Processing conditions can be set according to the workpiece, including stop time specification, ram speed, and position specification We also accept inquiries for the design of prototype semiconductor package lead forming cut molds tailored to tabletop servo presses. ~Basic Information~ Main body size: 390mm(W) × 340mm(D) × 580mm(H) Main body weight: 50kg Mold size (standard): 118mm(W) × 170mm(D) × 131mm(H) Workpiece (standard size): MAX 80mm(W) ~Applications~ Trial runs, small-scale production, mass production