List of Thermo-fluid analysis products
- classification：Thermo-fluid analysis
46～90 item / All 427 items
Are you measuring the correct thermal conductivity of the thermal pad?
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
Even thin and small samples, as well as samples with high thermal conductivity, can be measured!
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
Leave the measurement of the thermal conductivity of carbon fiber reinforced plastic (CFRP) to us.
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
World's first! Dedicated software developed for extrusion technology simulation and optimization of extrusion die design.
- Thermo-fluid analysis
Proposing a new design through fluid analysis and multi-objective topology optimization.
- Thermo-fluid analysis
Sales of "ToffeeX," which supports the development and design of cooling structure components, have begun - Achieving reduced development time and improved product performance through thermal fluid analysis and topology optimization.
SCSK Corporation (Headquarters: Koto-ku, Tokyo, Representative Director and Executive Officer: Takashi Toma, hereinafter referred to as SCSK) has concluded a general agency agreement for the cloud-based topology optimization software "ToffeeX" with ToffeeX Ltd (Headquarters: London, UK) and will begin sales on April 1, 2024. By utilizing advanced topology optimization technology, we will derive the shapes of components that maximize heat dissipation and minimize pressure loss in a short time, thereby achieving reduced development time and improved product performance. We aim to sell 50 units by March 2026, focusing on the manufacturing of components requiring thermal management and the product design field using 3D printing. *1 Analysis that clarifies how to arrange materials in the design space to achieve an optimal structure. *2 The energy lost by a fluid as it passes through pipes and other conduits.
Data center thermal management simulation software available for operational managers to use in daily tasks with DCIM integration.
- Thermo-fluid analysis
- Other core systems
TileFlow Japan will exhibit at Data Center Japan 2025.
TileFlow Japan will exhibit at the "Data Center Japan 2025" event, which is held to commemorate the 15th anniversary of the Japan Data Center Association. Date: March 18, 2025 - March 19, 2025 Time: 10:00 AM - 5:00 PM Venue: Tokyo Metropolitan Industrial Trade Center, Hamamatsucho Hall, 4th and 5th floors For more details, please refer to the following URL: https://f2ff.jp/event/dcjapan
Engineering actively utilizing CAE (Computer Aided Engineering)
- Thermo-fluid analysis
- Analysis Services
- Stress Analysis
You can download the Corporate Profile.
Mitsubishi Chemical Engineering has renewed its company brochure. Please download and take a look from the related link below.
The use of thermal fluid simulation is advancing in various aspects of plant design, such as stratified air conditioning, heat stroke prevention, and ensuring cleanliness, etc.
- Thermo-fluid analysis
Constant temperature and humidity, local cleanliness, airflow methods... Solving various issues in clean rooms with fluid analysis! [We also accept contracted analyses with no work required on your pa...
- Thermo-fluid analysis