List of Etching Equipment products
- classification：Etching Equipment
301～315 item / All 333 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Ninomiya System manufactured H-down device
- Etching Equipment
Ninomiya System ITO Etching Equipment
- Etching Equipment
Compact Ultra-High Precision Etching Machine MPE40
- Etching Equipment
Ninomiya System's ultra-compact etching test device
- Etching Equipment
Easy and efficient etching with air jets.
- Etching Equipment
Removal of gases and vapors generated during etching.
- Etching Equipment
- Ventilation and Exhaust
Chemical resistance, heat resistance, insulation, non-magnetic, acid resistance, alkali resistance, oil resistance, solvent resistance, thermal insulation, recycling.
- Spring
- Other physicochemical equipment
- Etching Equipment
Chemical resistance, heat resistance, insulation, non-magnetic, acid resistance, alkali resistance, oil resistance, solvent resistance, thermal insulation, recycling.
- Spring
- Other physicochemical equipment
- Etching Equipment
Chemical resistance, heat resistance, insulation, non-magnetic, acid resistance, alkali resistance, oil resistance, solvent resistance, thermal insulation, recycling.
- Spring
- Other physicochemical equipment
- Etching Equipment
Small developing device for photolithography
- Etching Equipment
Ultra-compact microwave plasma source SMPS-201
- Etching Equipment
- Other semiconductor manufacturing equipment
Microwave Ion Source EMIS-221C
- Etching Equipment
- Other semiconductor manufacturing equipment
Night Ride H System Quartz Night Ride Reflux System ACCUBATH
- Etching Equipment
PSS (Patterned Sapphire Substrate) through wet etching is changing the LED industry!!
About Patterned Sapphire Substrates (PSS) Using Wet Etching Currently, LED manufacturers have two completely different processes as options for their manufacturing processes. The dry etching method allows for the production of high-brightness, high-efficiency LEDs, but it requires a long time for manufacturing and has limitations on throughput. The wet etching method has a shorter manufacturing time and is highly scalable, but it cannot produce LEDs that are efficient or effective. However, in the case of the wet etching method, even when polishing and improving the wafer to enhance light extraction efficiency, significant cost reductions can be achieved compared to the dry etching method. Additionally, because it can scale up very efficiently, the cost reduction rate dramatically increases multiple times as throughput is increased and wafer sizes are expanded.