List of Wafer processing/polishing equipment products

Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

• air conditioning

Supports φ10 to φ80 and up to 350L! This is the process performed after lathe machining to improve the outer diameter dimensions and surface roughness.

• Processing Contract
• others
• Wafer processing/polishing equipment

I want to polish like this. Please feel free to consult us about outer diameter polishing, inner diameter polishing, end face polishing, and more.

• Wafer processing/polishing equipment
• Surface treatment contract service
• Processing Contract

Introducing examples of processing rubber rolls made from general-purpose rubber as an alternative to whetstone grinding!

• Wafer processing/polishing equipment
• Surface treatment contract service
• Processing Contract

Introducing a case where processing time has been reduced to less than 1/4 as a substitute for whetstone grinding!

• Wafer processing/polishing equipment
• Surface treatment contract service
• Processing Contract

Introducing a case study of a machined tool holder for SCM415 as an alternative to whetstone grinding!

• Wafer processing/polishing equipment
• Surface treatment contract service
• Processing Contract

Introducing a processing example using a super finisher that achieved a measurement result of Ra0.035μm, replacing whetstone grinding!

• Wafer processing/polishing equipment
• Surface treatment contract service
• Processing Contract

Flexible multi-stage, diverse, high-efficiency polishing of cylindrical shapes! Film cylindrical super finishing machine with lift and carry transport device included.

• Wafer processing/polishing equipment

The world of ultra-fine polishing of the difficult inner surfaces and end faces of cylinders has expanded thanks to the internal unit!

• Wafer processing/polishing equipment

Achieving ultra-fine finishing grinding of the outer diameter in recessed areas of the workpiece using a 3D motion W-cross guide method!

• Wafer processing/polishing equipment

Film polishing always uses a method of continuously feeding in new film! It flexibly accommodates a variety of roll materials!

• Wafer processing/polishing equipment

Powerful performance when mounted on compact general-purpose machines! Unit-type super finisher.

• Wafer processing/polishing equipment

Introduction of a film super finishing device with backup roller diameter and width of φ58×50mm!

• Grinding Machine
• Wafer processing/polishing equipment

Introduction of a film super finishing device with backup roller diameter and width of φ58×100mm!

• Grinding Machine
• Wafer processing/polishing equipment

A 2-way machine for the final polishing process with excellent cost performance.

• Wafer processing/polishing equipment

No nests, achieving uniform organization and hardness, can be produced from 3B to 32B!

• Wafer processing/polishing equipment