10/26 Webinar "Silicon Chemicals; Complete Guide"

The depths of material innovation driving generative AI, data centers, and physical AI!

Power Semiconductor and Advanced Materials Technology Roadmap 2030 ~ The Deep Innovations in Materials Driving Generative AI, Data Centers, and Physical AI ~ 【Features of this Book】 - What is the ultimate technological strategy of "peripheral chemical materials" that maximizes device performance? - Unraveling the depths of materials supporting the power revolution in data centers and 1500V DC distribution! - Beyond SiC/GaN. A comprehensive view of semiconductor materials and implementation strategies looking towards 2030! - From material supply to co-creation value. Strategic indicators for material manufacturers to seize dominance! - A complete overview of power semiconductor peripheral materials overcoming thermal, reliability, and supply risks! - The underlying strength of chemistry supporting AI infrastructure, from PFAS regulations to next-generation bonding technologies! - Guiding the winning strategies for next-generation power devices through material informatics!

• Other semiconductors
• Technical and Reference Books

An easy-to-understand explanation of the latest trends in PFAS regulations, which are being strengthened globally!

PFAS Regulations and Their Impact on the Semiconductor Industry 【Features of This Book】 - Clearly explains the latest trends in the strengthening of PFAS regulations globally. - Systematically organizes the processes and roles of PFAS in semiconductor manufacturing. - Covers essential knowledge needed for regulatory compliance, including analysis and processing technologies. - Introduces trends and recent examples of non-PFAS alternative materials and technologies. - A useful resource for engineers in the research, development, manufacturing, and environmental sectors of the semiconductor industry.

• Other semiconductors
• Technical and Reference Books

A compass for the era of physical AI. Structuring everything from semiconductors to data centers!

The Semiconductor Industry in the Era of Physical AI A 2030 Hegemony Scenario Interpreted from the Perspective of Constraint Economics [Features of This Book] - Where is the true bottleneck of AI semiconductors? Unraveling the depths of physics and technology. - Beyond miniaturization lies the "Century of Implementation." A complete analysis of the next-generation semiconductor hegemony. - A compass for the era of Physical AI. Structuring everything from semiconductors to data centers. - Break through the constraints of power, heat, and materials. What are the conditions for victory in the next-generation semiconductor industry? - Why is silicon alone not enough? The new economic value created by physical constraints. - US-China rivalry and the supply chain. The "winning strategy" for Japan's semiconductor industry. - From CoWoS to next-generation implementation. A thorough dissection of the bottlenecks in the AI semiconductor supply chain. - A gift to the winners of 2030. An integrated strategy for Physical AI and semiconductor infrastructure. - The fusion of physical phenomena and AI. Here is the technology roadmap that redefines the industry. - The shock of the data center revolution. Comprehensive coverage of the economics of waste heat and the materials revolution.

• Other semiconductors
• Technical and Reference Books

2035 Strategy Interpreted from Implementation, Regulation, and Economic Security!

The Complete Guide to Low Dielectric Materials in the Semiconductor and AI Era ~ Deciphering the 2035 Strategy from Implementation, Regulation, and Economic Security ~ 【Features of this Book】 - Technological innovations and market changes of low dielectric materials supporting the era of over 224Gbps! - Supply chain restructuring and material strategies in the geopolitical era! - Future vision of advanced packaging driven by optoelectronic integration and glass core substrates! - Analyzing the 2035 electronic substrate materials market through a triple amplification model! - A multifaceted analysis of the competitive advantages of major material manufacturers! - Technical requirements for low dielectric materials supporting chiplets and 3D packaging! - Growth potential and investment value of the low dielectric materials market looking towards 2035!

• Other semiconductors
• Technical and Reference Books

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

Yamawa Manufacturing Co., Ltd. will exhibit at "JIMTOF 2026, the 33rd Japan International Machine Tool Fair," which will be held at Tokyo Big Sight from October 26 (Monday) to October 31 (Saturday), 2026. We will be showcasing two new products from our highly acclaimed ultimate professional tool "Z-PRO," optimized for machining! Don’t miss this opportunity to visit our booth. 【Highlights】 We will display two new products from the "Z-PRO" brand. We have prepared many short videos to solve tapping troubles! We will thoroughly explain examples of failures and successes in tapping. Live demonstrations using the precision tapping machine 'TTTsystem' will be available.

[Speaker] Masanori Hayashi Evangelist, NTT Docomo Business, Inc. Visiting Researcher, GLOCOM, International University [Key Lecture Content] The application areas of AI are expanding from generative AI to AI agents and physical AI, while the main battlefield of AI infrastructure is shifting from learning-centric to inference-centric. Against the backdrop of rapidly growing AI demand, investments and entries into AI data centers by various businesses are accelerating. However, new challenges are emerging, such as increasing power and cooling demands, responses to data sovereignty, and the utilization of GX strategy regional systems for data center aggregation. This lecture will overview the latest trends in the AI data center market and investment trends, as well as organize technological innovations such as GPUs, liquid cooling, and all-optical networks, along with policy and institutional trends and industrial challenges. Furthermore, it will envision the future of a decentralized AI infrastructure that connects AI factories, data centers, and the edge, and discuss new industrial foundations and future competitive axes through watt-bit collaboration.

[Speaker] Ren Taro Hayashi, Senior Manager, Environmental, Energy, and Resource Strategy Group, Research and Consulting Division, Japan Research Institute, Ltd. [Lecture Items] 1. Overview of Data Centers 2. Impact of Data Centers on the Power Industry 3. Policy Trends in Data Centers and Power (1) GX2040 Vision (2) Watt-Bit Collaborative Public-Private Discussion (3) GX Industry Location Working Group (4) Japan Growth Strategy 4. Future Approaches to Power Procurement for Data Center Development 5. Q&A / Business Card Exchange

This year, we will be holding the large exhibition "Wood and Living Expo" organized by Nice! Approximately 150 domestic housing and building material manufacturers will gather to showcase the latest equipment and noteworthy new products. Additionally, many specialized seminars will be held to learn about the latest industry trends and future outlooks! It will be a two-day event filled with business tips and seeds for new proposals. We sincerely look forward to your visit. ■ Dates: October 15, 2026 (Thursday) 10:00-17:00 October 16, 2026 (Friday) 10:00-16:00 ■ Venue: Pacifico Yokohama, Hall C&D ■ Organized by: Nice Co., Ltd., Wood and Housing Research Association, and the Trustworthy Renovation Promotion Association ■ Official website: https://woodlivingfair.jp/ ■ Pre-registration: https://www.tenjikai-uketsuke.com/form/wood-living-expo-2026/ *Pre-registration is required for attendance. When registering, please select "R&D Center" as the Nice department.

In November 2025, the revised "Good Manufacturing Practice (GMP) for Medical Devices" in China will be announced, with implementation scheduled for November 2026. Local experts will provide a clear explanation of the key points for compliance. < Seminar Topics > - Overview of China's new GMP - Differences from ISO 13485:2016 - New requirements that require particularly careful measures - Anticipated inspection styles