September 29 Webinar "Semiconductor Packaging and Encapsulation Technology"

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books

The depths of material innovation driving generative AI, data centers, and physical AI!

Power Semiconductor and Advanced Materials Technology Roadmap 2030 ~ The Deep Innovations in Materials Driving Generative AI, Data Centers, and Physical AI ~ 【Features of this Book】 - What is the ultimate technological strategy of "peripheral chemical materials" that maximizes device performance? - Unraveling the depths of materials supporting the power revolution in data centers and 1500V DC distribution! - Beyond SiC/GaN. A comprehensive view of semiconductor materials and implementation strategies looking towards 2030! - From material supply to co-creation value. Strategic indicators for material manufacturers to seize dominance! - A complete overview of power semiconductor peripheral materials overcoming thermal, reliability, and supply risks! - The underlying strength of chemistry supporting AI infrastructure, from PFAS regulations to next-generation bonding technologies! - Guiding the winning strategies for next-generation power devices through material informatics!

• Other semiconductors
• Technical and Reference Books

An easy-to-understand explanation of the latest trends in PFAS regulations, which are being strengthened globally!

PFAS Regulations and Their Impact on the Semiconductor Industry 【Features of This Book】 - Clearly explains the latest trends in the strengthening of PFAS regulations globally. - Systematically organizes the processes and roles of PFAS in semiconductor manufacturing. - Covers essential knowledge needed for regulatory compliance, including analysis and processing technologies. - Introduces trends and recent examples of non-PFAS alternative materials and technologies. - A useful resource for engineers in the research, development, manufacturing, and environmental sectors of the semiconductor industry.

• Other semiconductors
• Technical and Reference Books

A compass for the era of physical AI. Structuring everything from semiconductors to data centers!

The Semiconductor Industry in the Era of Physical AI A 2030 Hegemony Scenario Interpreted from the Perspective of Constraint Economics [Features of This Book] - Where is the true bottleneck of AI semiconductors? Unraveling the depths of physics and technology. - Beyond miniaturization lies the "Century of Implementation." A complete analysis of the next-generation semiconductor hegemony. - A compass for the era of Physical AI. Structuring everything from semiconductors to data centers. - Break through the constraints of power, heat, and materials. What are the conditions for victory in the next-generation semiconductor industry? - Why is silicon alone not enough? The new economic value created by physical constraints. - US-China rivalry and the supply chain. The "winning strategy" for Japan's semiconductor industry. - From CoWoS to next-generation implementation. A thorough dissection of the bottlenecks in the AI semiconductor supply chain. - A gift to the winners of 2030. An integrated strategy for Physical AI and semiconductor infrastructure. - The fusion of physical phenomena and AI. Here is the technology roadmap that redefines the industry. - The shock of the data center revolution. Comprehensive coverage of the economics of waste heat and the materials revolution.

• Other semiconductors
• Technical and Reference Books

2035 Strategy Interpreted from Implementation, Regulation, and Economic Security!

The Complete Guide to Low Dielectric Materials in the Semiconductor and AI Era ~ Deciphering the 2035 Strategy from Implementation, Regulation, and Economic Security ~ 【Features of this Book】 - Technological innovations and market changes of low dielectric materials supporting the era of over 224Gbps! - Supply chain restructuring and material strategies in the geopolitical era! - Future vision of advanced packaging driven by optoelectronic integration and glass core substrates! - Analyzing the 2035 electronic substrate materials market through a triple amplification model! - A multifaceted analysis of the competitive advantages of major material manufacturers! - Technical requirements for low dielectric materials supporting chiplets and 3D packaging! - Growth potential and investment value of the low dielectric materials market looking towards 2035!

