10/26 Webinar "Silicon Chemicals; Complete Guide"

The depths of material innovation driving generative AI, data centers, and physical AI!

Power Semiconductor and Advanced Materials Technology Roadmap 2030 ~ The Deep Innovations in Materials Driving Generative AI, Data Centers, and Physical AI ~ 【Features of this Book】 - What is the ultimate technological strategy of "peripheral chemical materials" that maximizes device performance? - Unraveling the depths of materials supporting the power revolution in data centers and 1500V DC distribution! - Beyond SiC/GaN. A comprehensive view of semiconductor materials and implementation strategies looking towards 2030! - From material supply to co-creation value. Strategic indicators for material manufacturers to seize dominance! - A complete overview of power semiconductor peripheral materials overcoming thermal, reliability, and supply risks! - The underlying strength of chemistry supporting AI infrastructure, from PFAS regulations to next-generation bonding technologies! - Guiding the winning strategies for next-generation power devices through material informatics!

• Other semiconductors
• Technical and Reference Books

An easy-to-understand explanation of the latest trends in PFAS regulations, which are being strengthened globally!

PFAS Regulations and Their Impact on the Semiconductor Industry 【Features of This Book】 - Clearly explains the latest trends in the strengthening of PFAS regulations globally. - Systematically organizes the processes and roles of PFAS in semiconductor manufacturing. - Covers essential knowledge needed for regulatory compliance, including analysis and processing technologies. - Introduces trends and recent examples of non-PFAS alternative materials and technologies. - A useful resource for engineers in the research, development, manufacturing, and environmental sectors of the semiconductor industry.

• Other semiconductors
• Technical and Reference Books

A compass for the era of physical AI. Structuring everything from semiconductors to data centers!

The Semiconductor Industry in the Era of Physical AI A 2030 Hegemony Scenario Interpreted from the Perspective of Constraint Economics [Features of This Book] - Where is the true bottleneck of AI semiconductors? Unraveling the depths of physics and technology. - Beyond miniaturization lies the "Century of Implementation." A complete analysis of the next-generation semiconductor hegemony. - A compass for the era of Physical AI. Structuring everything from semiconductors to data centers. - Break through the constraints of power, heat, and materials. What are the conditions for victory in the next-generation semiconductor industry? - Why is silicon alone not enough? The new economic value created by physical constraints. - US-China rivalry and the supply chain. The "winning strategy" for Japan's semiconductor industry. - From CoWoS to next-generation implementation. A thorough dissection of the bottlenecks in the AI semiconductor supply chain. - A gift to the winners of 2030. An integrated strategy for Physical AI and semiconductor infrastructure. - The fusion of physical phenomena and AI. Here is the technology roadmap that redefines the industry. - The shock of the data center revolution. Comprehensive coverage of the economics of waste heat and the materials revolution.

• Other semiconductors
• Technical and Reference Books

2035 Strategy Interpreted from Implementation, Regulation, and Economic Security!

The Complete Guide to Low Dielectric Materials in the Semiconductor and AI Era ~ Deciphering the 2035 Strategy from Implementation, Regulation, and Economic Security ~ 【Features of this Book】 - Technological innovations and market changes of low dielectric materials supporting the era of over 224Gbps! - Supply chain restructuring and material strategies in the geopolitical era! - Future vision of advanced packaging driven by optoelectronic integration and glass core substrates! - Analyzing the 2035 electronic substrate materials market through a triple amplification model! - A multifaceted analysis of the competitive advantages of major material manufacturers! - Technical requirements for low dielectric materials supporting chiplets and 3D packaging! - Growth potential and investment value of the low dielectric materials market looking towards 2035!

• Other semiconductors
• Technical and Reference Books

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

Connectors exist in very large numbers in the world. It is very difficult for customers to find connectors that match their specific applications from among them. The "Product Finder" on the ODU website serves as a tool to help find the right connector products. You can search for the optimal connector from various approaches, such as matching it to your cable, electrical specifications, waterproofing, etc. The connectors you search for will provide information on electrical specifications, durability, and also CAD data. In the online seminar, we will introduce how easy and quick it is to search for connectors using the "Product Finder" in a live format. ------------ Date and Time: November 19, 2026 (Thursday) 14:00 - 14:35 Venue: Online (A URL for the venue will be sent via email after you register) Speakers: Miho Kato, Sales Department, Kamex ONE Co., Ltd. Masaru Kimura, Sales Manager, ODU Japan Co., Ltd. ------------

KAI Group will be exhibiting at the "Advanced Materials Technology Exhibition 2026" held at Tokyo Big Sight. This exhibition widely introduces advanced materials and technologies in the industrial sector, covering everything from materials to their processing. It provides an essential venue for business discussions that are crucial for the development of new technologies and products in advanced fields. We plan to showcase industrial blades, cutters, and scissors with exceptional sharpness, leveraging the technology we have cultivated through our razor products. We sincerely look forward to your visit.

We will be exhibiting products that have undergone surface treatment through thermal spraying. Specifically, we will showcase products that have been ceramic thermally sprayed on metal rolls and aluminum alloy products that have undergone hard surface treatment. We provide a comprehensive service for thermal spraying repairs of parts that have lost thickness due to wear, surface modification of metal components, and other related machining processes. Exhibition Dates: November 11 (Wednesday) to 13 (Friday), 2026 - 3 days Opening Hours: 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Hall 2

Kinoshita Corporation will exhibit at "N-Plus 2026," held at Tokyo Big Sight from November 11 (Wednesday) to 13 (Friday), as a member of the Japan Nonwoven Fabric Association's joint pavilion. In this exhibition, we will introduce a wide range of products, including the water-soluble and biodegradable nonwoven fabric "Haibios," themed "Returning to Paper," as well as the pulp nonwoven fabric "Kinari-to," which can be thermoformed. Additionally, we will have a mini sound absorption experience corner where you can actually test the differences in sound using our pulp-based sound-absorbing material "Otocell." We will showcase the various possibilities of our airlaid nonwoven fabrics through actual product displays and demonstrations. Please come and see our products and samples at the venue.

We will be exhibiting at the 46th Nano Testing Symposium (NANOTS2026) held at the Senri Life Science Center in Toyonaka City, Osaka Prefecture! Booth: Senri Room (6F) No. 28 We will be introducing our latest analytical technology services, so please stop by! We sincerely look forward to your visit.