List of Semiconductor Manufacturing Equipment products
- classification:Semiconductor Manufacturing Equipment
3061~3075 item / All 5179 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Press the start button to automatically measure all items continuously! Introduction to the laser diode inspection device.
- Other inspection equipment and devices
- Semiconductor inspection/test equipment
LD is supplied in a tray storage state, and automatic pickup and measurement are performed continuously!
- Other inspection equipment and devices
- Semiconductor inspection/test equipment
Development of Ultra-Fine Processing Technology - Mori Seiki Cutting Processing Dream Contest - 6th Micro Processing Division Gold Award Winning Work - Micro 3D Rotating Filter
- Other semiconductor manufacturing equipment
We will respond as your manufacturing partner with a one-stop (integrated production system) approach!
- Contract manufacturing
- Semiconductor inspection/test equipment
- Wafer processing/polishing equipment
Notice of Participation in Internepcon Japan 2021 Electronics Manufacturing and Assembly Exhibition
We will be exhibiting at "NEPCON Japan," where the latest manufacturing and implementation technologies that support the multifunctionality and high performance of electronic devices come together. "NEPCON Japan" has established itself as a venue for business negotiations with domestic and international manufacturers of electronic devices, semiconductors, electronic components, and automotive and electrical equipment. If you are facing various challenges such as complicated outsourcing management or improving equipment utilization rates, please stop by our booth. We will propose the optimal plan tailored to your situation. 【Booth Number: W1-54】 ● NEPCON Official Site: https://www.nepcon.jp/ja-jp.html ● NEPCON Company Site: https://jan2021.tems-system.com/exhiSearch/INW/jp/Details?id=%2FUqXsOFXpWM%3D&type=2&rel=undefinedl If you need an invitation ticket, please request the necessary number by writing to us through the "Contact" section. We look forward to your visit as we prepare new proposals.
Aluminum microprocessing, fine groove processing, micro groove cutting processing, precision aluminum parts for semiconductor manufacturing equipment.
- Other semiconductor manufacturing equipment
Aluminum five-axis machining Osaka [Leave cost reduction to Philir Co., Ltd.]
- CVD Equipment
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Whether in a syringe or cup type, leave the mixing and degassing to us!
- Mixer/agitator
- Other semiconductor manufacturing equipment
Production innovation in LED dispensing engineering! Achieving the precision required in the production field.
- Dispenser
- Other semiconductor manufacturing equipment
For stirring and degassing all kinds of materials such as LED materials, medical materials, solar cells, and adhesives! Compatible with both syringe and cup types!
- Mixer/agitator
- Other semiconductor manufacturing equipment
Ensuring and maintaining productivity! We introduce economical, compact, and highly reliable products.
- Wafer processing/polishing equipment
- Other measurement, recording and measuring instruments
Non-contact transport device for gripping ultra-thin warped wafers without touching them.
- Other semiconductor manufacturing equipment
- CVD Equipment
- Heating device
It can be easily used by anyone simply by specifying the etching amount (depth) and the material of the wafer.
- Etching Equipment