Etching device
Device for etching copper foil after development using ferric chloride and cupric chloride 【Features】 ○ Lane configuration: 2 Lane ○ Transport speed: 2.0m/min ○ Material width: 35mm to 160mm for TAB/CSP/COF (250mm to 300mm for FPC) ○ Material thickness: PI 25μm and above ○ Processing surface: Single side ○ Device configuration: Unwinding → Etching → Rinsing → Liquid removal → Drying → Winding ○ Utilities: - Power supply: AC200V・220V / 50Hz・60Hz - Tap water, pure water, cooling water, scrubber, heat exhaust, (steam) ○ Device dimensions: 16m (L) × 2.5m (W) × 2.5m (H) ● For other functions and details, please contact us.
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Device for etching copper foil after development using ferric chloride and cupric chloride 【Features】 ○ Lane configuration: 2 Lane ○ Transport speed: 2.0m/min ○ Material width: 35mm to 160mm for TAB/CSP/COF (250mm to 300mm for FPC) ○ Material thickness: PI 25μm and above ○ Processing surface: One side ○ Device configuration: Unwinding - Etching - Washing - Liquid removal - Drying - Winding ○ Utilities: - Power supply: AC200V・220V / 50Hz・60Hz - City water, pure water, cooling water, scrubber, heat exhaust, (steam) ○ Device dimensions: 16m (L) × 2.5m (W) × 2.5m (H) ● For other functions and details, please contact us.
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As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. We will continue to operate as a group of specialists in roll-to-roll manufacturing equipment. Additionally, SETO ENGINEERING has inherited all the technical know-how related to roll-to-roll from the former Seto Giken, so we will not only design and manufacture new roll-to-roll manufacturing equipment but also provide maintenance for various roll-to-roll manufacturing equipment delivered by the former Seto Giken.
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