List of Wafer processing/polishing equipment products

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• Sensors

We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

• Other semiconductors
• Processing Contract
• Wafer

Carburizing hardening and polishing processing using steel materials! Capable of buff polishing with excellent surface roughness.

• Wafer processing/polishing equipment

Spindle head with a specification of 30,000 RPM! Demonstrates high precision with coaxiality and perpendicularity of 0.003 millimeters.

• Wafer processing/polishing equipment

Chuck taper grinding using a vertical grinding machine! Achieving high precision with simultaneous internal and external diameter grinding.

• Wafer processing/polishing equipment

Cooling bimetallic joint using S54C and brass! Surface polishing after joining is also possible.

• Wafer processing/polishing equipment

Achieving high machining precision with one chucking! Grinding technology that processes both inner and outer diameters simultaneously.

• Wafer processing/polishing equipment

Active in the automotive and semiconductor industries! Surface grinding processing using a horizontal axis rotary grinding machine.

• Processing Contract
• Other machine elements
• Wafer processing/polishing equipment

Machining flatness and parallelism to 0.001 to 0.005! Reference surface grinding processing using a surface grinder.

• Processing Contract
• Other machine elements
• Wafer processing/polishing equipment

High-precision polishing of processed surfaces! We accommodate everything from small items to large ones.

• Processing Contract
• Contract manufacturing
• Wafer processing/polishing equipment

We can precisely process the inner diameter of a round hole to a thousandth of a unit!

• Processing Contract
• Contract manufacturing
• Wafer processing/polishing equipment

Starting with surface polishing treatment, we also accommodate cylindrical workpieces!

• Processing Contract
• Contract manufacturing
• Wafer processing/polishing equipment

Bernoulli chuck for SiC wafers available for use in clean rooms.

• Other semiconductor manufacturing equipment
• Pneumatic Equipment
• Wafer processing/polishing equipment

Easy to replace the buff! A buff polishing machine with a high spindle suitable for upright work.

• Wafer processing/polishing equipment
• Hand polishing and filing

Buff polishing machine with a transmission device that can be adjusted to the appropriate rotation speed for the type and size of the buff!

• Wafer processing/polishing equipment
• Hand polishing and filing

Installation of an inverter is also possible! A buffing machine suitable for bench work with a low spindle center height.

• Wafer processing/polishing equipment
• Hand polishing and filing

For a wide range of applications such as deburring tools, blades, cast iron products, and forged products, as well as general grinding work!

• Wafer processing/polishing equipment
• Hand polishing and filing