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  4. 8/5 Webinar: Semiconductor Packaging Technology Course
SEMINAR_EVENT NEW
  • Jul 14, 2026
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Jul 14, 2026

8/5 Webinar: Semiconductor Packaging Technology Course

CMC RESEARCH Ltd. CMC RESEARCH Ltd.
■Title "Changes in Joint Structures and Packaging Responses Due to the Evolution of Semiconductors ~ Response of Resin Sealing Technology to the Increase in the Number of Joints and Narrow Pitching ~" In semiconductor packages, which are advancing in high integration, high density, and three-dimensionality, addressing the increase in joints (bumps) and narrowing of pitches has become an important challenge. In this seminar, experienced instructors will organize the changes in joint structures accompanying the evolution of semiconductor packages and explain the latest trends, challenges, and countermeasures in resin sealing technology and mounting technology. 【Knowledge Gained from the Seminar】 - Development history and latest trends of semiconductor packaging - Changes in joint structures and packaging technology - Evaluation methods for resin sealing materials and sealing technology - Sealing technology for narrow pitch bumps and reliability improvement - Challenges and countermeasures in advanced packaging 【Target Audience】 Engineers, researchers, and sales representatives from semiconductor-related companies, as well as those involved in semiconductor manufacturing, mounting, sealing materials, and packaging technology.
Date and time Wednesday, Aug 05, 2026
Capital
Entry fee Charge Tuition fee: 44,000 yen (tax included) *Includes materials *For our newsletter members (registration is free) 39,600 yen (tax included) ★【Newsletter Member Benefit】 If two or more people apply at the same time and all applicants are newsletter members (registration is free), the participation fee per person will be half of the newsletter member price.
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Research Report "Comprehensive Guide to Low Dielectric Materials in the Semiconductor and AI Era"

2035 Strategy Interpreted from Implementation, Regulation, and Economic Security!

The Complete Guide to Low Dielectric Materials in the Semiconductor and AI Era ~ Deciphering the 2035 Strategy from Implementation, Regulation, and Economic Security ~ 【Features of this Book】 - Technological innovations and market changes of low dielectric materials supporting the era of over 224Gbps! - Supply chain restructuring and material strategies in the geopolitical era! - Future vision of advanced packaging driven by optoelectronic integration and glass core substrates! - Analyzing the 2035 electronic substrate materials market through a triple amplification model! - A multifaceted analysis of the competitive advantages of major material manufacturers! - Technical requirements for low dielectric materials supporting chiplets and 3D packaging! - Growth potential and investment value of the low dielectric materials market looking towards 2035!

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Book "Latest Trends in Semiconductor Packaging Technology and Design/Evaluation of Semiconductor Encapsulation Materials"

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

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Survey Report "The Future of Semiconductor Manufacturing Worldwide: PFAS-Free Strategy and"

Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

The Future of Semiconductor Manufacturing Worldwide: The Cutting Edge of PFAS-Free Strategies and Next-Generation Alternative Technologies [Features of this Book] - Transforming regulatory risks into opportunities! Presenting trends in PFAS regulations in Europe, the United States, and Asia, along with pathways for restructuring the semiconductor supply chain! - Maintaining equipment performance is key! Evaluating the practicality of PFAS-free materials in equipment components! - A weapon for chemists! What are the performance and introduction benefits of next-generation cleaning and stripping surfactants like POE and APG? - Lessons learned from "Types and Cases of Failure Challenges in PFAS-Free Strategies" to prevent critical yield declines! - An overview of PFAS-free initiatives and specific implementation plans, from piping and temperature control to cleanroom utilities! - Comparative analysis of the risks of short-chain/partially fluorinated derivatives and the characteristics of complete alternative candidates like silicone-based (PDMS) materials! - Practical strategies for engineers! Specific methods and case studies for "process condition optimization" aimed at reducing PFAS dependency! [Structure] 1. PFAS-Free Strategies and Alternative Technologies in the Semiconductor Field 2. Failures and Challenges of PFAS-Free Strategies in the Semiconductor Field 3. PFAS Alternatives in Semiconductor Manufacturing Processes 4. PFAS Alternatives in Manufacturing Equipment and Infrastructure 5. Alternative Candidate Substances and Future Prospects

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Book "All About Semiconductor Packaging and Assembly Technology"

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

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Drug Discovery Support System StarDrop - Introduction to the High-Performance Metabolism Prediction Module

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Evaluating drug efficacy, safety, pharmacokinetics, and physical properties comprehensively from the early stages of the drug discovery process is essential for efficient pharmaceutical development. To support these evaluations comprehensively, the drug discovery support software StarDrop offers various modules. In this presentation, we will introduce an overview of the functions included in the metabolism prediction module, the Metabolism module, its theoretical background, and how it contributes to solving various challenges related to drug metabolism.

Jul 15, 2026

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[Seminar] Tokyo Electric Power Group's DX Strategy

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Jul 14, 2026

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[Seminar] AI and Cybersecurity Legal Practices for the Manufacturing Industry

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[Seminar] System Revision and Practical Response for Agricultural Solar Power Generation (Solar Sharing)

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Jul 14, 2026

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