Web Seminar on "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials" on April 17

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books

Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

The Future of Semiconductor Manufacturing Worldwide: The Cutting Edge of PFAS-Free Strategies and Next-Generation Alternative Technologies [Features of this Book] - Transforming regulatory risks into opportunities! Presenting trends in PFAS regulations in Europe, the United States, and Asia, along with pathways for restructuring the semiconductor supply chain! - Maintaining equipment performance is key! Evaluating the practicality of PFAS-free materials in equipment components! - A weapon for chemists! What are the performance and introduction benefits of next-generation cleaning and stripping surfactants like POE and APG? - Lessons learned from "Types and Cases of Failure Challenges in PFAS-Free Strategies" to prevent critical yield declines! - An overview of PFAS-free initiatives and specific implementation plans, from piping and temperature control to cleanroom utilities! - Comparative analysis of the risks of short-chain/partially fluorinated derivatives and the characteristics of complete alternative candidates like silicone-based (PDMS) materials! - Practical strategies for engineers! Specific methods and case studies for "process condition optimization" aimed at reducing PFAS dependency! [Structure] 1. PFAS-Free Strategies and Alternative Technologies in the Semiconductor Field 2. Failures and Challenges of PFAS-Free Strategies in the Semiconductor Field 3. PFAS Alternatives in Semiconductor Manufacturing Processes 4. PFAS Alternatives in Manufacturing Equipment and Infrastructure 5. Alternative Candidate Substances and Future Prospects

• Other semiconductors
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!

【Features of this Book】 - Characteristics required for glass substrates for semiconductor packages and trends in the development of glass interposers! - Advantages and disadvantages of backside power supply technologies from the three major semiconductor manufacturers, their business strategies, and mass production timelines? - Business strategies of foundries, EMS, fabless companies, OSAT, and semiconductor manufacturing equipment-related companies! - Characteristics and applications of 2D and 3D implementations using chiplets for heterogeneous integration! - Material properties required for 2.5D and 3D packages! Including redistribution layers, encapsulants, underfills, etc.! - Types of manufacturing processes for FOWLP/PLP, related companies, and requirements for package component mounting! - Intensifying global competition for HBM market share and the business opportunities for Japanese companies that accompany it! - Performance and technology trends required for underfills, market forecasts, and company-specific shares explored! - Design and quality requirement levels to accommodate chipletization in the manufacturing of copper-plated wiring! 【Table of Contents Structure】 Part I: Introduction to Chiplets Part II: Advanced Packaging Technologies Part III: Technologies, Materials, and Equipment for Chiplet Packaging *For a detailed table of contents, please refer to the related link URL.

• Other semiconductors
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Eplan, the comprehensive electrical design CAD used by customers worldwide. We will hold a real event called "EPLAN Operation Experience Session," where you can actually experience operating EPLAN. In the morning session, we will explain the overview of EPLAN, and in the afternoon session, you will have the opportunity to operate the actual equipment and gain hands-on experience. You can participate in just one of the seminars, or you can join both and experience EPLAN in one day. You can experience the operation and features of EPLAN P8 and Pro Panel at three locations: the EPLAN Shin-Yokohama office, the Osaka office, and the Osaka office. Participation is free! Please come and check out the feel of operating Eplan.

[Lecture Topics] 1. Regarding the SIP Phase 3 "Construction of a Smart Mobility Platform" Masaki Yahata, Policy Researcher, Cabinet Office, Office for Promotion of Science and Technology Innovation (in charge of Social System Infrastructure) 2. Initiatives by the Ministry of Internal Affairs and Communications on Communication Infrastructure Supporting Autonomous Driving Society Yudai Matsuo, Section Chief, Mobile Communications Division, Radio Department, Telecommunications Bureau, Ministry of Internal Affairs and Communications 3. NTT's Initiatives on Autonomous Driving and Smart Mobility Minako Tsumenaga, Executive Officer, Research and Development Marketing Headquarters, Alliance Division, NTT Corporation / Director, NTT Mobility Corporation 4. Toyota's Efforts Towards Zero Traffic Accidents Mitsuo Shida, Chief, Advanced Safety Systems Reform Department, Toyota Motor Corporation

[Lecture Topics] 1. Introduction to the "Mobility Roadmap 2026" Seiji Muto, Senior Advisor to the Director-General, Mobility Division, National Services Group, Digital Agency 2. Regional Transportation DX for Resolving "Transportation Gaps" Akihiro Watanabe, Deputy Director of the Mobility Services Promotion Division, Ministry of Land, Infrastructure, Transport and Tourism 3. Nissan's Efforts Towards the Practical Implementation of Mobility Services Yoshirou Takamatsu, Senior Researcher, Mobility Society & AI Research Institute, Nissan Motor Co., Ltd. 4. Challenges and Measures for the Social Implementation of Autonomous Driving Yuki Inoue, LPL for Autonomous Driving Business Planning, Honda Motor Co., Ltd. 5. Waymo's Initiatives: The Cutting Edge of Fully Autonomous Driving Commercialization Mika Yamamoto, Head of Policy & Government Affairs, Japan and Asia-Pacific, Waymo

[Instructor] Representative of Digital Infrastructure Consulting LLC (DIRC) President of Regenerative Infrastructure Inc. (R11i) Mr. Takashi Furuta [Key Lecture Content] The data center market, which has continued to grow based on the internet and cloud, is expected to see a further explosive increase in demand due to the extensive use of computational resources that constitute generative AI. Meanwhile, in the Japanese market, foreign funds and global operators are leading development, while Japanese companies face challenges such as revenue opportunities, business continuity through exit strategies, reduced flexibility due to early securing of power, constraints of grid electricity, soaring construction costs, and coexistence with local communities. This lecture will organize these structural challenges and explore integrated location strategies for power, communication, and computational resources in the AI era, conditions for regional dispersion to areas like Hokkaido and Kyushu, and the business strategies that Japanese players should adopt.

[Speaker] Technical Advisor Shikenoh Furuno, Japan Automobile Parts Industry Association [Key Lecture Content] In February 2026, the U.S. and Israel attacked Iran, effectively closing the Strait of Hormuz, which led to skyrocketing prices of crude oil, naphtha, and other petroleum products, severely impacting the global economy. While renewable energy (renewables) is becoming more widespread, the reality of the energy crisis has highlighted the world's continued heavy reliance on crude oil. This has prompted a reevaluation of the value of BEVs, revealing distinct regional differences in the market. While Europe, Japan, and Southeast Asia are experiencing growth, the U.S. continues to see a contraction. In China, REEVs are also on the rise, and the movement towards a hydrogen society utilizing surplus renewable energy is accelerating. Moreover, with the evolution of AI and SoC, the value of cars is shifting from hardware to software, and the development of SDVs and autonomous driving is rapidly advancing. However, there are also concerns about being technology-driven. This lecture will organize these changes and provide an outlook on the future mobility society, including energy considerations.