Book "Latest Trends in Semiconductor Packaging Technology and Design/Evaluation of Semiconductor Encapsulation Materials"

This seminar systematically explains the fundamentals of optical sensors and the latest application examples against the backdrop of the rapidly growing optical semiconductor sensor market. It provides clear explanations of the photoelectric effect, the basics of semiconductors, the characteristics of key devices such as PD, image sensors, SiPM, and SPAD, as well as design and selection points regarding wavelength, sensitivity, response speed, and noise. Furthermore, it introduces the latest implementation cases for applications such as LiDAR for autonomous driving, medical and healthcare devices, industrial equipment, and IoT/smart homes, allowing participants to learn about application strategies and market trends for commercialization. It targets a wide range of individuals, from product planning and business development to marketing, research and development, and design engineers, providing knowledge that can be applied to product development and business strategies starting tomorrow.

■Title "Changes in Joint Structures and Packaging Responses Due to the Evolution of Semiconductors ~ Response of Resin Sealing Technology to the Increase in the Number of Joints and Narrow Pitching ~" In semiconductor packages, which are advancing in high integration, high density, and three-dimensionality, addressing the increase in joints (bumps) and narrowing of pitches has become an important challenge. In this seminar, experienced instructors will organize the changes in joint structures accompanying the evolution of semiconductor packages and explain the latest trends, challenges, and countermeasures in resin sealing technology and mounting technology. 【Knowledge Gained from the Seminar】 - Development history and latest trends of semiconductor packaging - Changes in joint structures and packaging technology - Evaluation methods for resin sealing materials and sealing technology - Sealing technology for narrow pitch bumps and reliability improvement - Challenges and countermeasures in advanced packaging 【Target Audience】 Engineers, researchers, and sales representatives from semiconductor-related companies, as well as those involved in semiconductor manufacturing, mounting, sealing materials, and packaging technology.

■Title "Fundamentals of Backend Processes, Packaging, and Design in Semiconductor Manufacturing" This seminar offers a systematic learning experience about backend processes and packaging technologies that support the high performance and functionality of semiconductors, covering everything from the basics to the latest trends. Experienced instructors will clearly explain the history of semiconductor package evolution, various package types, packaging processes, encapsulation technologies, and evaluation and analysis techniques. Additionally, the latest trends in advanced packaging technologies such as 2.5D/3D packaging, CoWoS, chiplets, hybrid bonding, and optoelectronic integration technologies that support the AI era will also be introduced. This content is recommended for engineers and researchers in fields such as chemistry, electronic components, and the automotive industry who wish to learn semiconductor packaging technology from the ground up. ■Event Details Date and Time: July 3, 2026 (Friday) 13:30–16:30 Instructor: Yosuke Hirumuta (Hirumuta Engineering Office, Quality and Technology Consultant) Participation Fee: 44,000 yen (tax included) Newsletter Member Price: 39,600 yen (tax included) Delivery Format: Live streaming via Zoom

Title: "Fundamentals of Semiconductor Packaging Technology ~ From the Evolution of Package Types to Manufacturing Processes, Equipment and Materials Used, and Latest Trends ~" This is an introductory seminar where you can systematically learn about semiconductor packaging technology from the basics to advanced techniques. It provides a clear explanation of the role of packaging technology that supports the high performance of semiconductors, its background of evolution, manufacturing processes, and materials and equipment technologies. In addition to the characteristics of various package types such as DIP, QFP, BGA, and WLCSP, it also details major manufacturing technologies like back grinding, dicing, die bonding, wire bonding, and molding. Furthermore, you will learn about the trends and future prospects of the latest technologies such as SiP, FOWLP, CoWoS, EMIB, chiplets, and optoelectronic integrated packaging. This content is ideal for semiconductor engineers as well as sales and marketing personnel who want to understand packaging technology from the ground up.