5/15 Webinar "Changes in Joint Structures and Packaging Solutions Due to the Evolution of Semiconductors"

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books

Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

The Future of Semiconductor Manufacturing Worldwide: The Cutting Edge of PFAS-Free Strategies and Next-Generation Alternative Technologies [Features of this Book] - Transforming regulatory risks into opportunities! Presenting trends in PFAS regulations in Europe, the United States, and Asia, along with pathways for restructuring the semiconductor supply chain! - Maintaining equipment performance is key! Evaluating the practicality of PFAS-free materials in equipment components! - A weapon for chemists! What are the performance and introduction benefits of next-generation cleaning and stripping surfactants like POE and APG? - Lessons learned from "Types and Cases of Failure Challenges in PFAS-Free Strategies" to prevent critical yield declines! - An overview of PFAS-free initiatives and specific implementation plans, from piping and temperature control to cleanroom utilities! - Comparative analysis of the risks of short-chain/partially fluorinated derivatives and the characteristics of complete alternative candidates like silicone-based (PDMS) materials! - Practical strategies for engineers! Specific methods and case studies for "process condition optimization" aimed at reducing PFAS dependency! [Structure] 1. PFAS-Free Strategies and Alternative Technologies in the Semiconductor Field 2. Failures and Challenges of PFAS-Free Strategies in the Semiconductor Field 3. PFAS Alternatives in Semiconductor Manufacturing Processes 4. PFAS Alternatives in Manufacturing Equipment and Infrastructure 5. Alternative Candidate Substances and Future Prospects

• Other semiconductors
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

This is a training webinar that introduces the entire process from sample and reagent preparation to measurement initiation and data analysis using actual data. It is aimed at those considering the use of simple Western or those who wish to review the operation.

The "International Fermentation and Brewing Food Industry Exhibition" is Japan's only specialized exhibition that brings together ingredients, materials, research equipment, manufacturing facilities, testing equipment, and packaged products related to fermentation and brewing. In 2013, "Washoku" (Japanese cuisine) and in 2024, "Traditional Sake Brewing" were registered as UNESCO Intangible Cultural Heritage, increasing interest in Japan's fermentation and brewing industry. This exhibition will be grandly held at Tokyo Big Sight as a platform to promote the development of the industry and the richness of food culture to the world, and to spread Japan's proud fermented and brewed foods.

Tanaka Import Group Co., Ltd. will be exhibiting at the 'JIMTOF2026 33rd Japan International Machine Tool Fair' held at Tokyo Big Sight. This exhibition is a comprehensive showcase of manufacturing, where machine tools and their peripheral equipment gather in one place, and it is one of the largest international technology shows in the world, featuring advanced technologies and products from around the globe. We plan to display a variety of products, including drill grinding machines and tube skimmers. When you visit, please be sure to stop by our booth.

We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!

Sakurai Graphic Systems Co., Ltd. will be exhibiting at the "5th Nepcon Japan [Autumn] - Electronics Development and Implementation Exhibition -" to be held in September 2026. We warmly welcome those who would like to "just hear about it first!" We sincerely look forward to your visit. *Details such as exhibition content and booth number will be added and updated as they are finalized. ★Registration for Visitor Badges★ Advance registration (free) is required. Click the "Details & Application Button" below!