List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
1141～1155 item / All 5180 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
We flexibly respond to everything from software and hardware design to implementation and product assembly. "Yoho's adaptability" to the challenges of various manufacturers.
- EMS
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Capable of accommodating large circuit board assembly in 850×500mm size.
Supports large PCB assembly with a size of 850×500mm. [Precision] Chip size: 03015 Lead pitch: 0.3mm Adjacent pitch: 0.1mm [Supported Chips] BGA, CSP, QFN, SOP, QFP, LED, etc. [Supported Sizes] Minimum size: 50mm×50mm Maximum size: 500mm×850mm Board thickness: 0.5mm to 3.0mm
If you are troubled by contamination from waste and foreign substances after cleaning, NCC will provide solutions!
- Other machine tools
- Other production management systems
- Other semiconductor manufacturing equipment
For polishing various substrates and for fine burr removal in punched areas.
- Other machine tools
- Wafer processing/polishing equipment
- Special Processing Machinery
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.
- Wafer processing/polishing equipment
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Exhibiting at JIMTOF! Demonstrating tape grinding of ball screws and worms for electric vehicles! Also unveiling a newly developed outer diameter grinding machine and new technology for clogging preve...
- Wafer processing/polishing equipment
You can achieve the desired surface accuracy with a simple operation to replace the polishing film!
- Wafer processing/polishing equipment
No need for an inversion device to clean the LCD substrate on both sides simultaneously!
- Wafer processing/polishing equipment
- Circuit board processing machine
Roughness control below Ra0.1μm is possible! Achieving high efficiency and low-cost processing.
- Other processing machines
- Wafer processing/polishing equipment
A composite device for tape polishing and brushing that maintains shape without distortion due to the tracking mechanism!
- Other processing machines
- Wafer processing/polishing equipment
Achieve precision that is unstable by hand, and definitely improve yield! Easily portable tabletop model.
- Other processing machines
- Wafer processing/polishing equipment
A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.
- Other processing machines
- Wafer processing/polishing equipment
It can accommodate slight differences in shaft length! A device that achieves surface roughness according to the purpose.
- Other processing machines
- Wafer processing/polishing equipment
The brush mechanism allows for the removal of burrs and chips generated during cutting.
- Other processing machines
- Wafer processing/polishing equipment
We propose our polishing equipment to address the concerns of automotive parts manufacturers.
- Wafer processing/polishing equipment
- Other abrasives
Inner diameter grinding device renewal
We have renewed the demo model of the film-type inner diameter polishing machine. The maximum size of compatible workpieces has increased in both height and diameter! During test trials before the equipment is finalized, processing under conditions closer to actual operation has become widely possible. If you are having trouble managing roughness with inner diameter honing or similar processes, please consider the film-type inner diameter polishing machine!
Introducing a case study on equipment installation at an automotive parts manufacturer! We are showcasing solutions using ball screw grinding technology tailored to the concerns of automotive parts ma...
- Wafer processing/polishing equipment
- Other abrasives