List of Semiconductors and ICs products
- classification：Semiconductors and ICs
91～135 item / All 4817 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
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Introducing a case study of precision surface treatment that prevents adhesion of epoxy adhesives used for bonding electronic components.
- Other semiconductors
Fischer Elektronik manufactured high-performance heat sink for forced air cooling (hollow type) W165mm x H84mm
- Other semiconductors
Silicone-based materials are not used, and electronic components (sensors) and electronic substrates that are susceptible to outgassing are thoroughly protected under a chemical atmosphere.
- Other semiconductors
It has a slew rate of over 200 kV/μs and can also be used for insulation testing!
- switch
- Other semiconductors
It is the 'Smart LCDC', an easy-to-understand and easy-to-use LCD controller that allows LCD display via RS-232C.
- Other semiconductors
It is an easy-to-understand and easy-to-use LCD controller 'Smart LCDC' that allows LCD display via RS-232C.
- Other semiconductors
It is a "development tool" that allows you to master the basics of LCD and drawing methods in a short time.
- Other semiconductors
We always have over 1,000 types of SOI wafers in stock! We accept orders for stock SOI wafers starting from one piece.
- Other semiconductors
Round pin fin heat sink with large size and high heat dissipation performance.
- Other semiconductors
Thin design high thermal conductivity round pin fin heat sink compatible with forced air cooling.
- Other semiconductors
Φ50 round pin fin heat sink that exhibits high heat dissipation through forced air cooling.
- Other semiconductors
High thermal dissipation round pin fin heat sink ideal for forced air cooling of small machinery.
- Other semiconductors
45mm diameter x 30mm height round pin fin heat sink (Al99.5)
- Other semiconductors
Selection of coprocessors compatible with advanced CMOS sensors!
- Dedicated IC
- Other semiconductors
Due to domestic supply shortages! Flexible response for PEI and PAI machining from prototype to mass production with direct overseas sales. On-site measurements without drawings are also acceptable!
- Semiconductors and ICs
- Engineering Plastics
- Wafer
2035 Strategy Interpreted from Implementation, Regulation, and Economic Security!
- Technical and Reference Books
- Other semiconductors
8/5 Webinar: Semiconductor Packaging Technology Course
■Title "Changes in Joint Structures and Packaging Responses Due to the Evolution of Semiconductors ~ Response of Resin Sealing Technology to the Increase in the Number of Joints and Narrow Pitching ~" In semiconductor packages, which are advancing in high integration, high density, and three-dimensionality, addressing the increase in joints (bumps) and narrowing of pitches has become an important challenge. In this seminar, experienced instructors will organize the changes in joint structures accompanying the evolution of semiconductor packages and explain the latest trends, challenges, and countermeasures in resin sealing technology and mounting technology. 【Knowledge Gained from the Seminar】 - Development history and latest trends of semiconductor packaging - Changes in joint structures and packaging technology - Evaluation methods for resin sealing materials and sealing technology - Sealing technology for narrow pitch bumps and reliability improvement - Challenges and countermeasures in advanced packaging 【Target Audience】 Engineers, researchers, and sales representatives from semiconductor-related companies, as well as those involved in semiconductor manufacturing, mounting, sealing materials, and packaging technology.
Leave it to us for all kinds of test pattern wafers for 3D NAND flash memory.
- Wafer
For recording robot control logs. Strong against rewriting, with stable data storage performance.
- Memory
It provides strong resistance to rewriting in pSLC mode and offers excellent reliability for video recording.
- Memory
Strong in measurement value storage! The pSLC method is resistant to rewriting and also excels in data storage performance.
- Memory
Because it's a pSLC method, it is strong against rewriting! The data retention performance after rewriting is also excellent!
- Memory
Since it's in pSLC mode, it is strong against rewriting! The data retention performance after rewriting is also excellent!
- Memory
By combining a hollow heat sink with dimensions of 92mm in width, 93mm in height, and 150mm in length with a DC 24V axial fan, efficient heat dissipation is achieved.
- Other semiconductors
For the semiconductor industry! Process analyzer / Online analyzer for monitoring tetramethylammonium hydroxide (TMAH) in developer solutions!
- Analytical Equipment and Devices
- Wafer
- Semiconductor inspection/test equipment
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Overcoming thermal displacement has been a bottleneck for achieving high precision. This is an excellent casting material developed to eliminate those bottlenecks!
- Other optical parts
- Other machine tools
- Other semiconductors