List of Semiconductors and ICs products
- classification：Semiconductors and ICs
3946～3960 item / All 4812 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Plastic containers (Placon) that can be used in clean rooms - can be produced in small quantities.
- Wafer
- Memory
- Transistor
Clip Bonder - Die bonder for power semiconductors, chip and clip bonding, with optional appearance inspection and NG product punching unit support.
- Soldering Equipment
- Other semiconductors
VCO voltage-controlled oscillator circuit's FSK electro
- Other semiconductors
If you have any inquiries about stainless steel processing or sheet metal processing, please consult our company!
- Contract manufacturing
- Other electronic parts
- Other semiconductors
Non-contact chuck of the vertical gas jet method at the Solar Research Institute.
- Wafer
- Pneumatic Equipment
- Other machine elements
Fluxless solder die bonding (wire solder) for power semiconductors. Multi-chip mounting support available as an option!
- Soldering Equipment
- Other semiconductors
Tanzaku frame double-sided adhesive, compatible with both epoxy and DAF, suitable for fast-drying paste.
- Soldering Equipment
- Other semiconductors
Dai-bonder for tanzaku frames, compatible with both eutectic and epoxy, can also be used for both. Supports small chips (□0.15mm and above) and provides stable operation!
- Soldering Equipment
- Other semiconductors
Die bond for hoop frames, compatible with both eutectic and epoxy (dual-use specification available), supports small chips (from 0.15mm) and provides stable operation!
- Soldering Equipment
- Other semiconductors
In the electronic component mounting metal mask industry, we want to 'always be a pioneer.'
- Other electronic parts
- Other semiconductors
- Circuit Board Inspection Equipment