8/5 Webinar: Semiconductor Packaging Technology Course

2035 Strategy Interpreted from Implementation, Regulation, and Economic Security!

The Complete Guide to Low Dielectric Materials in the Semiconductor and AI Era ~ Deciphering the 2035 Strategy from Implementation, Regulation, and Economic Security ~ 【Features of this Book】 - Technological innovations and market changes of low dielectric materials supporting the era of over 224Gbps! - Supply chain restructuring and material strategies in the geopolitical era! - Future vision of advanced packaging driven by optoelectronic integration and glass core substrates! - Analyzing the 2035 electronic substrate materials market through a triple amplification model! - A multifaceted analysis of the competitive advantages of major material manufacturers! - Technical requirements for low dielectric materials supporting chiplets and 3D packaging! - Growth potential and investment value of the low dielectric materials market looking towards 2035!

• Other semiconductors
• Technical and Reference Books

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books
• Technical and Reference Books

Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

The Future of Semiconductor Manufacturing Worldwide: The Cutting Edge of PFAS-Free Strategies and Next-Generation Alternative Technologies [Features of this Book] - Transforming regulatory risks into opportunities! Presenting trends in PFAS regulations in Europe, the United States, and Asia, along with pathways for restructuring the semiconductor supply chain! - Maintaining equipment performance is key! Evaluating the practicality of PFAS-free materials in equipment components! - A weapon for chemists! What are the performance and introduction benefits of next-generation cleaning and stripping surfactants like POE and APG? - Lessons learned from "Types and Cases of Failure Challenges in PFAS-Free Strategies" to prevent critical yield declines! - An overview of PFAS-free initiatives and specific implementation plans, from piping and temperature control to cleanroom utilities! - Comparative analysis of the risks of short-chain/partially fluorinated derivatives and the characteristics of complete alternative candidates like silicone-based (PDMS) materials! - Practical strategies for engineers! Specific methods and case studies for "process condition optimization" aimed at reducing PFAS dependency! [Structure] 1. PFAS-Free Strategies and Alternative Technologies in the Semiconductor Field 2. Failures and Challenges of PFAS-Free Strategies in the Semiconductor Field 3. PFAS Alternatives in Semiconductor Manufacturing Processes 4. PFAS Alternatives in Manufacturing Equipment and Infrastructure 5. Alternative Candidate Substances and Future Prospects

• Other semiconductors
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

[Speaker] CBRE, Inc. Research Senior Director, Mr. Arishi Iwama [Key Lecture Content] Due to the spread of cloud computing and AI, the supply and demand for data centers in the metropolitan area is tightening. There are numerous development plans for data centers, and it is expected that the market size in the metropolitan area will expand by approximately 3.3 times in the future. However, securing the necessary power for the establishment of data centers in the metropolitan area can take up to 10 years in some cases. As a result, securing power has become the biggest bottleneck in data center development. On the other hand, it is anticipated that the decentralization of data centers will progress in the future, supported by government policies and aimed at securing power. This lecture will explain the trends in the data center market, future outlook, and characteristics as an investment target. [Lecture Items] 1. Overview of the data center market in the metropolitan area 2. Outlook for data center power demand and measures to alleviate power supply and demand tightness 3. Overview and location conditions of data centers 4. Potential of AI data centers in regional decentralization 5. Data centers as an investment target 6. Q&A / Business card exchange

[Speaker] Hideo Hakomori, Chief Analyst, Equity Research Department, Daiwa Securities Co., Ltd. [Key Lecture Content] For Japan's automotive industry, which has expanded through globalization, global divisions such as U.S. tariffs and conflicts in the Middle East present headwinds. Additionally, responding to the rise of Chinese competitors is urgent, making it difficult to steer growth strategies. Nevertheless, a "once-in-a-century transformation" is occurring. The axis of competition has shifted from a "two-dimensional world map" to a "three-dimensional map with a time axis." Rather than Renault-Nissan, Nissan's collaboration with Honda seems inevitable despite various twists and turns. This lecture will explore this background while considering changes in the industry structure. In the U.S., rising gasoline prices are driving demand for HEVs and compact cars. This is a tailwind for Japanese manufacturers, but at the same time, demand for BEVs is expanding again in Europe and other regions. It is also important to confirm that BEVs are a growing market.

Nomura DS Corporation will participate in the "Oume Open Factory 2026" held in Oume City. The Oume Open Factory is a four-day limited "on-site experience event" where manufacturing companies in Oume City open their factories to the public. Our company plans to showcase CNC automatic lathes and factory tours, as well as the recently highlighted robot for post-processing efficiency, the "N-ROBO." The "N-ROBO" is a device that uses a small robot to prevent damage to workpieces processed (cut) by NC automatic lathes and conducts various inspections (overall length, outer diameter, inner diameter), serving as a labor-saving robot to address labor shortages. Since it is not often that one can experience seeing large machines and robots, we encourage you to take this opportunity to participate in the "Oume Open Factory 2026 at Nomura DS Corporation." We look forward to your visit. Our event will take place only on Friday, November 6th. Please come dressed in clothes that can get dirty. We have parking available, but if it is full, please use nearby coin parking.

F.I.T. Pacific Co., Ltd. will exhibit at the "Okayama Technology Exhibition (OTEX) 2026," which will be held locally from November 11 (Wednesday) to November 12 (Thursday), 2026, and online from October 30 (Friday), 2026, to December 18 (Friday), 2026, at Convex Okayama. At our booth, we will showcase heat-resistant and wear-resistant hoses. We sincerely look forward to your visit. 【Event Overview】 Name: Okayama Technology Exhibition (OTEX) 2026 Date: Local: November 11, 2026 (Wednesday) 10:00 AM - 5:00 PM November 12, 2026 (Thursday) 10:00 AM - 4:30 PM Online: October 30, 2026 (Friday) - December 18, 2026 (Friday) Venue: Convex Okayama Large, Medium, and Small Exhibition Halls Our Booth: Large Exhibition Hall, Booth Number: 114 Admission Fee: Free (registration on the official website is required) Organizer: Okayama Prefecture, Okayama Prefectural Industrial Promotion Foundation Official Website: https://www.optic.or.jp/otex/

F.I.T. Pacific Co., Ltd. will exhibit at "POWTEX(R)2026 (46th International Powder Technology Exhibition)" held at Tokyo Big Sight from November 25 (Wednesday) to November 27 (Friday), 2026. At our booth, we will showcase heat-resistant and wear-resistant hoses. We sincerely look forward to your visit. 【Event Overview】 Name: POWTEX(R)2026 (46th International Powder Technology Exhibition) Date: On-site: November 25 (Wednesday) to November 27 (Friday), 2026, 9:30 AM to 5:00 PM Venue: Tokyo Big Sight, Halls 1, 2, and 3 Our Booth: 3-T65 Admission Fee: Free (Pre-registration required) *Admission is allowed for high school students and above. Middle school students and below are not permitted. Organizer: Japan Powder Technology Association Official Website: https://www.powtex.com/tokyo/