Survey Report "The Future of Semiconductor Manufacturing Worldwide: PFAS-Free Strategy and"

■Title "Fundamentals and Applications of Non-Fluorinated Water-Repellent and Oil-Repellent Coatings, Development Trends" This seminar provides a systematic learning experience about non-fluorinated water-repellent and oil-repellent coating technologies, which are gaining attention against the backdrop of strengthened PFAS regulations. It covers the fundamental theories of water-repellent and oil-repellent phenomena, the concept of surface energy, the characteristics of fluorinated coatings, and the latest trends in PFAS regulations. Additionally, it introduces the characteristics, technological trends, and application examples of non-fluorinated materials such as silicone-based, urethane-based, polyolefin-based, and hybrid systems, organizing the merits and challenges of each. This content is beneficial for engineers and planners involved in the consideration of PFAS alternative technologies and product development. ■Event Details Date and Time: July 8, 2026 (Wednesday) 13:30 - 16:30 Instructor: Mr. Nakahira Hirayama (Director of Hirayama Engineering Office) Participation Fee: 44,000 yen (tax included) *Price for our newsletter members (registration free): 39,600 yen (tax included) Delivery Format: Live streaming via Zoom

■Title "Fundamentals of Backend Processes, Packaging, and Design in Semiconductor Manufacturing" This seminar offers a systematic learning experience about backend processes and packaging technologies that support the high performance and functionality of semiconductors, covering everything from the basics to the latest trends. Experienced instructors will clearly explain the history of semiconductor package evolution, various package types, packaging processes, encapsulation technologies, and evaluation and analysis techniques. Additionally, the latest trends in advanced packaging technologies such as 2.5D/3D packaging, CoWoS, chiplets, hybrid bonding, and optoelectronic integration technologies that support the AI era will also be introduced. This content is recommended for engineers and researchers in fields such as chemistry, electronic components, and the automotive industry who wish to learn semiconductor packaging technology from the ground up. ■Event Details Date and Time: July 3, 2026 (Friday) 13:30–16:30 Instructor: Yosuke Hirumuta (Hirumuta Engineering Office, Quality and Technology Consultant) Participation Fee: 44,000 yen (tax included) Newsletter Member Price: 39,600 yen (tax included) Delivery Format: Live streaming via Zoom

■ Title: "Changes in Joint Structures and Packaging Correspondence Due to the Evolution of Semiconductors - Response of Resin Sealing Technology to the Increase in the Number of Joint Locations and Narrow Spacing -" ――Organizing the core of joint design and sealing technology essential for the WLP and 3D assembly era. Covering failure mechanisms and countermeasures associated with high integration, providing insights directly related to development, evaluation, and mass production challenges. ■ Date and Time: May 15, 2026 (Friday) 13:00 - 16:30 ■ Zoom Streaming (with materials) 【Knowledge Gained from the Seminar】 - Development history and trends of semiconductor packaging - Changes in semiconductor joint structures and the current status of packaging technology - Evolution of semiconductor packaging and the development history, challenges, and countermeasures of resin sealing technology 【Target Audience for the Seminar】 - Stakeholders in the semiconductor-related fields (sales, technical positions, etc.) - Individuals interested in semiconductor manufacturing technology (front-end, back-end, etc.) - Those interested in the evolution of semiconductor packaging and the corresponding packaging technology - Individuals interested in semiconductor integration = bonding technology (Bumping Technology)

■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" ――As chipletization and 3D packaging advance in semiconductors, more sophisticated material design for encapsulants is required than ever before. This seminar will provide a detailed practical perspective on the latest trends in semiconductor packaging, covering raw material selection, design techniques, and reliability evaluation of encapsulants. ■Date and Time: April 17, 2026 (Friday) 13:30–16:30 ■Target Audience: Designers of semiconductor encapsulation materials, engineers using semiconductor encapsulation materials, designers of epoxy resins and hardeners for semiconductor encapsulation materials ■Knowledge Gained from the Seminar: - Trends in semiconductor packaging - Knowledge about raw materials for semiconductor encapsulation materials - Design techniques for semiconductor encapsulation materials and evaluation techniques for semiconductor encapsulation materials