List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
91～135 item / All 4974 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.
- Other machine tools
Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.
The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.
Are you having trouble with the delivery time for cast prototypes? "Casting prototype service!" for cast iron, aluminum castings, and stainless steel castings (lost wax casting)!
- Other semiconductor manufacturing equipment
Round hole filters and honeycomb mesh, etc.! You can create freely shaped designs.
- Etching Equipment
Easy tool re-sharpening! Anyone can achieve a uniform finish! Ready to use with a household power supply.
- Other surface treatment equipment
- Wafer processing/polishing equipment
- Optical inspection of LEDs - Electrical characteristic testing - High-speed processing of classification - By exchanging attachments, one machine can be used for both side view and top view.
- Automatic sorting machine
- Chip type LED
- Other semiconductor manufacturing equipment
Standard products available in a variety of sizes, customization is also OK! *Currently offering product samples to 10 people by lottery.
- Other semiconductor manufacturing equipment
We will be exhibiting at the 2nd Semiconductor Industry Exhibition to be held in Kyushu in October 2025.
This time, Orte Corporation will exhibit at the "2nd Kyushu Semiconductor Industry Exhibition," continuing from last year. As a specialized manufacturer of collets for chip transport, we will introduce a variety of cutting-edge products that respond to the latest assembly processes, including rubber collets for ionizer countermeasures and patented holder mechanisms that can accommodate high-aspect and large chips. Particularly noteworthy is the rubber collet with a U-shaped recessed type that achieves a contact width of less than 0.1mm between the chip and the collet, utilizing ultra-precision processing technology. It is also compatible with optical devices and bumped chips, making it ideal for high-precision applications that require flatness at the collet tip. We will have sample displays of our products, including collets, so please feel free to stop by our booth. 【Exhibition Contents】 - Pickup collets (rubber/plastic/metal/others) - Bonding-related components (upward needles, dispense nozzles, transfer pins) - Wire bonding-related components (EFO torch, wire clampers, window clampers, finger clamps) - Transport components (magazine racks, IC chip trays)
High-performance, cost-effective RF/DC magnetron sputtering system for research and development.
- Sputtering Equipment
- Evaporation Equipment
- Other semiconductor manufacturing equipment
◇◆◇ nanoPVD-S10A Magnetron Sputtering Device ◇◆◇
This is a research and development RF/DC magnetron sputtering device. Despite its high performance and multifunctionality, it fits into limited laboratory space with a compact size and easy operation via a 7-inch front touch panel. ● Achievable pressure: 5x10^-5 Pa (*fastest 30 minutes to 1x10^-4 Pa!) ● Film uniformity: ±3% ● Various options: up/down rotation, heater, cathode for magnetic materials, and more ● 3-source cathode + 3 MFC systems, with additional RF/DC power supply, allowing for versatile applications such as multilayer films and simultaneous deposition. - Insulating films - Conductive films - Compounds, etc. 【Main Features】 ◉ Compatible substrates: 2" (up to 3 sources) or 1" (1 source) ◉ 2" cathode x up to 3 sources ◉ Easy operation via touch panel with PLC automatic program control ◉ High-precision APC process control with MFC ◉ Up to 3 MFC systems ◉ USB port for Windows PC connection, capable of creating and saving recipes for up to 1000 layers and 50 films. Live data logging on PC. ◉ Vacuum system: TMP + RP (*dry pump option) ◉ Substrate rotation, vertical lift, and heating (Max 500℃) ◉ Quartz crystal film thickness monitor/controller
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
- Other semiconductor manufacturing equipment
- Sputtering Equipment
Sputtering/Dual Chamber System【MiniLab-E080A/S060A】
Two thin-film experimental devices are connected via a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected through the load lock. With Moorfield's unique load lock system, connections to the left, right, and rear process chambers are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB Evaporation: 7cc crucible x 6 - Resistance Heating Evaporation x 2 - Organic Evaporation Limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron Cathode x 4 sources for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma Etching Stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique 'soft etching' technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Supports RCA cleaning and various etching! Significantly reduces the usage of chemicals and pure water as well as the footprint.
- Other surface treatment equipment
- Other semiconductor manufacturing equipment
Accommodating various process needs with a diverse range of chamber forms! Work sizes range from 2-inch to 12-inch wafers.
- Other surface treatment equipment
- Other semiconductor manufacturing equipment
【Hot Melt Molding Machine】 ▼From low-cost tabletop devices to mass production machines▼ ▼Many actual machines on display at the prototype lab (Fuji City)▼
- Other polymer materials
- Molding Equipment
- Coating Agent
Introducing the waterproof, dustproof, and insulation protection technology for various electrical components called "hot melt molding." Sealing is completed in just a few dozen seconds, achieving process improvement and cost reduction.
The technology "Hot Melt Molding," which is expanding its adoption for waterproofing, dustproofing, and insulation protection of various electrical components, rapidly solidifies thermoplastic hot melt adhesives within molds, completing sealing in a short time of just a few dozen seconds. Compared to traditional urethane potting and epoxy potting, this technology allows for sealing to be completed in an ultra-short time, leading to alternatives aimed at process improvement and cost reduction. Additionally, because it involves mold forming, it offers high freedom of shape, receiving high praise for miniaturization and lightweighting of components. Our company, Matsumoto Processing, has been involved in the protection of many electrical components, including automotive electrical components, as a pioneer of this technology alongside our customers. We can achieve material selection, specification consideration, prototype shape design, mold manufacturing, and prototyping in a short time. Customers interested in this technology are encouraged to feel free to contact us.
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
- Bonding Equipment
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
High-speed line inspection at SWIR 2K×1, 110kHz
- Monochrome camera
- Semiconductor inspection/test equipment
Flow spray of 2 mmlit/min or less is possible!
- nozzle
- valve
- Etching Equipment
We have started listing our products on the matching service SEMI-NET for the WEB EXHIBITION of semiconductors/MEMS/displays.
We have started listing our products on the semiconductor-related matching service site SEMI-NET. The listed products are as follows: ≪Sonosys≫ - Ultrasonic cleaning spray nozzle for batch-type cleaning equipment - Ultrasonic cleaning machine for batch cleaning - Ultrasonic spray nozzle (for coating) *Please contact us if you need a catalog of Sonosys products. ≪Sonia≫ - Ultrasonic spray nozzle ≪Sonic≫ Blower and air knife system for water removal and drying after cleaning ≪GPE≫ Blower for water removal and drying after cleaning (standalone) High pressure, large airflow, low noise, and low vibration with low power consumption—four benefits in one. We will continue to list products on this site as they become available. If you need catalogs or other materials, please feel free to contact our staff.
Leakage Current Circuit Breaker 【LCB 15mA 100V 15A PSC AAM A】
- Tester
We propose a custom-made dispenser that fulfills your ideals.
- Other semiconductor manufacturing equipment
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
- Bonding Equipment
Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
A super compact spin coater that won't be in the way even inside the glove box.
- Other semiconductor manufacturing equipment