List of Semiconductors and ICs products
- classification：Semiconductors and ICs
1291～1305 item / All 4514 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
54mm diameter round LED heat sink
- Other semiconductors
Clip-type heat sink that can be mounted without screws on TO-247, TO-248, TO-220, and TO-218 package semiconductors.
- Other semiconductors
Insulated clamp parts for TO-247 package power transistors
- Other semiconductors
Round Pin Heat Sink "ICK S R 140 x 70"
- Other semiconductors
Efficient heat dissipation is possible with a W129mm x H66mm hollow-type heat sink and axial fan.
- Other semiconductors
A clip that can securely make contact with a TO-220 package transistor and a heat sink.
- Other semiconductors
98 mm diameter x 50 mm height round pin fin heat sink (Al99.5)
- Other semiconductors
This is a black anodized heat sink for BGA with a width of 45 mm, a length of 42.5 mm, and a height of 6 mm.
- Other semiconductors
200mm diameter, 40mm height round LED heat sink
- Other semiconductors
Efficient heat dissipation is possible with a W66mm x H66mm hollow-type heat sink and an axial fan.
- Other semiconductors
Axial flow heat sink with axial flow fan for AC230V
- Other semiconductors
Heat sink for DIP IC (14, 16 contacts)
- Other semiconductors
High-performance heat sink for forced air cooling (hollow type) W400mm x H88mm, 31 fins
- Other semiconductors
With a pressing force of 55N, the transistor in the TO-220 and TO-3P packages can be reliably brought into contact with the heat sink.
- Other semiconductors
With a pressing force of 59N, it is possible to ensure that transistors in TO-248 and TO-218 packages make reliable contact with the heat sink.
- Other semiconductors