• Other semiconductors
• Technical and Reference Books

Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

The Future of Semiconductor Manufacturing Worldwide: The Cutting Edge of PFAS-Free Strategies and Next-Generation Alternative Technologies [Features of this Book] - Transforming regulatory risks into opportunities! Presenting trends in PFAS regulations in Europe, the United States, and Asia, along with pathways for restructuring the semiconductor supply chain! - Maintaining equipment performance is key! Evaluating the practicality of PFAS-free materials in equipment components! - A weapon for chemists! What are the performance and introduction benefits of next-generation cleaning and stripping surfactants like POE and APG? - Lessons learned from "Types and Cases of Failure Challenges in PFAS-Free Strategies" to prevent critical yield declines! - An overview of PFAS-free initiatives and specific implementation plans, from piping and temperature control to cleanroom utilities! - Comparative analysis of the risks of short-chain/partially fluorinated derivatives and the characteristics of complete alternative candidates like silicone-based (PDMS) materials! - Practical strategies for engineers! Specific methods and case studies for "process condition optimization" aimed at reducing PFAS dependency! [Structure] 1. PFAS-Free Strategies and Alternative Technologies in the Semiconductor Field 2. Failures and Challenges of PFAS-Free Strategies in the Semiconductor Field 3. PFAS Alternatives in Semiconductor Manufacturing Processes 4. PFAS Alternatives in Manufacturing Equipment and Infrastructure 5. Alternative Candidate Substances and Future Prospects

• Other semiconductors
• Technical and Reference Books

Yamamoto Vinitar Co., Ltd. will be exhibiting at the "Frozen, Retort, and Instant Food Material Technology Exhibition" held at "Pacifico Yokohama Exhibition Hall C." Concurrently, the "2nd Nutritional Food Material Exhibition (a B to B food material exhibition focused on health and nutrition)" and the "9th P&B Japan" (a retail, baking, and confectionery exhibition) will also take place. At our booth, we will showcase a demonstration of the 'Range Type' high-frequency thawing device, along with a panel display of high-frequency thawing devices (small batch type; processing capacity of 60kg to 170kg/h, medium batch type; processing capacity of 200kg to 500kg/h, medium to large continuous type; processing capacity of 200kg to 4000kg/h) and provide a consultation desk for high-frequency and microwave heating. If you have any concerns regarding heating, drying, thawing, sterilization, secondary heating sterilization, or pest control using high-frequency/microwave technology, please visit us. [Main Examples of Thawing and Heating Processes] - Heating and drying for confectionery and baking, tempering and melting of butter, thawing of meat, pork, chicken, canned fish, squid, octopus, etc., secondary sterilization of prepared foods, and more. We look forward to your visit. [Exhibited Equipment] ■ High-frequency thawing device 　・ Range type

We will be exhibiting at Semicon Japan 2024, which will be held at Tokyo Big Sight from December 11 (Wednesday) to December 12 (Friday). If you are interested, please come to the venue. ■ Products to be exhibited 1. Spectral interference optical thickness sensor CHRocodile 2 DW/ 2IT 2. Area scanner for measuring the thickness and shape of 12" wafers - Flying Spot Scanner (FSS) 3. Chromatic aberration confocal optical line sensor CLS2.0 4. Chromatic aberration confocal line camera CVC 5. Chromatic aberration confocal optical single-point sensor CHRocodile Mini 6. Non-contact thickness measurement sensor for opaque materials Enovasnese 7. Sensor for detecting internal defects non-contactly - Field sensor

Do you have any of these concerns? "I want to ensure proper dispersion, but bubbles won't escape and there are inconsistencies." "It takes too long to degas using vacuum or manual methods, and the process has become reliant on specific individuals." "When mixing at high speeds, it generates heat, causing the materials to deteriorate or harden." "I want to quickly prototype and evaluate new materials or produce small quantities of various items easily." In this seminar, we will provide not only the fundamental information about Awatori Nentaro but also the latest updates. During the live demonstration, we will clearly explain how actual materials mix and the operation screen of the Shinky temperature management solution app. Additionally, we will have equipment and optional products on display in the venue, allowing you to consult while viewing the actual items. In the seminar, you will learn about: - The mixing mechanism and examples of Awatori Nentaro - Stirring methods and heat generation countermeasures according to material viscosity - The latest automation models and syringe filling technology After the seminar, we will hold an open consultation session at the venue for anyone interested. Please register early!

Hakkou Co., Ltd. will be exhibiting at the 3rd Kyushu Semiconductor Industry Exhibition. At this exhibition, we will showcase our gas-compatible hoses for cooling lines utilizing our lamination technology. We will also be offering technical consultations on the day, so please stop by our booth.

Hakkou Co., Ltd. will exhibit at the 2026 Medical Creation Fukushima. At the exhibition, we will showcase our series of laminated thin tubes with an inner diameter of φ0.8 to 3 or less, utilizing our unique lamination technology for the first time. We will also hold a consultation session for custom-made products, so if you have any issues with hoses or tubes, please feel free to consult with us. We look forward to your visit.