List of Wafer processing/polishing equipment products

  • classification:Wafer processing/polishing equipment

631~675 item / All 1014 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.

  • Other machine tools

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Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.

The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.

Stable support for the vibration unit! The replacement of the buff can be easily carried out by one person.

  • Wafer processing/polishing equipment

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Introducing a versatile barrel polishing machine that meets various needs at a low cost.

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  • Wafer processing/polishing equipment
  • Other abrasives
  • Other processing machines

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Ideal for deburring and smoothing finishes of small to large parts! The layout of auxiliary equipment is easy to arrange.

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  • Wafer processing/polishing equipment
  • Other abrasives
  • Other processing machines

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A fulfilling lineup! Ideal for removing burrs and edges from workpieces, as well as for R-attachment and heavy cutting to finishing processes.

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  • Wafer processing/polishing equipment
  • Other abrasives
  • Other processing machines

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Deburring with polishing stones for a glossy finish! Achieves a high level of finish without dents.

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  • Wafer processing/polishing equipment

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Non-contact, high-speed response allows for control as you wish. Custom orders are available starting from one unit!

  • Pneumatic Equipment
  • Bonding Equipment
  • Wafer processing/polishing equipment

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Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition

We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee

Stable and uniform processing is possible! Supports everything from fine burr removal to cleaning!

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  • Wafer processing/polishing equipment

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We will exhibit at the Kansai Mechanical Components Exhibition [Hall 3, Booth 12-1].

Kawashin Co., Ltd. will be exhibiting at the "Kansai Machine Elements Technology Exhibition" from October 7 (Wednesday) to October 9 (Friday). 【Exhibition Booth Location】 12-1 (Hall 3) 【Exhibition Contents】 - Multi-chamber hydrocarbon cleaning and drying machine - Hydrocarbon cleaning agents - Mirror finish processing blast equipment - Mirror finish processing barrel media "23rd Kansai Machine Elements Technology Exhibition" ______________________ <Organizer> Reed Exhibitions Japan Ltd. <Date> October 7 (Wednesday) to October 9 (Friday) <Venue> Intex Osaka https://www.japan-mfg-kansai.jp/ja-jp/about/mtech.html ____________________________________________________ We are taking sufficient infection control measures to ensure a safe experience. We look forward to your visit. Online consultations are also available. https://www.japan-mfg-kansai.jp/ja-jp/contents/online_kansai.html

The new concept of "tornado suction" completely overturns the conventional wisdom of blast processing!

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  • Wafer processing/polishing equipment

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Reduction of electricity consumption and CO2 emissions! Blower blast capable of using a wide range of abrasives.

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  • Wafer processing/polishing equipment

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Overwhelming ease of management compared to whetstone grinding! With condition settings, anyone can achieve the same finish.

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  • Other abrasives
  • Wafer processing/polishing equipment

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We will respond as your manufacturing partner with a one-stop (integrated production system) approach!

  • Contract manufacturing
  • Semiconductor inspection/test equipment
  • Wafer processing/polishing equipment

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Notice of Participation in Internepcon Japan 2021 Electronics Manufacturing and Assembly Exhibition

We will be exhibiting at "NEPCON Japan," where the latest manufacturing and implementation technologies that support the multifunctionality and high performance of electronic devices come together. "NEPCON Japan" has established itself as a venue for business negotiations with domestic and international manufacturers of electronic devices, semiconductors, electronic components, and automotive and electrical equipment. If you are facing various challenges such as complicated outsourcing management or improving equipment utilization rates, please stop by our booth. We will propose the optimal plan tailored to your situation. 【Booth Number: W1-54】 ● NEPCON Official Site: https://www.nepcon.jp/ja-jp.html ● NEPCON Company Site: https://jan2021.tems-system.com/exhiSearch/INW/jp/Details?id=%2FUqXsOFXpWM%3D&type=2&rel=undefinedl If you need an invitation ticket, please request the necessary number by writing to us through the "Contact" section. We look forward to your visit as we prepare new proposals.

Ensuring and maintaining productivity! We introduce economical, compact, and highly reliable products.

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  • Wafer processing/polishing equipment
  • Other measurement, recording and measuring instruments

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We will monitor the grinding process in real-time with the Marpos measurement head!

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  • Wafer processing/polishing equipment
  • Production Management System
  • Other measurement, recording and measuring instruments

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Realization of mechanization for the fitting work of hydraulic pumps.

  • Wafer processing/polishing equipment

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Are you having trouble with workpiece polishing? High-speed and high-pressure wrapping of difficult-to-cut materials with high precision!

  • Wafer processing/polishing equipment

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We will be exhibiting at "SEMICON JAPAN 2019."

