7/3 Webinar on Backend Processes, Assembly, and Design in Semiconductor Manufacturing

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books
• Technical and Reference Books

Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

The Future of Semiconductor Manufacturing Worldwide: The Cutting Edge of PFAS-Free Strategies and Next-Generation Alternative Technologies [Features of this Book] - Transforming regulatory risks into opportunities! Presenting trends in PFAS regulations in Europe, the United States, and Asia, along with pathways for restructuring the semiconductor supply chain! - Maintaining equipment performance is key! Evaluating the practicality of PFAS-free materials in equipment components! - A weapon for chemists! What are the performance and introduction benefits of next-generation cleaning and stripping surfactants like POE and APG? - Lessons learned from "Types and Cases of Failure Challenges in PFAS-Free Strategies" to prevent critical yield declines! - An overview of PFAS-free initiatives and specific implementation plans, from piping and temperature control to cleanroom utilities! - Comparative analysis of the risks of short-chain/partially fluorinated derivatives and the characteristics of complete alternative candidates like silicone-based (PDMS) materials! - Practical strategies for engineers! Specific methods and case studies for "process condition optimization" aimed at reducing PFAS dependency! [Structure] 1. PFAS-Free Strategies and Alternative Technologies in the Semiconductor Field 2. Failures and Challenges of PFAS-Free Strategies in the Semiconductor Field 3. PFAS Alternatives in Semiconductor Manufacturing Processes 4. PFAS Alternatives in Manufacturing Equipment and Infrastructure 5. Alternative Candidate Substances and Future Prospects

• Other semiconductors
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

Connectors exist in very large numbers in the world. It is very difficult for customers to find connectors that match their specific applications from among them. The "Product Finder" on the ODU website serves as a tool to help find the right connector products. You can search for the optimal connector from various approaches, such as matching it to your cable, electrical specifications, waterproofing, etc. The connectors you search for will provide information on electrical specifications, durability, and also CAD data. In the online seminar, we will introduce how easy and quick it is to search for connectors using the "Product Finder" in a live format. ------------ Date and Time: November 19, 2026 (Thursday) 14:00 - 14:35 Venue: Online (A URL for the venue will be sent via email after you register) Speakers: Miho Kato, Sales Department, Kamex ONE Co., Ltd. Masaru Kimura, Sales Manager, ODU Japan Co., Ltd. ------------

KAI Group will be exhibiting at the "Advanced Materials Technology Exhibition 2026" held at Tokyo Big Sight. This exhibition widely introduces advanced materials and technologies in the industrial sector, covering everything from materials to their processing. It provides an essential venue for business discussions that are crucial for the development of new technologies and products in advanced fields. We plan to showcase industrial blades, cutters, and scissors with exceptional sharpness, leveraging the technology we have cultivated through our razor products. We sincerely look forward to your visit.

We will be exhibiting products that have undergone surface treatment through thermal spraying. Specifically, we will showcase products that have been ceramic thermally sprayed on metal rolls and aluminum alloy products that have undergone hard surface treatment. We provide a comprehensive service for thermal spraying repairs of parts that have lost thickness due to wear, surface modification of metal components, and other related machining processes. Exhibition Dates: November 11 (Wednesday) to 13 (Friday), 2026 - 3 days Opening Hours: 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Hall 2

Kinoshita Corporation will exhibit at "N-Plus 2026," held at Tokyo Big Sight from November 11 (Wednesday) to 13 (Friday), as a member of the Japan Nonwoven Fabric Association's joint pavilion. In this exhibition, we will introduce a wide range of products, including the water-soluble and biodegradable nonwoven fabric "Haibios," themed "Returning to Paper," as well as the pulp nonwoven fabric "Kinari-to," which can be thermoformed. Additionally, we will have a mini sound absorption experience corner where you can actually test the differences in sound using our pulp-based sound-absorbing material "Otocell." We will showcase the various possibilities of our airlaid nonwoven fabrics through actual product displays and demonstrations. Please come and see our products and samples at the venue.

We will be exhibiting at the 46th Nano Testing Symposium (NANOTS2026) held at the Senri Life Science Center in Toyonaka City, Osaka Prefecture! Booth: Senri Room (6F) No. 28 We will be introducing our latest analytical technology services, so please stop by! We sincerely look forward to your visit.