Web Seminar on "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials" on April 17

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books
• Technical and Reference Books

Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

The Future of Semiconductor Manufacturing Worldwide: The Cutting Edge of PFAS-Free Strategies and Next-Generation Alternative Technologies [Features of this Book] - Transforming regulatory risks into opportunities! Presenting trends in PFAS regulations in Europe, the United States, and Asia, along with pathways for restructuring the semiconductor supply chain! - Maintaining equipment performance is key! Evaluating the practicality of PFAS-free materials in equipment components! - A weapon for chemists! What are the performance and introduction benefits of next-generation cleaning and stripping surfactants like POE and APG? - Lessons learned from "Types and Cases of Failure Challenges in PFAS-Free Strategies" to prevent critical yield declines! - An overview of PFAS-free initiatives and specific implementation plans, from piping and temperature control to cleanroom utilities! - Comparative analysis of the risks of short-chain/partially fluorinated derivatives and the characteristics of complete alternative candidates like silicone-based (PDMS) materials! - Practical strategies for engineers! Specific methods and case studies for "process condition optimization" aimed at reducing PFAS dependency! [Structure] 1. PFAS-Free Strategies and Alternative Technologies in the Semiconductor Field 2. Failures and Challenges of PFAS-Free Strategies in the Semiconductor Field 3. PFAS Alternatives in Semiconductor Manufacturing Processes 4. PFAS Alternatives in Manufacturing Equipment and Infrastructure 5. Alternative Candidate Substances and Future Prospects

• Other semiconductors
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!

【Features of this Book】 - Characteristics required for glass substrates for semiconductor packages and trends in the development of glass interposers! - Advantages and disadvantages of backside power supply technologies from the three major semiconductor manufacturers, their business strategies, and mass production timelines? - Business strategies of foundries, EMS, fabless companies, OSAT, and semiconductor manufacturing equipment-related companies! - Characteristics and applications of 2D and 3D implementations using chiplets for heterogeneous integration! - Material properties required for 2.5D and 3D packages! Including redistribution layers, encapsulants, underfills, etc.! - Types of manufacturing processes for FOWLP/PLP, related companies, and requirements for package component mounting! - Intensifying global competition for HBM market share and the business opportunities for Japanese companies that accompany it! - Performance and technology trends required for underfills, market forecasts, and company-specific shares explored! - Design and quality requirement levels to accommodate chipletization in the manufacturing of copper-plated wiring! 【Table of Contents Structure】 Part I: Introduction to Chiplets Part II: Advanced Packaging Technologies Part III: Technologies, Materials, and Equipment for Chiplet Packaging *For a detailed table of contents, please refer to the related link URL.

• Other semiconductors
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

The "New Technology Creation Exchange 2026" is finally approaching! At B-Core, we will showcase our uniquely developed black-and-white code, the "BE-AR Marker." It can read many codes at once. On the day of the event, you will be able to see a demonstration of bulk reading multiple BE-AR Markers with a camera. We also welcome inquiries about various applications such as goods and inventory management, identification of equipment and objects, and AR markers, with questions like "Can it be used this way?" Please come and see the actual reading at the venue. We look forward to your visit. ◆BE-AR Marker 　https://bear.b-core.net

[Speaker] Mr. Daishi Konoe, Partner Lawyer at KKM Law Office [Key Lecture Content] In recent years, due to fluctuations in the economic situation, wage increases and labor shortages have become serious issues, making it urgent for companies to figure out how to effectively utilize their existing workforce as a survival strategy. However, it cannot be denied that employees who are mismatched with the company and those who cannot fully demonstrate their abilities are lowering the operational efficiency of the business. While companies are required to implement improvement measures and build human resources aimed at placing the right people in the right positions, they may also be faced with the need to make tough decisions regarding employees. However, while companies may harbor dissatisfaction with mismatched employees, employees also have their own grievances against the company, leading to potential conflicts arising from each response made by the company. In this lecture, the speaker will discuss the responsibilities of the company regarding mismatched employees, methods for resolution, and the associated risks, focusing on four scenarios where issues are likely to arise, and will provide a wealth of case law to illustrate the nuanced examination of difficult cases.

In this seminar, we will introduce the potential of the AI agent "Tsunagi AI Powered by Dify," which connects the entire business. You will experience a realistic image of its application through examples of how we have automated our operations! ☆ Date ☆ November 1, 2026 (Sunday) to November 30, 2026 (Tuesday) 　　https://www.nttd-bb.com/event/smn20261101ai.html?utm_source=ipros&utm_medium=other&utm_campaign=20261015_sales ☆ Venue ☆ Online seminar, free of charge ☆ Seminar Content ☆ 　By using AI agents, we can achieve 　【cross-organizational business automation】 that goes beyond individual efficiency! 　This video will introduce the potential of the AI agent "Tsunagi AI Powered by Dify," which connects the entire business. You will experience a realistic image of its application through examples of how we have automated our operations! <Target Audience> 　・Those interested in cross-organizational business automation using AI 　・Those interested in AI and AI agents

This autumn, Advantech Toyo will exhibit at the 11th Drink Japan, where the latest technologies related to beverage and food manufacturing will gather. At our booth, we will introduce filtration and analysis solutions that contribute to solving various challenges in raw materials, manufacturing processes, and quality control, including activated carbon cartridge filters for PFAS removal. We will showcase a variety of products that will be useful for beverage manufacturers, food manufacturers, and those in charge of research and development and quality control, so please take this opportunity to visit us! Additionally, on the final day of the event, we will hold a seminar for exhibitors. We invite you to stop by our booth and also participate in the exhibitor seminar!

Advantech Toyo will introduce the new product "PFAS Removal Cartridge Filter High Flow Type" at the Drink Japan Exhibitor Seminar. As the need to address PFAS (per- and polyfluoroalkyl substances) increases, our product development team will provide a detailed explanation of the high flow type PFAS removal solution that can be utilized in manufacturing settings. In this presentation, we will discuss actual evaluation cases, the PFAS removal performance of activated carbon filters, the impact of TOC components on removal performance, and the effects of pretreatment on filter lifespan. Additionally, we will cover the high flow type designed for large volume processing and share filter technologies aimed at improving the efficiency of the filtration process in beverage manufacturing. Participants in the seminar will receive an original novelty item inspired by pH test paper rolls. If you are considering measures against PFAS or have challenges related to water treatment in beverage and food manufacturing processes, please feel free to join us!