September 17 Webinar: "Next-Generation AI Infrastructure and Optoelectronic Integration Implementation"

Understand the essence of next-generation AI infrastructure and consider future technology strategies, investment strategies, and business strategies!

AI Infrastructure Transformation: The Revolution of Next-Generation AI Infrastructure and Optoelectronic Integration Implementation [Features of this Book] - A must-read analysis for engineers covering thermal design, liquid cooling, and yield! Comprehensive coverage of the challenges in CPO implementation! - Market forecasts up to 2035! Investment opportunities and conditions for success revealed through the CPO adoption curve! - GAFA's pursuit of "Optical Dominance"! Disruptive strategies from emerging disruptors challenging existing powers! - Delving into the core of the IOWN concept! The day when Japan's material intelligence conquers the world! - The intersection of technology and market! A strategic roadmap leading to the redefinition of AI computing! - The true nature of the "AI Infrastructure Transformation"! Everything about the next-generation computing foundation led by optoelectronic integration is here! - No longer supported by "copper"! The shock of infrastructure transformation brought by optoelectronic integration implementation! - Japan's material strength seizes the opportunity! Geopolitical risks and future strategies of the optoelectronic integration supply chain! - A compass to 2035! Explaining the strategic value of "opticalization" that holds the key to AI infrastructure transformation!

• Technical and Reference Books

2035 Strategy Interpreted from Implementation, Regulation, and Economic Security!

The Complete Guide to Low Dielectric Materials in the Semiconductor and AI Era ~ Deciphering the 2035 Strategy from Implementation, Regulation, and Economic Security ~ 【Features of this Book】 - Technological innovations and market changes of low dielectric materials supporting the era of over 224Gbps! - Supply chain restructuring and material strategies in the geopolitical era! - Future vision of advanced packaging driven by optoelectronic integration and glass core substrates! - Analyzing the 2035 electronic substrate materials market through a triple amplification model! - A multifaceted analysis of the competitive advantages of major material manufacturers! - Technical requirements for low dielectric materials supporting chiplets and 3D packaging! - Growth potential and investment value of the low dielectric materials market looking towards 2035!

• Other semiconductors
• Technical and Reference Books

The era when AI was merely a tool waiting for human instructions has ended, leading to coexistence with humans! Instead of being immersed in specialized fields, a cross-disciplinary "integrative perspective" is required!

Physical AI: Integrated Technology of Materials, Devices, and Implementation [Features of this Book] - A radical shift in design philosophy. A complete and detailed explanation of the "four-in-one" strategy of materials, components, structures, and signal processing! - The reintegration of matter and intelligence. An essential latest report for developers that delves into the core of next-generation device development! - From self-healing materials to soft robotics. A stunning vision of the future opened up by physical intelligence! - Going beyond GAFA. A scenario for dominance in 2050 interpreted through implementation technology and device evolution! - Comprehensive corporate analysis. Identifying technological challenges and business opportunities, providing guidance for investment and development! - A condensed overview of the latest trends in MEMS and flexible devices. The societal changes brought about by advanced sensing! - Sustainable manufacturing. A sharp analysis of the challenges of sustainable materials and social implementation! - From autonomous driving to healthcare. A roadmap to 2050, a bible for technological integration!

• Technical and Reference Books

A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.

- The data center cooling market in 2030 is expected to expand to ● billion yen, a ●% increase compared to 2023! Investigating the background! - Researching the technology trends of silicon photonics and the background for the adoption of PIC! - Exploring market forecasts for Si, SiC, GaN, and Ga2O3 semiconductors, their backgrounds, and developments in various applications! - Why are NVIDIA and AMD adopting CoWoS technology? What are the challenges? What is TSMC's strategy? - Advantages and disadvantages of interposers, industry trends, and movements of TSMC, Intel, and Samsung! - The intensifying global HBM market share competition and the business opportunities for Japanese companies that accompany it! - Investigating the required performance and technology trends for underfill, market forecasts, and company-specific shares! - The market for FC-BGA substrates for AI servers/data centers, company-specific shares, and corporate strategies! 【Table of Contents】 Part I: AI Data Centers Part II: Cooling and Thermal Management Part III: Optical Communication Related Part IV: Next-Generation Semiconductors Part V: Packaging Technology Part VI: High-Multilayer Substrates and Low-Dielectric Resins *For a detailed table of contents, please refer to the related link URL.

