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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Other semiconductor manufacturing equipment
  6. Bernoulli tweezers (for ultra-thin glass over 50μm)

Bernoulli tweezers (for ultra-thin glass over 50μm)

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Bernoulli Forceps Type C(4)

last updated:Dec 11, 2018

ソーラーリサーチ研究所 大阪事業所
ソーラーリサーチ研究所 大阪事業所
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Non-contact tweezers for transporting 50μm ultra-thin glass and ultra-thin wafers.

A non-contact tweezers that transports wafers and chips to a designated location without contact by attaching a handle with a valve to a Bernoulli chuck that transports wafers by ejecting gas, allowing for manual operation of the valve like a pair of tweezers. Since it is non-contact, it does not scratch the wafers and allows for easy non-contact transportation.

    Other semiconductor manufacturing equipmentSubstrate transport device (loader/unloader)Other assembly machines
P1020269.JPG

Bernoulli tweezers (for ultra-thin glass over 50μm)

P1020269.JPG
P1020269.JPG
  • Related Link - http://www.solarlab.co.jp/pin1be

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basic information

A non-contact tweezers that transports wafers and chips to a designated location without contact by attaching a handle with a valve to a Bernoulli chuck that transports 50μm thick glass wafers by ejecting gas, allowing for manual operation of the valve like a pair of tweezers. Since it is non-contact, it does not scratch the wafers and allows for easy transportation without contact.

Price information

-

Delivery Time

P3

Applications/Examples of results

A non-contact tweezers that transports wafers, chips, and smartphone glass to designated locations through manual valve operation, without making contact. Since it is non-contact, it does not scratch the wafers or smartphone glass, allowing for easy non-contact transportation.

Company information

ソーラーリサーチ研究所

ソーラーリサーチ研究所 大阪事業所

Electronic Components and Semiconductors

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Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.

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The related categories of Other semiconductor manufacturing equipment

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  • Mounting Machine
  • Substrate transport device (loader/unloader)
  • Assembly Machine
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