Web Seminar on "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials" on April 17

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books

Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

The Future of Semiconductor Manufacturing Worldwide: The Cutting Edge of PFAS-Free Strategies and Next-Generation Alternative Technologies [Features of this Book] - Transforming regulatory risks into opportunities! Presenting trends in PFAS regulations in Europe, the United States, and Asia, along with pathways for restructuring the semiconductor supply chain! - Maintaining equipment performance is key! Evaluating the practicality of PFAS-free materials in equipment components! - A weapon for chemists! What are the performance and introduction benefits of next-generation cleaning and stripping surfactants like POE and APG? - Lessons learned from "Types and Cases of Failure Challenges in PFAS-Free Strategies" to prevent critical yield declines! - An overview of PFAS-free initiatives and specific implementation plans, from piping and temperature control to cleanroom utilities! - Comparative analysis of the risks of short-chain/partially fluorinated derivatives and the characteristics of complete alternative candidates like silicone-based (PDMS) materials! - Practical strategies for engineers! Specific methods and case studies for "process condition optimization" aimed at reducing PFAS dependency! [Structure] 1. PFAS-Free Strategies and Alternative Technologies in the Semiconductor Field 2. Failures and Challenges of PFAS-Free Strategies in the Semiconductor Field 3. PFAS Alternatives in Semiconductor Manufacturing Processes 4. PFAS Alternatives in Manufacturing Equipment and Infrastructure 5. Alternative Candidate Substances and Future Prospects

• Other semiconductors
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!

【Features of this Book】 - Characteristics required for glass substrates for semiconductor packages and trends in the development of glass interposers! - Advantages and disadvantages of backside power supply technologies from the three major semiconductor manufacturers, their business strategies, and mass production timelines? - Business strategies of foundries, EMS, fabless companies, OSAT, and semiconductor manufacturing equipment-related companies! - Characteristics and applications of 2D and 3D implementations using chiplets for heterogeneous integration! - Material properties required for 2.5D and 3D packages! Including redistribution layers, encapsulants, underfills, etc.! - Types of manufacturing processes for FOWLP/PLP, related companies, and requirements for package component mounting! - Intensifying global competition for HBM market share and the business opportunities for Japanese companies that accompany it! - Performance and technology trends required for underfills, market forecasts, and company-specific shares explored! - Design and quality requirement levels to accommodate chipletization in the manufacturing of copper-plated wiring! 【Table of Contents Structure】 Part I: Introduction to Chiplets Part II: Advanced Packaging Technologies Part III: Technologies, Materials, and Equipment for Chiplet Packaging *For a detailed table of contents, please refer to the related link URL.

• Other semiconductors
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

We will be exhibiting at TECHNO×FRONTIER 2025 - the 40th Power System Exhibition. Please be sure to visit our booth. Our booth: West Hall 4, NO. 4-B25 Organizer: Japan Management Association https://www.jma.or.jp/tf/outline/power.html

Even engineers can achieve this. Patent research transformed by AI search × BI! In daily patent research, many face challenges such as: "I don't know how to create search queries or what appropriate keywords to use..." "There are too many results to read, and I can't get around to analyzing them..." "In the end, I end up relying on the IP department or specific experts..." These issues lead to prolonged research times and delayed decisions... However, it is precisely because they have the deepest technical understanding that patent research conducted by "on-site engineers" is considered important. In this seminar, we will explain the entire process from research and analysis to research and development and strategic planning using PatentSQUARE, in a practical format from the engineer's perspective. We will first break through the "entrance to research" with AI search and resolve the "inability to analyze" bottleneck with the IP BI dashboard, achieving a seamless process without relying on other tools. ≪Recommended for≫ ● Those in research and development or technical departments ● Those considering new technology themes ● Those who want to improve research efficiency If you want to learn "research that leads to decision-making" rather than just ending with searches, please feel free to join us.

In the increasingly complex product development landscape, the importance of physical modeling and model-based development is rising, driven by factors such as carbon neutrality, electrification, advanced energy systems, and the efficiency of control development. This seminar will focus on the Modelica-compatible multiphysics simulation environment "Dymola," introducing practical technical information and user cases related to thermal and fluid system modeling, energy systems, control, electrification, building equipment, and model integration via FMI. This free online seminar is recommended for those who want to learn about the latest trends in Dymola/Modelica/FMI and those looking to utilize MBD in design, control development, and system evaluation. Date and Time: Thursday, July 30, 2026, 13:00 - 17:00 Format: Microsoft Teams Webinar Participation Fee: Free / Pre-registration required Organizer: Neolium Technology Co., Ltd. Sponsor: Dassault Systèmes Co., Ltd.

Even engineers can do this. Patent research transformed by AI search × BI! In daily patent research, many face issues such as: "I don't know how to create search queries or what appropriate keywords to use..." "There are too many results to read, and I can't manage to analyze them..." "In the end, I rely on the IP department or specific experts..." These problems lead to prolonged research times and delayed decision-making... However, it is precisely because they have the deepest technical understanding that patent research conducted by "on-site engineers" is considered important. In this seminar, we will explain the entire process from research and analysis to research and development and strategic planning using PatentSQUARE, in a practical format from the engineer's perspective. We will first break through the "entrance to research" with AI search, eliminate the "analysis bottleneck" with the IP BI dashboard, and achieve a seamless process without relying on other tools. ≪Recommended for≫ ● Those in research and development or technical departments ● Those considering new technology themes ● Those who want to improve research efficiency If you want to learn "research that leads to decision-making" rather than just searching, please feel free to join us. * The session on September 2 (Wednesday) will be an archive of the event held on August 27 (Thursday).

We are utilizing Jess in the presentation paper. We will hold an online seminar featuring a presentation by Kiyoka Deguchi, Lecturer at the Institute of Intractable Diseases, Graduate School of Science and Technology, Tokyo University of Science. The latest data will be presented on research that elucidates the response to enterovirus A71 using an intestinal microphysiological system cultured with human ES/iPS cells on a microfluidic device. Related paper on the lecture content: *Modeling human enterovirus A71 infection using an intestinal microphysiological system