5/15 Webinar "Changes in Joint Structures and Packaging Solutions Due to the Evolution of Semiconductors"

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books

Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

The Future of Semiconductor Manufacturing Worldwide: The Cutting Edge of PFAS-Free Strategies and Next-Generation Alternative Technologies [Features of this Book] - Transforming regulatory risks into opportunities! Presenting trends in PFAS regulations in Europe, the United States, and Asia, along with pathways for restructuring the semiconductor supply chain! - Maintaining equipment performance is key! Evaluating the practicality of PFAS-free materials in equipment components! - A weapon for chemists! What are the performance and introduction benefits of next-generation cleaning and stripping surfactants like POE and APG? - Lessons learned from "Types and Cases of Failure Challenges in PFAS-Free Strategies" to prevent critical yield declines! - An overview of PFAS-free initiatives and specific implementation plans, from piping and temperature control to cleanroom utilities! - Comparative analysis of the risks of short-chain/partially fluorinated derivatives and the characteristics of complete alternative candidates like silicone-based (PDMS) materials! - Practical strategies for engineers! Specific methods and case studies for "process condition optimization" aimed at reducing PFAS dependency! [Structure] 1. PFAS-Free Strategies and Alternative Technologies in the Semiconductor Field 2. Failures and Challenges of PFAS-Free Strategies in the Semiconductor Field 3. PFAS Alternatives in Semiconductor Manufacturing Processes 4. PFAS Alternatives in Manufacturing Equipment and Infrastructure 5. Alternative Candidate Substances and Future Prospects

• Other semiconductors
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

Yamawa Manufacturing Co., Ltd. will exhibit at "JIMTOF 2026, the 33rd Japan International Machine Tool Fair," which will be held at Tokyo Big Sight from October 26 (Monday) to October 31 (Saturday), 2026. We will be showcasing two new products from our highly acclaimed ultimate professional tool "Z-PRO," optimized for machining! Don’t miss this opportunity to visit our booth. 【Highlights】 We will display two new products from the "Z-PRO" brand. We have prepared many short videos to solve tapping troubles! We will thoroughly explain examples of failures and successes in tapping. Live demonstrations using the precision tapping machine 'TTTsystem' will be available.

[Speaker] Masanori Hayashi Evangelist, NTT Docomo Business, Inc. Visiting Researcher, GLOCOM, International University [Key Lecture Content] The application areas of AI are expanding from generative AI to AI agents and physical AI, while the main battlefield of AI infrastructure is shifting from learning-centric to inference-centric. Against the backdrop of rapidly growing AI demand, investments and entries into AI data centers by various businesses are accelerating. However, new challenges are emerging, such as increasing power and cooling demands, responses to data sovereignty, and the utilization of GX strategy regional systems for data center aggregation. This lecture will overview the latest trends in the AI data center market and investment trends, as well as organize technological innovations such as GPUs, liquid cooling, and all-optical networks, along with policy and institutional trends and industrial challenges. Furthermore, it will envision the future of a decentralized AI infrastructure that connects AI factories, data centers, and the edge, and discuss new industrial foundations and future competitive axes through watt-bit collaboration.

[Speaker] Ren Taro Hayashi, Senior Manager, Environmental, Energy, and Resource Strategy Group, Research and Consulting Division, Japan Research Institute, Ltd. [Lecture Items] 1. Overview of Data Centers 2. Impact of Data Centers on the Power Industry 3. Policy Trends in Data Centers and Power (1) GX2040 Vision (2) Watt-Bit Collaborative Public-Private Discussion (3) GX Industry Location Working Group (4) Japan Growth Strategy 4. Future Approaches to Power Procurement for Data Center Development 5. Q&A / Business Card Exchange

This year, we will be holding the large exhibition "Wood and Living Expo" organized by Nice! Approximately 150 domestic housing and building material manufacturers will gather to showcase the latest equipment and noteworthy new products. Additionally, many specialized seminars will be held to learn about the latest industry trends and future outlooks! It will be a two-day event filled with business tips and seeds for new proposals. We sincerely look forward to your visit. ■ Dates: October 15, 2026 (Thursday) 10:00-17:00 October 16, 2026 (Friday) 10:00-16:00 ■ Venue: Pacifico Yokohama, Hall C&D ■ Organized by: Nice Co., Ltd., Wood and Housing Research Association, and the Trustworthy Renovation Promotion Association ■ Official website: https://woodlivingfair.jp/ ■ Pre-registration: https://www.tenjikai-uketsuke.com/form/wood-living-expo-2026/ *Pre-registration is required for attendance. When registering, please select "R&D Center" as the Nice department.

In November 2025, the revised "Good Manufacturing Practice (GMP) for Medical Devices" in China will be announced, with implementation scheduled for November 2026. Local experts will provide a clear explanation of the key points for compliance. < Seminar Topics > - Overview of China's new GMP - Differences from ISO 13485:2016 - New requirements that require particularly careful measures - Anticipated inspection styles