List of Semiconductors and ICs products
- classification:Semiconductors and ICs
91~135 item / All 4861 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
An overview of advanced packaging technologies from 2.5D/3D chiplets to thermal management, reliability evaluation, and PFAS compliance.
- Other semiconductor manufacturing equipment
- Other semiconductors
- Technical Seminar
11/10 Webinar Advanced Semiconductor Packaging Technology
■Title: "The Complete Picture of Advanced Semiconductor Packaging Technology - From 2.5D/3D and Chiplets to Thermal and Power Solutions, Reliability Evaluation, and PFAS Compliance -" ――A systematic explanation of advanced packaging technologies that support the evolution of AI semiconductors. In addition to the latest technological trends in 2.5D/3D packaging, chiplets, CoWoS, TSV, and glass core substrates, you will learn broadly about manufacturing processes, yield improvement, failure analysis, reliability evaluation, PFAS regulatory compliance, and thermal and power design. Practical case studies and evaluation analysis techniques directly related to work will also be explained in detail. - Basics of semiconductor packaging technology and the evolution of trends - Latest trends in 2.5D/3D and chiplet technology - Reliability testing and failure analysis techniques - Key points for yield improvement - PFAS regulatory compliance and sustainable materials - Thermal and power design technologies for advanced packaging aimed at AI - Engineers and researchers from chemical, electronics, electrical, and automotive manufacturers - Personnel involved in semiconductor backend processes and assembly technologies - Personnel involved in materials and equipment development - Those who want to systematically learn about advanced packaging technologies
We provide comprehensive support from semiconductor design to embedded software development!
- Other semiconductors
- Other services
- Embedded system design service
AssetCore Technology Inc. Company Profile
Asset Core Technology Co., Ltd. provides comprehensive support from semiconductor design to embedded software development. Our "semiconductor design services" feature reliable achievements and expertise in LSI design and verification technology. In "system design development," we offer a one-stop service through collaborative design of hardware and software. Additionally, we conduct "model-based development," where engineers well-versed in MBD assist our clients' operations, as well as "embedded software development," which is grounded in an understanding of hardware.
Overcoming thermal displacement has been a bottleneck for achieving high precision. This is an excellent casting material developed to eliminate those bottlenecks!
- Other optical parts
- Other machine tools
- Other semiconductors
We also accommodate welding to flanges! Can be used as current introduction terminals for vacuum containers in your preferred size. We also accept small quantities, custom products, and specification ...
- Other semiconductors
- Other electronic parts
Notice of participation in the "VACUUM 2025 Vacuum Exhibition" from December 3 (Wednesday) to December 5 (Friday), 2025.
Fujidenka Co., Ltd. will be exhibiting at the "VACUUM2025 Vacuum Exhibition" held at Tokyo Big Sight. This exhibition marks the 47th edition of the comprehensive exhibition for vacuum equipment and devices. Every year, many companies and researchers involved in vacuum technology, including those in technology development, product manufacturing, and sales, attend, leading to numerous business negotiations directly related to business. We sincerely look forward to your visit.
Compatible Logic IC solutions for industrial equipment supporting 74HC, 74HCT, and 74LVC!
- Other semiconductors
Introduction to MKP Company! We possess unique patent technology that facilitates the smooth mass production of MFC.
- Other semiconductors
- controller
For industrial equipment, power supplies, and batteries. Supporting the selection and replacement of low on-resistance, high-efficiency, and high-reliability MOSFETs.
- Other semiconductors
This is a special industrial OPP film with a formulation of additives that is controlled as much as possible. It can be used as a release film in the electronics and optics fields without coating a re...
- Other optical parts
- Other semiconductors
Support from the integration of discrete circuits to the regeneration of EOL products.
- Circuit board design and manufacturing
- Prototype Services
- Dedicated IC
Reproduction is possible even without design data. 'Discontinued LSI Reproduction Service' that does not stop mass production and maintenance.
- Other semiconductors
- EMS
- Dedicated IC
A one-stop LSI turnkey service that supports everything from organizing requirements specifications to LSI design, evaluation, prototyping, and mass production.
- Circuit board design and manufacturing
- Prototype Services
- Dedicated IC
Agilex 5 FPGA SOM Second Edition. Low-cost and small Comet A13 SoM.
- Embedded Board Computers
- Other electronic parts
- Other semiconductors
Systematically acquire semiconductor packaging technology from the basics. Learn about quality control and the latest packaging trends in one day.
- Technical Seminar
- Other semiconductor manufacturing equipment
- Other semiconductors
Ideal for high-side switches of 48V batteries!
- Transistor
Adopts a body with embedded electrostatic discharge prevention material, an ESD-compatible laser barcode scanner capable of continuous high-speed reading.
- Printed Circuit Board
- Other semiconductors
- Other clean room equipment and facilities
Examples of applications used in a wide range of areas such as graph creation, matrix calculations, and numerical solutions of simultaneous differential equations.
- Software (middle, driver, security, etc.)
- Wafer
- Semiconductors and ICs
For the development of complex/high-performance processors/SoCs equipped with multiple ARM Cortex-A/R cores!
- Development support tools (ICE, emulators, debuggers, etc.)
- Software (middle, driver, security, etc.)
- Microcomputer
Debugger and trace solution compatible with RISC-V cores.
- Development support tools (ICE, emulators, debuggers, etc.)
- Microcomputer
For software development on ARM Cortex-M cores, use TRACE32!
- Development support tools (ICE, emulators, debuggers, etc.)
- Software (middle, driver, security, etc.)
- Microcomputer
Liquid hazardous materials can also be safely transported with all-fiber solutions.
- Wafer
- Resist Device
- Photomask
Achieves a consumption current of 0uA! A multifunctional load switch IC equipped with a soft start external adjustment feature.
- Other electronic parts
- Dedicated IC
HFE from Halocarbon is a fluorinated solvent with a low global warming potential (GWP) and an ozone depletion potential (ODP) of zero.
- Electronic Components
- Other semiconductors