• Other semiconductors
• Database
• EAI/ETL/WEB application server

We will be exhibiting at Semicon Japan 2024, which will be held at Tokyo Big Sight from December 11 (Wednesday) to December 12 (Friday). If you are interested, please come to the venue. ■ Products to be exhibited 1. Spectral interference optical thickness sensor CHRocodile 2 DW/ 2IT 2. Area scanner for measuring the thickness and shape of 12" wafers - Flying Spot Scanner (FSS) 3. Chromatic aberration confocal optical line sensor CLS2.0 4. Chromatic aberration confocal line camera CVC 5. Chromatic aberration confocal optical single-point sensor CHRocodile Mini 6. Non-contact thickness measurement sensor for opaque materials Enovasnese 7. Sensor for detecting internal defects non-contactly - Field sensor

We will exhibit at Highly-functional Material Week – 6th Sustainable Material Expo from Sep. 30 (Wed) - Oct.2(Fri), 2026. We look forward to seeing you at our booth. [Exhibited Products] - Cellulose fiber compounded resin “GREEN CHIP CMF” - A Sheet that Changes from Paper to Plastic When Heated “Conversion Sheet” - 1000°C Fireproof Thin Sheet “Thermal Barrier/Flame Spread Prevention Sheet” - Improving sealability and adhesion between metals and resins for integral molding “Sealing Tape HT56 for Insert Molding” - Eco-Friendly Kraft Paper Tape “RICA TAPE” /Self-Adhesive Tape “RICA SELF” - Reusable “Load Stability Cover” for Preventing Load Shifting

We will hold a "3D Manufacturing Individual Consultation Meeting" at creative centers across various locations. On the day, we will be available to discuss "3D modeling machines." A dedicated staff member will be present, allowing for in-depth discussions unlike at exhibitions. Each session is limited to one company, and we will provide careful, one-on-one support. As seating is limited, please apply early. All of our staff sincerely look forward to your visit. Recommended for customers like these: ■ Using a 3D printer but dissatisfied with accuracy or finish ■ Wanting to create mock-ups closer to the final product ■ Looking to in-house production of jigs ■ Interested in utilizing it in educational institutions Capacity: Limited to one company per session Application deadline: 17:00 on the business day before each event date.

Date and Time: Thursday, July 23, 2026, 13:30 – 16:45 This seminar is recommended for those who use "Gaussian," the de facto standard for quantum chemistry calculations, and "GaussView6," which is essential for creating input files and visualizing results, but want to learn more effective settings and convenient features. We also offer a free attendance benefit for those who have contracted paid support. Please make use of this for advanced research and data-driven development! For more details, click here (to the Hulinks page) https://www.hulinks.co.jp/seminar/gaussian-gaussview-intermediate/

Nitto Kohki will exhibit at "BATTERY JAPAN - Secondary Battery Exhibition" held at Makuhari Messe Hall 7 from September 9 (Wednesday) to September 11 (Friday), 2026. [Booth Number: E22-6] ■ Introduction of Exhibited Products At this exhibition, we will showcase rapid fluid couplings that can quickly connect and disconnect piping for various fluids such as air, water, oil, and chemical solutions. Highlighted products include the "Zero Spill Coupler," which significantly reduces liquid dripping during disconnection and contributes to improving the working environment, as well as the new "Large Diameter Zero Spill Coupler." Additionally, we offer over 100 varieties in the "High Coupler" series, categorized by body material and mounting size.