List of Semiconductors and ICs products
- classification:Semiconductors and ICs
1846~1890 item / All 4837 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Achieves low RDS(on) to maximize the effective use of package space.
- Other semiconductors
Introducing our unique package and DioMOS technology fusion module!
- Other semiconductors
The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!
- Other semiconductors
Insulation withstand voltage 2500V! A module that uses IGBTs specialized for high-speed performance.
- Other semiconductors
Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.
- Other semiconductors
A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.
- Other semiconductors
- Database
- EAI/ETL/WEB application server
September 17 Webinar: "Next-Generation AI Infrastructure and Optoelectronic Integration Implementation"
■Title: "Next-Generation AI Infrastructure and Optoelectronic Fusion Implementation - Addressing Massive Information Processing, Decoding Optoelectronic Fusion -" In the context of the rapid increase in information volume due to AI and live video, this seminar explains optical fiber communication, high-speed wireless, and semiconductor technologies that support high-speed information transmission. Participants will systematically learn about the current status and challenges of "optoelectronic fusion implementation" aimed at introducing optical transmission between and within electronic devices. 【Knowledge Gained from the Seminar】 - Basics of high-speed information transmission technology and the essence of high-speed transmission - Factors influencing high-speed transmission such as transmission medium, transmission distance, and transmission loss - Transmission methods including wired/wireless, 4G/5G, Wi-Fi 6/7 - Development history of optical fiber communication, communication methods, and transceivers - Challenges in information transmission between and within electronic devices - Current status of optoelectronic signal conversion and optoelectronic fusion implementation - Basic technologies such as optical semiconductors, silicon photonics, processors, and memory 【Target Audience for the Seminar】 - Individuals interested in high-speed information transmission technology - Those dealing with large-capacity information such as AI and video - Individuals who want to learn the basics of semiconductor and transmission technology
A new style heat sink with lower thermal resistance than the popular FK244 series.
- Other semiconductors
By directly soldering SMT power devices to the circuit board, a heat dissipation effect can be achieved.
- Other semiconductors
Here is an amazing thermal solution with exceptionally excellent thermal conductivity in the thickness direction of the TIM sheet!
- Composite Materials
- Other semiconductors
- Generators and transmission motors
We will exhibit at the 2nd Power Device & Module EXPO!
We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!
Heat sink for PCB mounting, 35.3 mm wide x 35 mm high.
- Other semiconductors
Pursuing extremes with rich achievements and advanced technology! Establishing a processing capability system positioned among the world's top class.
- Other semiconductors
- Wafer processing/polishing equipment
An example of connecting different pitches through a pitch conversion adapter linked by a pattern!
- Other semiconductors
An adapter composed of a substrate material (CEM-3) that is resistant to high-temperature reflow and pin terminals for SMT implementation!
- Other semiconductors
A pin header composed of electrical connection pins and positioning and stacking pins, with a case where the spacer tube has been eliminated.
- Other semiconductors
A case where the pin header terminals were shaped in a wave pattern to relieve stress on the solder joint!
- Other semiconductors
Attach a horn-shaped hollow terminal to the FPC, solder a lead wire to the hollow terminal, and increase the solder connection area to ensure strength.
- Other semiconductors
A case where installation man-hours were reduced with a pin header consolidated into a single base!
- Other semiconductors
An example of wire bonding a metal substrate and pin flat part, followed by soldering the metal module substrate to the motherboard.
- Other semiconductors
A case where terminal components were directly and automatically inserted onto the circuit board using an insertion machine, reducing labor hours!
- Other semiconductors
Solved with a conversion adapter! Here are some products that contributed to solving customer problems.
- Other semiconductors
By implementing plate terminals on pads that require gold plating, we can reduce extra costs during circuit board manufacturing!
- Other semiconductors
Connect the circuit boards using a pin header with spring characteristics designed for card edge with pin terminals!
- Other semiconductors
A case where a custom socket was mounted on the circuit board, and after reflow, components were attached to the socket!
- Other semiconductors
A relay board with terminals that eliminates the wire soldering process by connecting the terminals to the module board and the relay board to the connector.
- Other semiconductors
Place block-shaped copper terminals around the heat source! Transfer heat to the aluminum plate through thermally conductive silicone for heat dissipation.
- Other semiconductors
A pin header with a spring action on one side to hold the daughterboard!
- Other semiconductors
A pin header with a circular arc-shaped base that ensures an effective area and reduces the size of the substrate!
- Other semiconductors
An example where a pin header with a break-off section was soldered to a circuit board, leaving only the break-off terminals after removing the base.
- Other semiconductors
A case where stress was reduced and challenges were solved with a wave pin header!
- Other semiconductors
W389mm x H121mm Hollow-type heat sink with axial fan enables efficient heat dissipation.
- Other semiconductors
W259mm x H121mm hollow-type heat sink with axial fan enables efficient heat dissipation.
- Other semiconductors
We provide silicon wafers that meet your requirements with short delivery times and low prices! Same-day shipping available.
- Wafer
W129mm x H121mm hollow type heat sink + axial fan enables efficient heat dissipation.
- Other semiconductors
Transistors in TO-218, TO-220, TO-247, TO-248, and SIP-Multiwatt packages can be clipped.
- Other semiconductors
Extruded heat sink with solder pins that can secure the transistor with clips.
- Other semiconductors
Solder pin attached extrusion heat sink (transistor screw mounting)
- Other semiconductors
Extruded heat sink with M3 screw hole for transistor fixation and solder pin (for TO-220, SOT32 package)
- Other semiconductors
Aluminum is a top performer in recycling! Additionally, its lightweight nature contributes to reduced transportation costs and less burden on workers!
- Wafer
A reader chip boasting industry-leading reception sensitivity and reading speed, supporting next-generation RAIN tags.
- IC tag
- Dedicated IC
Extruded heat sink with M3 screw holes for fixing TO220 package transistors and M3 screw holes for mounting on the board.
- Other semiconductors
Supports high precision and high-frequency signals! It has received high trust from users.
- Other electronic parts
- Other semiconductors
Small temperature mobility switching characteristics, low forward voltage, high-speed switching time.
- diode
Controls conductivity in the range of 10E4 to 11Ω. A tray that excels in low dust generation and static prevention. Material suggestions suitable for the usage environment are also possible.
- Other semiconductors
Second source products for standard operational amplifiers (also available as alternatives for other standard products).
- Transistor