List of Semiconductors and ICs products
- classification：Semiconductors and ICs
1171～1215 item / All 4526 items
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Amino acid-derived natural cationic polymer that can be used in food preservatives, hygiene materials, and daily necessities. It is a safe material as it is a fermentation product produced by natural ...
- Shelf life enhancer
Introduction of the preservative polylysine / fermented polyamino acids that contribute to food poisoning prevention.
We provide easy-to-understand materials explaining the natural preservative polylysine, which prevents food poisoning. ε-Polylysine (hereafter referred to as polylysine) is an amino acid-derived preservative widely used as a food preservative. By adding polylysine, the growth of microorganisms that cause food poisoning can be prevented. Every year, food poisoning caused by microorganisms is a significant issue and is frequently reported in the news. Even foods that do not appear to be spoiled can rapidly proliferate microorganisms if the growth environment is suitable, so caution is necessary. Even if something looks clean, contamination by bacteria can progress, posing a risk of food poisoning. By ensuring hygiene management during the manufacturing process, proper storage at appropriate temperatures, and the appropriate use of the preservative polylysine, food safety can be more effectively protected. 【Features】 ■ A safe material produced through fermentation by natural microorganisms (not genetically modified organisms) ■ Provides a good image as a natural fermented product ■ Listed in the existing additive registry as a food preservative ■ A safe domestic product *Please feel free to contact us.
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It is possible to obtain insights into the size and distribution of crystal grains in metallic polycrystals.
- Contract Analysis
- Memory
Forced air cooling heat sink combining a hollow heat sink with dimensions of 160mm width, 83mm height, and 150mm length, and a DC24V axial fan.
- Other semiconductors
GC/MS: Gas Chromatography-Mass Spectrometry
- Contract Analysis
- Memory
AFM: Atomic Force Microscopy Method
- Contract Analysis
- Wafer
For applications such as generators and elevators! The synergy with solder bonding on both sides of the chip improves long-term reliability.
- Other semiconductors
There is a track record of growing nitride semiconductor crystals on various semiconductor substrates. Customization is also possible according to your requests.
- CVD Equipment
- LED Module
- Wafer
This is a three-dimensional processed product realized with our 5-axis machining center.
- Other semiconductors
We also process ultra-thin silicone rings with high precision.
- Other semiconductors
These are polyhedral processing samples of hard-to-cut materials such as alumina, silicon, and glass.
- Other semiconductors
A one-stop shop from connectors to harness processing. We take on challenges for prototypes and mass production with short delivery times and competitive prices. Waterproof and airtight testing is ava...
- Memory
- Memory
Mounting pads for transistors from Fischer Elektronik for protection and installation at uniform intervals.
- Other semiconductors
H50 x W50 x L75 mm aluminum heat sink + DC12V axial fan heat dissipation device compatible with transistor clips
- Other semiconductors
Forced air cooling set with W100.5mm x H50mm x L100mm aluminum heat sink + two DC12V axial fans.
- Other semiconductors
Ideal for preventing degradation or destruction of ICs and components from overcurrent during load short circuits and overvoltage due to abnormalities in surrounding devices!
- ASIC
We will also search for parts that have been rejected by other companies.
- Microcomputer
- Memory
- Embedded Board Computers
Ultra-small satellite, onboard computer for CubeSat, CSP. A single-board computer equipped with a Zynq-7020 processor.
- Printed Circuit Board
- Microcomputer
We have overseas sales achievements! Our strengths are a wide variety of products and the trust of Made in Japan!
- fiber
- Other semiconductors
Standard type aluminum extruded small heat sink with a width of 12.6mm and a height of 6.5mm.
- Other semiconductors
It is possible to easily respond to security requirements for existing products!
- Dedicated IC
- Other semiconductors
A heat sink with two 24VDC fans set on an aluminum heat sink measuring W120mm x H60mm x L150mm.
- Other semiconductors
A heat dissipation device that combines an aluminum heat sink compatible with transistor clips and a DC 12V axial fan.
- Other semiconductors
Aluminum filler with high thermal conductivity and heat dissipation properties.
- Wafer
From semiconductor substrates to powder applications. A lineup of grades tailored to diverse needs!
- Other semiconductors
We will be exhibiting at the 14th Shenzhen Heat Conduction Heat Dissipation Materials Expo 2025, which will be held in Shenzhen, China from June 4 (Wednesday) to June 6 (Friday), 2025!
Our group company in China, Hunan Ningxiang Jiweixin Metal Powder Co., Ltd., will be exhibiting at the 14th Shenzhen Heat Conduction Heat Dissipation Materials Expo 2025, which will be held from June 4 (Wednesday) to June 6 (Friday), 2025. This exhibition will be a comprehensive showcase of heat conduction and heat dissipation materials and equipment. At our booth, we plan to introduce a wide variety of aluminum powders, including high-purity aluminum powder, aluminum alloy powder, and aluminum nitride. We sincerely look forward to your visit.
It is predicted to grow at an average annual growth rate of 5.7% from 2025 to 2031.
- others
- Other semiconductors
Manufacturing and testing technology for small packages on cutting-edge rationalization lines! Quick and meticulous response.
- Wafer
- Dedicated IC
- Other semiconductors
Realizing non-contact thickness measurement of various materials that transmit white light.
- Other measurement, recording and measuring instruments
- Sensors
- Wafer
Notice of Participation in SEMICON JAPAN 2024
Our company will exhibit at "SEMICON JAPAN 2024," which will be held at Tokyo Big Sight starting December 11, 2024 (Booth number: 2705). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing process and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look at our offerings. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Contact/non-contact (confocal technology) hybrid applications - Optical 3D surface roughness and shape measuring instruments - High-end 3D surface measurement for probe card inspection - Visual blade inspection system for dicing processes
45mm diameter x 30mm height round pin fin heat sink (Al99.5)
- Other semiconductors