Book "All About Semiconductor Packaging and Assembly Technology"

■ Title: "Changes in Joint Structures and Packaging Correspondence Due to the Evolution of Semiconductors - Response of Resin Sealing Technology to the Increase in the Number of Joint Locations and Narrow Spacing -" ――Organizing the core of joint design and sealing technology essential for the WLP and 3D assembly era. Covering failure mechanisms and countermeasures associated with high integration, providing insights directly related to development, evaluation, and mass production challenges. ■ Date and Time: May 15, 2026 (Friday) 13:00 - 16:30 ■ Zoom Streaming (with materials) 【Knowledge Gained from the Seminar】 - Development history and trends of semiconductor packaging - Changes in semiconductor joint structures and the current status of packaging technology - Evolution of semiconductor packaging and the development history, challenges, and countermeasures of resin sealing technology 【Target Audience for the Seminar】 - Stakeholders in the semiconductor-related fields (sales, technical positions, etc.) - Individuals interested in semiconductor manufacturing technology (front-end, back-end, etc.) - Those interested in the evolution of semiconductor packaging and the corresponding packaging technology - Individuals interested in semiconductor integration = bonding technology (Bumping Technology)

■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" ――As chipletization and 3D packaging advance in semiconductors, more sophisticated material design for encapsulants is required than ever before. This seminar will provide a detailed practical perspective on the latest trends in semiconductor packaging, covering raw material selection, design techniques, and reliability evaluation of encapsulants. ■Date and Time: April 17, 2026 (Friday) 13:30–16:30 ■Target Audience: Designers of semiconductor encapsulation materials, engineers using semiconductor encapsulation materials, designers of epoxy resins and hardeners for semiconductor encapsulation materials ■Knowledge Gained from the Seminar: - Trends in semiconductor packaging - Knowledge about raw materials for semiconductor encapsulation materials - Design techniques for semiconductor encapsulation materials and evaluation techniques for semiconductor encapsulation materials

A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. A leading expert thoroughly organizes practical perspectives from WLP/PLP to high thermal conductivity materials. ■ Title: Basic Information on Semiconductor Packaging Technology: Comprehensive Explanation ■ Date and Time: April 10, 2026 (Friday) 10:30 AM - 4:30 PM ■ Target Audience for the Seminar - Individuals involved in semiconductor packaging (sales, technology) - Those interested in semiconductor packaging technology - Those interested in semiconductor resin encapsulation and encapsulation materials ■ Knowledge Gained from the Seminar - Development history of semiconductor packaging (PKG) - Development history of semiconductor packaging technology (methods, materials) - Specifications of semiconductor encapsulation materials (raw materials, composition, manufacturing equipment, evaluation methods, etc.)