5/15 Webinar "Changes in Joint Structures and Packaging Solutions Due to the Evolution of Semiconductors"

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books

Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

The Future of Semiconductor Manufacturing Worldwide: The Cutting Edge of PFAS-Free Strategies and Next-Generation Alternative Technologies [Features of this Book] - Transforming regulatory risks into opportunities! Presenting trends in PFAS regulations in Europe, the United States, and Asia, along with pathways for restructuring the semiconductor supply chain! - Maintaining equipment performance is key! Evaluating the practicality of PFAS-free materials in equipment components! - A weapon for chemists! What are the performance and introduction benefits of next-generation cleaning and stripping surfactants like POE and APG? - Lessons learned from "Types and Cases of Failure Challenges in PFAS-Free Strategies" to prevent critical yield declines! - An overview of PFAS-free initiatives and specific implementation plans, from piping and temperature control to cleanroom utilities! - Comparative analysis of the risks of short-chain/partially fluorinated derivatives and the characteristics of complete alternative candidates like silicone-based (PDMS) materials! - Practical strategies for engineers! Specific methods and case studies for "process condition optimization" aimed at reducing PFAS dependency! [Structure] 1. PFAS-Free Strategies and Alternative Technologies in the Semiconductor Field 2. Failures and Challenges of PFAS-Free Strategies in the Semiconductor Field 3. PFAS Alternatives in Semiconductor Manufacturing Processes 4. PFAS Alternatives in Manufacturing Equipment and Infrastructure 5. Alternative Candidate Substances and Future Prospects

• Other semiconductors
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

In this event, we will quickly understand the latest features of Creo 13 and introduce specific tips that will lead to the efficiency of design and development tasks. Veteran engineers from Creo will take the stage to clearly explain the enhanced and evolved points in Creo 13 and how they will bring about changes in the design and development process. In addition to the seminar, we are also planning a Creo hands-on experience session, which will be held for the first time in a while, where you can experience the evolution of Creo by actually operating some of the AI features and the latest design functions. Recommended for: - Those in design and development departments currently using or considering Creo. Please take this opportunity to register early.

We will provide not only the basic content of Awatori Rentaro but also the latest information. Additionally, in the "Legal Voluntary Inspection and Basic Maintenance Course," you will have the opportunity to experience basic maintenance such as round belt replacement and legal voluntary inspections (regular voluntary inspections). The capacity for each seminar varies, so please apply early! 【Content】 - Understand the mixing mechanism and examples of Awatori Rentaro - Introduction of the latest automation models, cooling gadgets, and syringe filling technology - Round belt replacement experience is popular! Maintenance training - Individual consultation sessions will be held at the venue! You can also observe actual machines at the Shinki headquarters lab.

Sensirion AG will be exhibiting at the "Automotive Technology Exhibition 2026 Nagoya" held at Tokyo Big Sight from June 17 (Wednesday) to June 19 (Friday). At this exhibition, we will introduce our sensor solutions for automotive applications. We will also showcase measurement demonstrations and new products that will be unveiled for the first time at the exhibition, providing an opportunity for you to directly experience the performance and technological excellence of our products. We look forward to your visit. ■ Venue: Aichi Sky Expo (Aichi Prefectural International Exhibition Center) ■ Booth No.: 199 ■ Exhibits: SWS4A: Direct water detection sensor for ADAS measurement demo SPS6x, STC42A: Battery thermal runaway detection sensor measurement demo SAEN6x: Integrated combo module for HVAC measurement demo SACD4: Refrigerant (propane) leak detection sensor module measurement demo SAAF4: Window fog detection sensor module measurement demo Various physical samples All of our staff are sincerely looking forward to your visit.

[Speaker] Yuzo Yamaguchi, Director, Mineral Division, Manufacturing Industries Bureau, Ministry of Economy, Trade and Industry [Key Lecture Content] I will explain the current situation regarding important minerals such as rare earths, which are essential for industrial activities, and the efforts being made to ensure stable supply. [Lecture Items] 1. Ensuring stable supply of important minerals such as rare earths 2. Q&A / Business card exchange

We would like to inform you that our company will be exhibiting at the 12th Liver and Diabetes/Metabolism Research Conference.