List of Semiconductor Manufacturing Equipment products

Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

• Other conveying machines

Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

• Cooling system

Easy setting of the thermal spray current! Using the patented "coaxial drive" system for metallization!

• Other semiconductor manufacturing equipment

A high-purity coating enhances the corrosion resistance, wear resistance, and impact resistance of metal components!

• Other semiconductor manufacturing equipment

Compact and easy to operate! Achieves high adhesion and a low porosity film.

• Other semiconductor manufacturing equipment

Ideal for use in the configuration of long supply packages! Provides a fast spraying speed.

• Other semiconductor manufacturing equipment

It is possible to spray molybdenum from a soft bonding film to a very hard wear-resistant film!

• Other semiconductor manufacturing equipment

Coating on parts is possible! This extension is often used for complex shapes.

• Other semiconductor manufacturing equipment

Adopting all the features of the conventional plasma and HVOF equipment's concise control and operator interface!

• Other semiconductor manufacturing equipment

Corrosion-resistant coating: Save time and costs! Flame spraying equipment using oxygen and propane as fuel.

• Other semiconductor manufacturing equipment

Introducing examples of stainless steel machining. We accommodate various parts processing across industries, not limited to machining, including turning, sheet metal work, and welding.

• Processing Contract
• Other machine elements
• Semiconductor inspection/test equipment

Multi-Wafer Handling Die Bonder (Auto)

• Bonding Equipment

Eagle AERO is a high-throughput wire bonding device.

• Bonding Equipment

CoS (Chip on Submount) is a high-precision die/flip chip bonder.

• Bonding Equipment

ICA1205 is a multi-laser dicing device that employs a multi-beam structure.

• Other semiconductor manufacturing equipment

It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.

• Bonding Equipment

AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.

• Bonding Equipment

Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.

• Bonding Equipment

We will introduce hand clean rolls made of silicone-based and non-silicone-based materials.

• Other cleaning tools
• Special labels, etc.
• Evaporation Equipment

Supports work widths of 255, 350, 450, 550, 600, and 750 mm!

• Sputtering Equipment
• Food Packaging Machinery
• Beverage Production Equipment

The CMX series is great news for those who had given up on web cleaners due to space constraints.

• Coater
• Vacuum Packaging Machine
• Processing Contract

Ideal for use in clean rooms! It is a fully automatic system for cleaning rolls.

• Sputtering Equipment
• Bag making machine/slitter
• Special labels, etc.

Supports work widths from 300 to 1500 mm! Single-sided and double-sided narrow applications.

• Coater
• Bag making machine/slitter
• Processing Contract

To customers considering wide-width equipment for roll-to-roll production lines.

• Bag making machine/slitter
• Injection Molding Machine
• Semiconductor inspection/test equipment

To customers considering ultra-wide equipment for roll-to-roll production lines.

• Evaporation Equipment
• Extrusion Machine
• Food Packaging Machinery

The ULT roll-to-roll web cleaner device stably removes dust even at a converting production line speed of 300m/min.

• Sputtering Equipment
• Bag making machine/slitter
• Food Packaging Machinery

"High-precision microfabrication" is a new method that achieves a balanced total of processing accuracy, productivity, compatible materials, and cost!

• Wafer processing/polishing equipment

Excellent burr removal performance! It cleansly removes small gaps and burrs.

• Wafer processing/polishing equipment

Advanced technologies that have been uniquely developed to support the industries of this country.

• Other semiconductor manufacturing equipment

Beautifully finished and improved design! Suitable for precision instruments and parts that require durability.

• Wafer processing/polishing equipment

All components are custom-made at a low cost, allowing for flexible customization. We provide one-stop service, including software support, at an attractive price.

• Other semiconductor manufacturing equipment

Carbon dioxide has excellent effects in preventing static electricity. It is a device that controls the specific resistance value of DIW by supplying CO2 gas through a hollow fiber membrane.

• Ion implantation equipment

We can provide heat-resistant IC chip trays made of SUS (stainless steel).

• Other semiconductor manufacturing equipment

Powerful eddy current testing in your hands! A handheld tester that flexibly adapts to a wide range of operating modes.

• Tester
• Other measurement, recording and measuring instruments

The passivation MBE device is composed of various chambers specially designed for laser facet passivation and other purposes.

• Evaporation Equipment
• CVD Equipment

By achieving ultra-high temperature treatment and excellent temperature uniformity, batch processing of boule ingots and wafers is possible, minimizing defects and dislocations.

• Annealing furnace
• Other semiconductor manufacturing equipment
• Other metal materials

We design and provide nozzles and precision nozzles of small sizes that can be used in semiconductor manufacturing processes. Achieved with precision component design technology cultivated over severa...

• Contract manufacturing
• Other industrial robots
• Other semiconductor manufacturing equipment

Use of diamond with excellent wear resistance.

• Bonding Equipment

Utilizing ultra-precision machining to demonstrate excellent bonding properties.

• Bonding Equipment

Achieving stable tension force using a unique ceramic nozzle.

• Bonding Equipment

High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.

• Bonding Equipment

Carbon dioxide has excellent effects in preventing static electricity. This is a device that controls the resistivity of DIW by supplying CO2 gas through a hollow fiber membrane.

• Ion implantation equipment

We can widely design and provide EFO torches for wire bonders used by various companies in the semiconductor industry.

• Bonding Equipment
• Other semiconductor manufacturing equipment

We provide EFO torches that fit your company's specifications according to your budget. We offer a variety of shapes, from stick-shaped to special designs.

• Other semiconductor manufacturing equipment

No costs for molds! We can also accommodate small lot production of deformed items.

• Etching Equipment