List of Semiconductors and ICs products
- classification：Semiconductors and ICs
946～960 item / All 4691 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
★ 2x Front Removable Storage Module ★ High-speed PCIe transfer from host to module ★ Ruggedized support
- Microcomputer
3U VPX rugged environment storage products 480GB to 8TB data capacity
- Microcomputer
Aluminum extruded heat sink with a width of 30 mm and a height of 7.5 mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 29 mm and a height of 25 mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 29 mm and a height of 11.5 mm - available in various lengths.
- Other semiconductors
We will comprehensively respond to our customers' needs, from consulting on requirements specifications to chip replacement!
- Other semiconductors
FPGA capable of high-speed and real-time processing.
- Other semiconductors
A thorough explanation of semiconductor packaging from the basics to applications!
- Other semiconductors
- others
- Technical and Reference Books
5/15 Webinar "Changes in Joint Structures and Packaging Solutions Due to the Evolution of Semiconductors"
■ Title: "Changes in Joint Structures and Packaging Correspondence Due to the Evolution of Semiconductors - Response of Resin Sealing Technology to the Increase in the Number of Joint Locations and Narrow Spacing -" ――Organizing the core of joint design and sealing technology essential for the WLP and 3D assembly era. Covering failure mechanisms and countermeasures associated with high integration, providing insights directly related to development, evaluation, and mass production challenges. ■ Date and Time: May 15, 2026 (Friday) 13:00 - 16:30 ■ Zoom Streaming (with materials) 【Knowledge Gained from the Seminar】 - Development history and trends of semiconductor packaging - Changes in semiconductor joint structures and the current status of packaging technology - Evolution of semiconductor packaging and the development history, challenges, and countermeasures of resin sealing technology 【Target Audience for the Seminar】 - Stakeholders in the semiconductor-related fields (sales, technical positions, etc.) - Individuals interested in semiconductor manufacturing technology (front-end, back-end, etc.) - Those interested in the evolution of semiconductor packaging and the corresponding packaging technology - Individuals interested in semiconductor integration = bonding technology (Bumping Technology)
The GS7 series is a low power consumption, high-speed asynchronous SRAM.
- Memory
GSI Technology Rad-Hard SRAM
Release of Rad-Hard versions of SigmaQuad-II+, SyncBurst, and NBT SRAM! GSI's Rad-Hard SRAM is expected to be a key component in advanced systems utilizing cutting-edge FPGAs, ADCs, and DACs. The initial release products are certified to Class-Q and Class-V levels to meet the stringent requirements of aerospace and defense customers. For satellite and defense customers eagerly awaiting alternatives to current Rad-Hard memory solutions, GSI's Rad-Hard SRAM leverages our proven commercial technology and architecture with radiation enhancement, providing efficient and high-performance state-of-the-art memory at the 40nm technology node.
The GS8 series is a high-speed, large-capacity synchronous SRAM that can be supplied for a long term.
- Memory
The SigmaDDR series is a high-speed DDR II SRAM that is fully compatible with products from other companies such as Cypress.
- Memory
The LL DRAM II has finally arrived from SRAM manufacturer GSI Technology.
- Memory
Aluminum extruded heat sink with dimensions of 27.95 mm wide x 15.24 mm high - available in various lengths.
- Other semiconductors