List of Semiconductors and ICs products
- classification：Semiconductors and ICs
1876～1890 item / All 4864 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
Achieving a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line! *Samples available upon request.
- Other semiconductors
Achieved a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line!
- Other semiconductors
Achieves low RDS(on) to maximize the effective use of package space.
- Other semiconductors
Introducing our unique package and DioMOS technology fusion module!
- Other semiconductors
The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!
- Other semiconductors
Insulation withstand voltage 2500V! A module that uses IGBTs specialized for high-speed performance.
- Other semiconductors
Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.
- Other semiconductors
A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.
- Other semiconductors
- Database
- EAI/ETL/WEB application server
September 17 Webinar: "Next-Generation AI Infrastructure and Optoelectronic Integration Implementation"
■Title: "Next-Generation AI Infrastructure and Optoelectronic Fusion Implementation - Addressing Massive Information Processing, Decoding Optoelectronic Fusion -" In the context of the rapid increase in information volume due to AI and live video, this seminar explains optical fiber communication, high-speed wireless, and semiconductor technologies that support high-speed information transmission. Participants will systematically learn about the current status and challenges of "optoelectronic fusion implementation" aimed at introducing optical transmission between and within electronic devices. 【Knowledge Gained from the Seminar】 - Basics of high-speed information transmission technology and the essence of high-speed transmission - Factors influencing high-speed transmission such as transmission medium, transmission distance, and transmission loss - Transmission methods including wired/wireless, 4G/5G, Wi-Fi 6/7 - Development history of optical fiber communication, communication methods, and transceivers - Challenges in information transmission between and within electronic devices - Current status of optoelectronic signal conversion and optoelectronic fusion implementation - Basic technologies such as optical semiconductors, silicon photonics, processors, and memory 【Target Audience for the Seminar】 - Individuals interested in high-speed information transmission technology - Those dealing with large-capacity information such as AI and video - Individuals who want to learn the basics of semiconductor and transmission technology
A new style heat sink with lower thermal resistance than the popular FK244 series.
- Other semiconductors
By directly soldering SMT power devices to the circuit board, a heat dissipation effect can be achieved.
- Other semiconductors
Here is an amazing thermal solution with exceptionally excellent thermal conductivity in the thickness direction of the TIM sheet!
- Composite Materials
- Other semiconductors
- Generators and transmission motors
We will exhibit at the 2nd Power Device & Module EXPO!
We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!
Heat sink for PCB mounting, 35.3 mm wide x 35 mm high.
- Other semiconductors
Pursuing extremes with rich achievements and advanced technology! Establishing a processing capability system positioned among the world's top class.
- Other semiconductors
- Wafer processing/polishing equipment
![[Problem Solving Case] Pitch Conver...](https://image.mono.ipros.com/public/product/image/4cc/2001503929/IPROS78349843531622306344.png?w=280&h=280){kind=small}
An example of connecting different pitches through a pitch conversion adapter linked by a pattern!
- Other semiconductors
![[Problem Solving Case] SMT Conversi...](https://image.mono.ipros.com/public/product/image/413/2001503932/IPROS39276812336088411411.png?w=280&h=280){kind=small}
An adapter composed of a substrate material (CEM-3) that is resistant to high-temperature reflow and pin terminals for SMT implementation!
- Other semiconductors