7/2 Basic Course on Semiconductor Packaging Technology WEB Seminar

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

The particle visualization technology developed under our brand "ViEST" has a very high level of detection sensitivity, capable of visualizing the suspended or adhered states of micro and nano-sized particles in real time. We are engaged in the sale of visualization systems and contract services for evaluation (investigating particles and airflow in production processes, inside and outside manufacturing equipment, evaluating the performance of cleaning products, proposing yield improvement measures, etc.) both domestically and internationally. In manufacturing environments, invisible fine foreign substances, dust generation, particle adhesion due to static electricity, and airflow disturbances can cause quality defects and reduced yield. Our company clarifies these contamination factors through visualization technology and provides consistent support from identifying the source of the problem to considering and confirming improvement measures. Do you have any of the following concerns? - Unable to identify the cause of foreign matter contamination - Want to check airflow and cleanliness in clean rooms - Want to understand dust generation from manufacturing equipment and transport systems - Want to reduce particle adhesion to films and substrates - Want to improve contamination that leads to reduced yield

[Lecturers] KPMG Consulting Co., Ltd. Executive Officer, Partner Kazushige Ikeda KPMG Consulting Co., Ltd. Technology Consulting Senior Consultant Kakeru Ota [Key Lecture Content] In recent years, AI has evolved beyond information processing in digital spaces, such as text generation and image recognition, to become Physical AI that perceives, judges, and acts in the real world by connecting with sensors, robots, vehicles, industrial equipment, and more. Physical AI is increasingly important across a wide range of fields, including manufacturing, as it addresses industrial challenges such as labor shortages, skill transfer, replacement of hazardous work, and productivity improvement. Additionally, foundational models, semiconductors, sensors, actuators, and robotics-related technologies that support Physical AI are becoming increasingly significant from the perspective of economic security, particularly in terms of responding to supply chain risks and securing and managing critical technologies. This lecture will organize the basic concepts and key technologies of Physical AI, discuss its potential applications in manufacturing and industrial sectors, outline practical considerations for implementation and operation, and explain the actions that companies should take moving forward.

[Instructor] Nobuyuki Oonaka, CEO of Bridge Inc., Project Designer [Key Lecture Content] "Why do new businesses often come to a halt?" The cause may not be a lack of ideas or talent. Through supporting over 300 new businesses and business developments, I have learned that what separates success from failure is "the structure of the organization"—specifically, how decisions are made, how dialogue occurs, and how assumptions are shared. In this seminar, based on the book "How to Create Self-Driving New Businesses" (Shoei-sha), we will analyze the "communication problems" that cause new businesses to stop as a structure. The goal is to develop a common language within the organization to identify "where we are stuck and what actions we should take." I will share how to use the "self-driving map" in practical terms.

In this seminar, we will focus on the challenges of sensitivity reduction and separation performance in GC/MS analysis, and introduce the latest technologies and practical know-how that can help solve these issues. This time, we will also have a presentation from LECO Japan, who will discuss the benefits and applications of high-resolution and high-separation analysis with real examples. Additionally, Restek will introduce column technologies effective for improving sensitivity in trace analysis. Restek: We will explain the inert performance of the RMX GC column, which is effective for improving sensitivity in trace analysis, and the column technology that suppresses adsorption loss in low concentration areas, along with actual measurement data. LECO: We will present the latest application examples of comprehensive detection of trace components using high-sensitivity GC-TOFMS and RMX columns, including environmental, aroma, and material analysis. This content is recommended for anyone involved in multi-component analysis using GC/MS, whether for target or non-target analysis, as well as those who are just starting out. We will provide clear explanations suitable for beginners in GC/MS, so please join us.

[Speaker] Hidetaka Ishibashi, Director of IoT Planning Department, KDDI Corporation [Key Lecture Content] Against the backdrop of declining birth rates, an aging population, and labor shortages, the nature of mobility is reaching a significant turning point. KDDI has established a "Mobility Control Center" to integratively support new mobility solutions such as autonomous vehicles, drones, and robots, based on the knowledge and infrastructure cultivated through the operation of connected cars. In this lecture, we will focus on the communication and monitoring functions that are essential for the social implementation of each mobility solution, discussing the challenges and efforts towards their resolution, as well as the future vision that KDDI aims for. [Lecture Items] 1. Efforts and history of connected cars 2. Development and initiatives for new mobility 3. Importance of remote monitoring in a mobility society 4. Challenges in communication and monitoring and efforts towards solutions 5. Future vision of the mobility society that KDDI aims for 6. Q&A