Book "All About Semiconductor Packaging and Assembly Technology"

■Title: "Silicon Chemicals Active in Everyday Life and Cutting-Edge Applications; Comprehensive Explanation - From Silicon to Silicone and Silica, Basics to Applications -" ――This seminar systematically explains silicon chemicals, covering raw materials, manufacturing methods, properties, and applications. It introduces a wide range of uses from everyday items such as hygiene products and cooking utensils to advanced fields like optics and semiconductors, focusing on silicon, silanes, silicones, and silica. 【Knowledge Gained from the Seminar】 - Basic knowledge of silicon chemicals (raw materials, manufacturing methods, properties) - Classification, manufacturing methods, and applications of silicon - Manufacturing methods and applications of inorganic and organic silanes - Classification, manufacturing methods, and applications of silicones - Manufacturing methods, types, particle sizes, and applications of silica - The role of silicon chemicals in optics and semiconductors 【Target Audience for the Seminar】 - Those interested in the manufacturing methods of silicon chemicals (from silicon to silica and silicone) - Those who want to acquire systematic technical information about silicon chemicals - Those interested in the application development of silicon chemicals from everyday use to cutting-edge technologies

■Title: "Manufacturing Process of Semiconductors (ICs) and Basic Information on Semiconductor Components" ~ Introduction: Semiconductor Manufacturing and Components - From Pre-Process to Implementation ~ This seminar systematically explains the overall picture of semiconductor manufacturing, from the IC manufacturing process to the implementation on circuit boards. Participants will learn about the flow of pre-process, post-process, and implementation processes, as well as the roles and necessities of the components used in each stage. Attendees will acquire basic information on semiconductor manufacturing and gain knowledge useful for the development of semiconductor components and the expansion of their own technologies. 【Knowledge Gained from the Seminar】 - Basic information on semiconductor manufacturing - Technical information on Japanese technologies active in the semiconductor field - Potential for expanding one's own technologies into the semiconductor field 【Target Audience for the Seminar】 - Individuals interested in basic technical information about semiconductor (IC) manufacturing - Individuals interested in the components used in IC manufacturing - Individuals interested in Japanese technologies (equipment, components) active in IC manufacturing

This seminar systematically explains the fundamentals of optical sensors and the latest application examples against the backdrop of the rapidly growing optical semiconductor sensor market. It provides clear explanations of the photoelectric effect, the basics of semiconductors, the characteristics of key devices such as PD, image sensors, SiPM, and SPAD, as well as design and selection points regarding wavelength, sensitivity, response speed, and noise. Furthermore, it introduces the latest implementation cases for applications such as LiDAR for autonomous driving, medical and healthcare devices, industrial equipment, and IoT/smart homes, allowing participants to learn about application strategies and market trends for commercialization. It targets a wide range of individuals, from product planning and business development to marketing, research and development, and design engineers, providing knowledge that can be applied to product development and business strategies starting tomorrow.

■Title "Changes in Joint Structures and Packaging Responses Due to the Evolution of Semiconductors ~ Response of Resin Sealing Technology to the Increase in the Number of Joints and Narrow Pitching ~" In semiconductor packages, which are advancing in high integration, high density, and three-dimensionality, addressing the increase in joints (bumps) and narrowing of pitches has become an important challenge. In this seminar, experienced instructors will organize the changes in joint structures accompanying the evolution of semiconductor packages and explain the latest trends, challenges, and countermeasures in resin sealing technology and mounting technology. 【Knowledge Gained from the Seminar】 - Development history and latest trends of semiconductor packaging - Changes in joint structures and packaging technology - Evaluation methods for resin sealing materials and sealing technology - Sealing technology for narrow pitch bumps and reliability improvement - Challenges and countermeasures in advanced packaging 【Target Audience】 Engineers, researchers, and sales representatives from semiconductor-related companies, as well as those involved in semiconductor manufacturing, mounting, sealing materials, and packaging technology.