September 17 Webinar: "Next-Generation AI Infrastructure and Optoelectronic Integration Implementation"

Understand the essence of next-generation AI infrastructure and consider future technology strategies, investment strategies, and business strategies!

AI Infrastructure Transformation: The Revolution of Next-Generation AI Infrastructure and Optoelectronic Integration Implementation [Features of this Book] - A must-read analysis for engineers covering thermal design, liquid cooling, and yield! Comprehensive coverage of the challenges in CPO implementation! - Market forecasts up to 2035! Investment opportunities and conditions for success revealed through the CPO adoption curve! - GAFA's pursuit of "Optical Dominance"! Disruptive strategies from emerging disruptors challenging existing powers! - Delving into the core of the IOWN concept! The day when Japan's material intelligence conquers the world! - The intersection of technology and market! A strategic roadmap leading to the redefinition of AI computing! - The true nature of the "AI Infrastructure Transformation"! Everything about the next-generation computing foundation led by optoelectronic integration is here! - No longer supported by "copper"! The shock of infrastructure transformation brought by optoelectronic integration implementation! - Japan's material strength seizes the opportunity! Geopolitical risks and future strategies of the optoelectronic integration supply chain! - A compass to 2035! Explaining the strategic value of "opticalization" that holds the key to AI infrastructure transformation!

• Technical and Reference Books

2035 Strategy Interpreted from Implementation, Regulation, and Economic Security!

The Complete Guide to Low Dielectric Materials in the Semiconductor and AI Era ~ Deciphering the 2035 Strategy from Implementation, Regulation, and Economic Security ~ 【Features of this Book】 - Technological innovations and market changes of low dielectric materials supporting the era of over 224Gbps! - Supply chain restructuring and material strategies in the geopolitical era! - Future vision of advanced packaging driven by optoelectronic integration and glass core substrates! - Analyzing the 2035 electronic substrate materials market through a triple amplification model! - A multifaceted analysis of the competitive advantages of major material manufacturers! - Technical requirements for low dielectric materials supporting chiplets and 3D packaging! - Growth potential and investment value of the low dielectric materials market looking towards 2035!

• Other semiconductors
• Technical and Reference Books

The era when AI was merely a tool waiting for human instructions has ended, leading to coexistence with humans! Instead of being immersed in specialized fields, a cross-disciplinary "integrative perspective" is required!

Physical AI: Integrated Technology of Materials, Devices, and Implementation [Features of this Book] - A radical shift in design philosophy. A complete and detailed explanation of the "four-in-one" strategy of materials, components, structures, and signal processing! - The reintegration of matter and intelligence. An essential latest report for developers that delves into the core of next-generation device development! - From self-healing materials to soft robotics. A stunning vision of the future opened up by physical intelligence! - Going beyond GAFA. A scenario for dominance in 2050 interpreted through implementation technology and device evolution! - Comprehensive corporate analysis. Identifying technological challenges and business opportunities, providing guidance for investment and development! - A condensed overview of the latest trends in MEMS and flexible devices. The societal changes brought about by advanced sensing! - Sustainable manufacturing. A sharp analysis of the challenges of sustainable materials and social implementation! - From autonomous driving to healthcare. A roadmap to 2050, a bible for technological integration!

• Technical and Reference Books

A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.

- The data center cooling market in 2030 is expected to expand to ● billion yen, a ●% increase compared to 2023! Investigating the background! - Researching the technology trends of silicon photonics and the background for the adoption of PIC! - Exploring market forecasts for Si, SiC, GaN, and Ga2O3 semiconductors, their backgrounds, and developments in various applications! - Why are NVIDIA and AMD adopting CoWoS technology? What are the challenges? What is TSMC's strategy? - Advantages and disadvantages of interposers, industry trends, and movements of TSMC, Intel, and Samsung! - The intensifying global HBM market share competition and the business opportunities for Japanese companies that accompany it! - Investigating the required performance and technology trends for underfill, market forecasts, and company-specific shares! - The market for FC-BGA substrates for AI servers/data centers, company-specific shares, and corporate strategies! 【Table of Contents】 Part I: AI Data Centers Part II: Cooling and Thermal Management Part III: Optical Communication Related Part IV: Next-Generation Semiconductors Part V: Packaging Technology Part VI: High-Multilayer Substrates and Low-Dielectric Resins *For a detailed table of contents, please refer to the related link URL.

