Survey Report "The Future of Semiconductor Manufacturing Worldwide: PFAS-Free Strategy and"

■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors

■Title: "Manufacturing Process of Semiconductors (ICs) and Basic Information on Semiconductor Components" ~ Introduction: Semiconductor Manufacturing and Components - From Pre-Process to Implementation ~ This seminar systematically explains the overall picture of semiconductor manufacturing, from the IC manufacturing process to the implementation on circuit boards. Participants will learn about the flow of pre-process, post-process, and implementation processes, as well as the roles and necessities of the components used in each stage. Attendees will acquire basic information on semiconductor manufacturing and gain knowledge useful for the development of semiconductor components and the expansion of their own technologies. 【Knowledge Gained from the Seminar】 - Basic information on semiconductor manufacturing - Technical information on Japanese technologies active in the semiconductor field - Potential for expanding one's own technologies into the semiconductor field 【Target Audience for the Seminar】 - Individuals interested in basic technical information about semiconductor (IC) manufacturing - Individuals interested in the components used in IC manufacturing - Individuals interested in Japanese technologies (equipment, components) active in IC manufacturing

■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" --- This seminar systematically explains encapsulation materials that correspond to evolving semiconductor packages such as chiplets and 3D packages, covering everything from raw materials like epoxy resins, hardeners, and additives to design and evaluation. It will also introduce technological trends for next-generation encapsulation materials, including low dielectric, high thermal conductivity, and optoelectronic integration. 【Knowledge Gained from the Seminar】 - Types of semiconductor packages and the latest trends - Characteristics of wire bond, flip chip, wafer level, and advanced packages - Molding methods such as transfer and compression molding - Raw materials like epoxy resins, hardeners, and inorganic fillers - Required properties of encapsulation materials and material design techniques - Design for heat resistance, moisture resistance, and low stress - Evaluation techniques for moisture absorption reflow, heat cycles, and high temperature/high humidity - Next-generation encapsulation materials for low dielectric, high thermal conductivity, and optoelectronic integration 【Target Audience for the Seminar】 - Engineers involved in the design and use of semiconductor encapsulation materials - Designers of epoxy resins and hardeners for semiconductor encapsulation materials - Individuals interested in semiconductor packages and encapsulation materials

■Title "Changes in Joint Structures and Packaging Responses Due to the Evolution of Semiconductors ~ Response of Resin Sealing Technology to the Increase in the Number of Joints and Narrow Pitching ~" In semiconductor packages, which are advancing in high integration, high density, and three-dimensionality, addressing the increase in joints (bumps) and narrowing of pitches has become an important challenge. In this seminar, experienced instructors will organize the changes in joint structures accompanying the evolution of semiconductor packages and explain the latest trends, challenges, and countermeasures in resin sealing technology and mounting technology. 【Knowledge Gained from the Seminar】 - Development history and latest trends of semiconductor packaging - Changes in joint structures and packaging technology - Evaluation methods for resin sealing materials and sealing technology - Sealing technology for narrow pitch bumps and reliability improvement - Challenges and countermeasures in advanced packaging 【Target Audience】 Engineers, researchers, and sales representatives from semiconductor-related companies, as well as those involved in semiconductor manufacturing, mounting, sealing materials, and packaging technology.