List of Mounting Machine products
- classification：Mounting Machine
1711～1755 item / All 1857 items
This is a wafer chemical cleaning device of the manual type for 3D implementation!
- Other mounting machines
Improvement of precision in the consistent assembly production line. We will enhance the main equipment.
- Other mounting machines
The grip can be used permanently!
- Circuit board processing machine
- Other consumables
Launched the compact and low-cost UV-LED irradiation device (ultraviolet irradiator) ULEDN-102CT series.
- Other optical parts
- Other mounting machines
Introduced a processing machine equipped with IFRIT (Ifrit) from Cyber Laser Co. It enables high-precision micro-machining of difficult-to-process materials and achieves reduced friction.
- Circuit board processing machine
- Other processing machines
- Processing Contract
A spray gun for thin films has been developed that allows for uniform film formation by atomizing a coating material with fillers, high viscosity, and high thixotropy!
- Other mounting machines
- Printing Machinery
- spray
Exhibited at the JPCA Microelectronics Show eX-tech 2016.
From June 1 to 3, at Tokyo Big Sight, Shimada Appli LLC will exhibit the following new products and patented high-efficiency coating guns at the JPCA Show, held concurrently with the Microelectronics Show eX-tech 2016. Theme: The latest automatic gun for partial coating with automatic adjustment of coating width and film coating with ultra-fine nozzles significantly contributes to quality and cost reduction. Exhibited Products and Announcements: 1. Demonstration of a selective spray gun capable of automatically adjusting the coating width from 1 to 12 mm (patent pending). 2. Announcement of a coating method for solvent-based moisture-proof materials that applies without stringing (patent pending). 3. Demonstration of various nozzle coating patterns for the latest film coating. Demonstration of a high-speed response film coating gun with a 3 mm diameter nozzle (utility model registered).
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It can be used for various applications, from solder formation on the wafer to soldering of semiconductor chips, and even large-area soldering for power devices.
- Vacuum Equipment
- Wafer processing/polishing equipment
- Reflow Equipment
Air-free, hassle-free laminator
- Other semiconductor manufacturing equipment
- Circuit board processing machine
- Vacuum Packaging Machine
Manual tape mounter is a tape application machine that combines a wafer mounter and a wafer laminator.
- Mounter
- Other semiconductor manufacturing equipment
The dust prevention measures are different from previous exposure devices!
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Construction of implementation facilities tailored to various customer needs.
- Other mounting machines
- Other services
Valve seat press-fitting device for simultaneously press-fitting the valve seat ring and valve guide.
- Other machine tools
- Soldering Equipment
- Fuel system parts
It is a high-frequency induction heating device for brazing the chip part and shank part of a gun drill.
- Other machine tools
- Soldering Equipment
- Fuel system parts
This is a brazing heating device that allows anyone to perform brazing using high-frequency heating.
- Other machine tools
- Soldering Equipment
- Fuel system parts
This is a sprocket hardening and tempering device that utilizes induction heating by high frequency.
- Other machine tools
- Soldering Equipment
- Fuel system parts
High-frequency soldering heating device.
- Other machine tools
- Soldering Equipment
- Fuel system parts
Processing technology that allows flexible responses tailored to customer needs, from a single prototype to mass production.
- Circuit board processing machine
It is capable and easy to use. There are few troubles and maintenance costs are low. AGH seed spraying machine.
- Other mounting machines
Seed blowing and dual use. Few troubles and low maintenance costs. AGD, AGPM soil-blowing machines.
- Other mounting machines
For greening substrate materials and chip materials. Available for supply with shovels or precast.
- Other mounting machines
High performance, high safety, excellent mobility, low running costs, AG-150II.
- Other mounting machines
A device for semi-automatically applying dicing tape to silicon wafers. It is a semi-auto type compatible with 12-inch wafers, providing supply of wafer frames and frame mounting.
- Other painting machines
- Mounter
This laminator supports wafers from 4 inches to 8 inches, has a compact design that can be placed on a tabletop, and is easy to operate even for beginners.
- Other painting machines
- Mounter
Space reduction of 35% (compared to our company)! The inspection device is built into the main unit, allowing operations to be performed on the same control screen!
- Other mounting machines
High-performance flip chip bonder for multi-variety cell production lines.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production purposes
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production with automatic ACF attachment.
- Circuit board processing machine
Elimination of coating unevenness and nozzle clogging with a unique nozzle.
- spray
- Circuit board processing machine
- Other semiconductor manufacturing equipment
IC bonding device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production use.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
High-density plasma is generated over a large area by a unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Molding Equipment
- Circuit board processing machine
- Plasma surface treatment equipment
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
Implementation Solution Service
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Notice of Participation in the 22nd Fine Tech Japan - Low Power Atmospheric Pressure Plasma Device with Reduced Ozone and Nitrogen Oxide Emissions
Well, Inc. (Location: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the 22nd Fine Tech Japan, which will be held at Tokyo Big Sight from April 11 (Wednesday) to April 13 (Friday), 2012. Well's atmospheric pressure plasma equipment is characterized by its environmental friendliness, featuring low power consumption (CO2 reduction) while suppressing the generation of ozone and nitrogen oxides. Additionally, it does not require a vacuum chamber like conventional equipment, combining low capital investment with low running costs, which is its greatest economic advantage. On the day of the event, we will conduct a demonstration using the compact tabletop MyPL-Auto150, allowing you to experience actual large-area plasma irradiation. We sincerely look forward to your visit. 【Contact Information for Inquiries】 Well, Inc. Packaging Solutions Sales Department Tel: 03 (5715) 3501 Email: info@welljp.co.jp http://well-plasma.jp/
Real-time monitoring system for semiconductor packaging process anomalies
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Dispenser & UV irradiation device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Ultrasonic flip chip bonder
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Sale of inexpensive metal mask storage shelves compatible with Irector spacers.
- Other semiconductor manufacturing equipment
- Other mounting machines
- cabinet
We are committed to manufacturing printed circuit boards with a pattern accuracy of 0.1μm.
- Circuit board processing machine
As a key player in the manufacturing and maintenance of electronic devices that support the accelerating digital network society.
- Other mounting machines
Equipped with independent temperature control program (multi-functional type)
- Soldering Equipment