• Other semiconductors
• Database
• EAI/ETL/WEB application server

Shibuya Kogyo Co., Ltd. will exhibit at "POWTEX 2026 (46th International Powder Technology Exhibition)" held at Tokyo Big Sight from November 25 (Wednesday) to 27 (Friday), 2026. We propose solid-liquid mixing and dispersion systems that consider the entire manufacturing process, from powder and liquid supply to mixing, dispersion, and transfer. 【Main Introduction Content】 ■ Solid-liquid Mixing and Dispersion Systems - Process design from powder supply to mixing, dispersion, and transfer - Selection of methods such as batch and inline according to material characteristics - Support for high-viscosity and high-solid-content slurries - Live demonstration of mixing equipment (continuous kneader) - Introduction of a hybrid system for inline batch processing - Comprehensive support from lab testing to scale-up and mass production equipment 【For Those Facing These Challenges】 - Want to improve clumping and agglomeration during powder feeding - Want to reduce dispersion unevenness and quality variation in slurries - Want to review mixing and transfer processes for high-viscosity materials - Want to reproduce lab dispersion quality in mass production You can consult us not only about the selection of individual equipment but also about the optimization of the entire process and scale-up. Please feel free to visit our booth (3-H67).

[Review of DX in Pharmaceutical Labs] Reliable test data management and operational efficiency achieved by LabWare LIMS and Mettler Toledo! We would like to congratulate you on your continued prosperity. This is an announcement for a webinar by LabWare, the world's No. 1 in LIMS sales. It is a collaborative project with Mettler Toledo, a company with extensive achievements in electronic balances and more. We will introduce the benefits of using software commonly employed between LIMS and analytical instrument connections, as well as the basics of instrument connectivity. We look forward to many of you joining us.

Venue: It will be held simultaneously at Tokyo Big Sight. Please feel free to stop by. Automotive World Tokyo https://www.automotiveworld.jp/tokyo/ja-jp.html Nepcon Japan https://www.nepconjapan.jp/tokyo/ja-jp.html

In polymer materials such as plastics, rubber, films, and composite materials, advanced analytical techniques are required in a wide range of scenarios from research and development to quality control, including understanding material properties, foreign substance and defect analysis, degradation evaluation, and optimization of manufacturing processes. In this webinar, we will introduce Bruker's latest analytical solutions that are useful for the evaluation and analysis of polymer materials. Additionally, we will invite Mr. Toshimitsu Numata from Nissan Arc Co., Ltd. to give a presentation on actual analysis cases and key points for utilization. *This event will be jointly held by Bruker Japan's five divisions (BioSpin, Daltonics, Optics, Nano Surface Measurement, and X-ray).

This seminar provides an overview of the "SCS Evaluation System" designed to protect manufacturing plants from cyber attacks targeting the manufacturing industry, along with specific strategies for improving evaluation levels to obtain the SCS mark. By incorporating case studies from power transmission component manufacturing plants, participants will learn comprehensively about specific equipment implementations such as communication protection through cloud integration and VPNs, prohibiting the connection of external storage devices, as well as building operational management systems and mechanisms for continuous improvement (PDCA). This content is ideal for executives and DX promotion personnel from mid-sized and small supplier companies, who urgently need to strengthen security measures to supply products to large corporations. ▼ Recommended for: - Executives or directors of manufacturing companies, plant managers - Information security personnel in the manufacturing industry ▼ Event Details: Date: November 13, 2026 (Friday) 13:30 - 14:30 Format: Online (Teams Webinar) Participation Fee: Free ▼ Company Overview: Trust Co., Ltd. is a professional group that supports DX through AI, data utilization, and IT consulting.