Nihon Engis will be exhibiting at "SEMICON JAPAN 2019," which will be held from December 11 (Wednesday) to December 13 (Friday) at Tokyo Big Sight (Tokyo International Exhibition Center). At this exhibition, we will showcase our flagship product, the new model of our wrapping device, the "High-Speed & High-Pressure Polisher EJW-400HSP." We would be grateful if you could take a look at a part of our technological capabilities. On the day of the event, we will also be accepting inquiries about polishing (mainly flat polishing), so we would be happy if you could visit our booth. We sincerely look forward to welcoming many of you.

Most of the work is done in-house through trial and error! We handle all processes including design, manufacturing, machining, welding, electrolysis, and cleaning internally.

  • Wafer processing/polishing equipment
  • Processing Contract

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Multiple specialized electro-polishing factories established! Responding to diverse needs along with various cleaning equipment and clean facilities.

  • Wafer processing/polishing equipment
  • Processing Contract

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Ideal for small-lot and multi-variety production of small precision parts! It is possible to use grinding stones with a diameter of 3mm or less.

  • Wafer processing/polishing equipment

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Maintain a comfortable working environment with dust collection! No consumables needed for rust prevention of compounds in wet processes.

  • Wafer processing/polishing equipment

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Achieve significant efficiency improvements! Introducing a high-performance, lightweight, easy-to-use, and long-lasting centrifugal barrel polishing machine.

  • Wafer processing/polishing equipment
  • Other abrasives
  • Other processing machines

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Select the appropriate grinding method according to the production volume! Easily achieve VA/VE for parts.

  • Wafer processing/polishing equipment
  • Grinding Machine
  • Other contract services

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As the production quantity increases, it becomes possible to reduce the total cost.

  • Wafer processing/polishing equipment
  • Grinding Machine
  • Other contract services

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We have reduced the need for Kaeri processing in paper handling.

  • Wafer processing/polishing equipment
  • Grinding Machine
  • Other contract services

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Introducing a case where a company was looking for one that could ensure precision through grinding processing, as the required precision could not be achieved with press processing alone!

  • Wafer processing/polishing equipment
  • Processing Contract

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Introduction to the case study of Konishi Manufacturing, which utilizes its top-notch grinding and polishing equipment in Japan to provide integrated solutions for flat cutting, cylindrical grinding, ...

  • Wafer processing/polishing equipment
  • Processing Contract

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Introduction of Konishi Manufacturing's case, which utilizes its top-notch equipment for grinding and polishing processes in Japan, providing comprehensive support for flat cutting, cylindrical grindi...

  • Wafer processing/polishing equipment
  • Processing Contract

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High precision and mass production are achievable with grinding processing utilizing bearing machining technology!

  • Wafer processing/polishing equipment
  • Grinding Machine
  • Other contract services

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We provide reliable support from the sale of internal and external mold materials to processing.

  • Wafer processing/polishing equipment
  • Processing Contract

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Added outer diameter grinding processing! Contributed to total cost reduction.

  • Wafer processing/polishing equipment
  • Grinding Machine
  • Other contract services

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From procurement of pressing, forging, and cutting processing to consistent support for polishing and grinding processing!

  • Wafer processing/polishing equipment
  • Grinding Machine
  • Other contract services

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Cost reduction of over 40%! Cost reduction proposal service utilizing processing equipment.

  • Wafer processing/polishing equipment
  • Grinding Machine
  • Other contract services

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It is suitable for samples where you want to control the grinding amount with automatic grinding!

  • Wafer processing/polishing equipment
  • Other measurement, recording and measuring instruments

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Customize wafers according to your needs! We respond to your requests with a full lineup of sizes.

  • Wafer processing/polishing equipment
  • Wafer
  • Processing Contract

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Capable of handling various grinding tasks! It produces minimal dust dispersion and provides a quiet working environment.

  • Wafer processing/polishing equipment

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Suitable for a wide range of applications, including deburring and cleaning! Available in belt and wheel types.

  • Wafer processing/polishing equipment

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A wide variety of ceramic products used in wafer manufacturing processes and device manufacturing processes are featured!

  • Ceramics
  • Wafer processing/polishing equipment
  • Other machine elements

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Special price - Free shipping available!

  • wheel
  • Steel
  • Wafer processing/polishing equipment

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Low center of gravity, lightweight, and compact! It's a "good balance design" that pursues user experience.

  • Wafer processing/polishing equipment

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Interchangeable attachments allow for use in various tasks! Powered by a high-capacity battery, it excels in driving force and durability.

  • Wafer processing/polishing equipment

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Sanding with minimal fluff is possible! Compact, lightweight, and high-torque type.

  • Wafer processing/polishing equipment

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Lightweight design improves usability! Demonstrates performance in putty grinding, feather edging, waxing, and more!

  • Wafer processing/polishing equipment

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It is possible to complete it in as short as 2 days! We will introduce examples of polishing that have led to cost reductions.

  • Wafer processing/polishing equipment
  • Other abrasives
  • Surface treatment contract service

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Up to 20 to 30 sharpenings are possible! We will introduce examples of sharpening that restored the cutting performance to like new.

  • Wafer processing/polishing equipment
  • Other abrasives
  • Surface treatment contract service

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