List of Semiconductors and ICs products
- classification：Semiconductors and ICs
706～720 item / All 4809 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Looking for the appropriate PD. An explanation of the types of photodiodes and their structural characteristics!
- diode
Pin fin heat sink, width 40mm, height 20mm, length 40mm, material: Al99.5.
- Other semiconductors
Square pin fin heat sink, width 50mm, height 25mm, length 50mm, material: Al99.5.
- Other semiconductors
Achieve automation of IC packaging with space-saving design! Inspection equipment capable of high-precision 2D and 3D dimensional measurement.
- Microcomputer
New CVS analysis device "894 Professional CVS" for measuring organic additives in copper sulfate plating baths and tin/lead baths.
- Analytical Equipment and Devices
- Plating Equipment
- Wafer
"894 Professional CVS Analyzer" capable of multi-sample continuous automatic analysis by combining a sample changer and an electric burette.
- Analytical Equipment and Devices
- Plating Equipment
- Wafer
Custom formulations for important applications
- Other semiconductors
- Other medical supplies and cosmetic manufacturing materials
FFKM solutions designed for harsh operating conditions.
- Other semiconductors
For heat dissipation of surface mount packages such as DPAK, D2PAK, and SO-8. Our compact design reliably solves thermal issues in power converters and power supply boards.
- Other semiconductors
We conducted a cleaning evaluation using samples created under conditions that are likely to leave residues intentionally!
- Other semiconductors
A page on "Cleaning evaluation of organic residue remaining after sintering" has been added.
In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean solder bonding technology, sintering bonding is fundamentally designed to be "no-clean." However, the currently mainstream sintering bonding methods are conducted under high temperature and high pressure conditions, which can lead to the generation and adhesion of residues during the bonding process, potentially affecting subsequent processes and long-term reliability. Cleaning is one proposed solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. Detailed content of the technical column can be viewed through the related link.
From margin design that protects by looking at temperature to confident design that attacks by looking at heat flow.
- Dedicated IC
Designed for a wavelength range of 760 to 2900 nm with an accuracy of ±10 nm.
- Other semiconductors
QCL optimal for high-precision gas detection using TDLAS.
- Other semiconductors
