List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
631～645 item / All 1008 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Scan speed increased! Conventional alignment speed improved by over 3 seconds! Furthermore, low prices achieved for Si wafers only! [Free demo available now]
- Wafer processing/polishing equipment
Stable support for the vibration unit! The replacement of the buff can be easily carried out by one person.
- Wafer processing/polishing equipment
Introducing a versatile barrel polishing machine that meets various needs at a low cost.
- Wafer processing/polishing equipment
- Other abrasives
- Other processing machines
Ideal for deburring and smoothing finishes of small to large parts! The layout of auxiliary equipment is easy to arrange.
- Wafer processing/polishing equipment
- Other abrasives
- Other processing machines
A fulfilling lineup! Ideal for removing burrs and edges from workpieces, as well as for R-attachment and heavy cutting to finishing processes.
- Wafer processing/polishing equipment
- Other abrasives
- Other processing machines
Deburring with polishing stones for a glossy finish! Achieves a high level of finish without dents.
- Wafer processing/polishing equipment
Stable and uniform processing is possible! Supports everything from fine burr removal to cleaning!
- Wafer processing/polishing equipment
Stable pressure flow (patented) maximizes the power of the media!
- Wafer processing/polishing equipment
We will exhibit at the Kansai Mechanical Components Exhibition [Hall 3, Booth 12-1].
Kawashin Co., Ltd. will be exhibiting at the "Kansai Machine Elements Technology Exhibition" from October 7 (Wednesday) to October 9 (Friday). 【Exhibition Booth Location】 12-1 (Hall 3) 【Exhibition Contents】 - Multi-chamber hydrocarbon cleaning and drying machine - Hydrocarbon cleaning agents - Mirror finish processing blast equipment - Mirror finish processing barrel media "23rd Kansai Machine Elements Technology Exhibition" ______________________ <Organizer> Reed Exhibitions Japan Ltd. <Date> October 7 (Wednesday) to October 9 (Friday) <Venue> Intex Osaka https://www.japan-mfg-kansai.jp/ja-jp/about/mtech.html ____________________________________________________ We are taking sufficient infection control measures to ensure a safe experience. We look forward to your visit. Online consultations are also available. https://www.japan-mfg-kansai.jp/ja-jp/contents/online_kansai.html
The new concept of "tornado suction" completely overturns the conventional wisdom of blast processing!
- Wafer processing/polishing equipment
Reduction of electricity consumption and CO2 emissions! Blower blast capable of using a wide range of abrasives.
- Wafer processing/polishing equipment
Overwhelming ease of management compared to whetstone grinding! With condition settings, anyone can achieve the same finish.
- Other abrasives
- Wafer processing/polishing equipment
We will respond as your manufacturing partner with a one-stop (integrated production system) approach!
- Contract manufacturing
- Semiconductor inspection/test equipment
- Wafer processing/polishing equipment
Notice of Participation in Internepcon Japan 2021 Electronics Manufacturing and Assembly Exhibition
We will be exhibiting at "NEPCON Japan," where the latest manufacturing and implementation technologies that support the multifunctionality and high performance of electronic devices come together. "NEPCON Japan" has established itself as a venue for business negotiations with domestic and international manufacturers of electronic devices, semiconductors, electronic components, and automotive and electrical equipment. If you are facing various challenges such as complicated outsourcing management or improving equipment utilization rates, please stop by our booth. We will propose the optimal plan tailored to your situation. 【Booth Number: W1-54】 ● NEPCON Official Site: https://www.nepcon.jp/ja-jp.html ● NEPCON Company Site: https://jan2021.tems-system.com/exhiSearch/INW/jp/Details?id=%2FUqXsOFXpWM%3D&type=2&rel=undefinedl If you need an invitation ticket, please request the necessary number by writing to us through the "Contact" section. We look forward to your visit as we prepare new proposals.
Ensuring and maintaining productivity! We introduce economical, compact, and highly reliable products.
- Wafer processing/polishing equipment
- Other measurement, recording and measuring instruments
Realization of mechanization for the fitting work of hydraulic pumps.
- Wafer processing/polishing equipment
Are you having trouble with workpiece polishing? High-speed and high-pressure wrapping of difficult-to-cut materials with high precision!
- Wafer processing/polishing equipment
We will be exhibiting at "SEMICON JAPAN 2019."
Nihon Engis will be exhibiting at "SEMICON JAPAN 2019," which will be held from December 11 (Wednesday) to December 13 (Friday) at Tokyo Big Sight (Tokyo International Exhibition Center). At this exhibition, we will showcase our flagship product, the new model of our wrapping device, the "High-Speed & High-Pressure Polisher EJW-400HSP." We would be grateful if you could take a look at a part of our technological capabilities. On the day of the event, we will also be accepting inquiries about polishing (mainly flat polishing), so we would be happy if you could visit our booth. We sincerely look forward to welcoming many of you.