Research Report "Comprehensive Guide to Low Dielectric Materials in the Semiconductor and AI Era"

This seminar systematically explains the fundamentals of optical sensors and the latest application examples against the backdrop of the rapidly growing optical semiconductor sensor market. It provides clear explanations of the photoelectric effect, the basics of semiconductors, the characteristics of key devices such as PD, image sensors, SiPM, and SPAD, as well as design and selection points regarding wavelength, sensitivity, response speed, and noise. Furthermore, it introduces the latest implementation cases for applications such as LiDAR for autonomous driving, medical and healthcare devices, industrial equipment, and IoT/smart homes, allowing participants to learn about application strategies and market trends for commercialization. It targets a wide range of individuals, from product planning and business development to marketing, research and development, and design engineers, providing knowledge that can be applied to product development and business strategies starting tomorrow.

■Title "Changes in Joint Structures and Packaging Responses Due to the Evolution of Semiconductors ~ Response of Resin Sealing Technology to the Increase in the Number of Joints and Narrow Pitching ~" In semiconductor packages, which are advancing in high integration, high density, and three-dimensionality, addressing the increase in joints (bumps) and narrowing of pitches has become an important challenge. In this seminar, experienced instructors will organize the changes in joint structures accompanying the evolution of semiconductor packages and explain the latest trends, challenges, and countermeasures in resin sealing technology and mounting technology. 【Knowledge Gained from the Seminar】 - Development history and latest trends of semiconductor packaging - Changes in joint structures and packaging technology - Evaluation methods for resin sealing materials and sealing technology - Sealing technology for narrow pitch bumps and reliability improvement - Challenges and countermeasures in advanced packaging 【Target Audience】 Engineers, researchers, and sales representatives from semiconductor-related companies, as well as those involved in semiconductor manufacturing, mounting, sealing materials, and packaging technology.