List of Bonding Equipment products
- classification：Bonding Equipment
91～105 item / All 142 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Flexible bonding function! With Y and Z motor drive, it offers easy operability.
- Bonding Equipment
Versatile bonder with a variety of options! It is a universal bonder capable of performing wire bonding and pull/share tests.
- Bonding Equipment
From research and development to production! We demonstrate high quality and high versatility.
- Bonding Equipment
Since its establishment, MPP has over 40 years of experience and know-how, supplying products to more than 400 companies in 20 countries.
- Bonding Equipment
- Other semiconductor manufacturing equipment
MKE is headquartered in South Korea and boasts the second largest shipment volume of bonding wires, solder balls, and adhesives in the world.
- Bonding Equipment
- Other consumables
- Other semiconductors
A highly expandable ACF mounting device that combines alignment and thermal compression in one machine.
- Bonding Equipment
- Mounter
- Other assembly machines
A pulse heat bonding device that achieves a flexible temperature profile with pulse heat! Equipped with a highly durable ceramic heater!
- Bonding Equipment
We offer a diverse lineup including bonding press machines and laminating machines!
- Other processing machines
- Printing Machinery
- Bonding Equipment
Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.
- Bonding Equipment
Introducing a rubber connecting machine that allows for easy switching from overlapping sewing to butt sewing.
- Other processing machines
- Bonding Equipment
A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.
- Wafer processing/polishing equipment
- Bonding Equipment
[Finished] We will be exhibiting at ICEP-IAAC 2018 (April 17-21, Hotel Hanamizuki, Kuwana, Mie).
We will be exhibiting at ICEP-IAAC 2018 (April 17 (Tuesday) to 21 (Saturday); Kuwana City, Mie Prefecture). We look forward to your visit.
This is a bonding tool made using single crystal diamond. It has excellent thermal conductivity and wear resistance at high temperatures.
- Other semiconductors
- Bonding Equipment
- PCB terminal blocks
Achieving stable dispensing of two-component adhesive!
- Other processing machines
- glue
- Bonding Equipment
Domestic ultra-compact pen-type atmospheric plasma device suitable for fine processing and laboratory applications! It can be easily used at an affordable price.
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
NEW! "Rotating Plasma Device"! Exhibiting at the International Frontier Industry Messe 2012 in Kobe from September 6 to 7. ■ Demo units available at the exhibition booth. Popular for surface modification and cleaning applications.
New Product! Rotating Plasma Device Debuts at Trade Show! 【Trade Show Name】International Frontier Industry Messe 2012 【Dates】 September 6 (Thursday) - 7 (Friday), 2012 10:00 - 17:00 【Venue】Kobe International Exhibition Hall, Building 2 (Kobe Port Island) 【Expected Exhibition Scale】 200 booths (including concurrently held events) * FY 2011 results: 239 companies, 271 booths 【Expected Number of Visitors】 15,000 people * FY 2011 results: 17,253 people 【Booth】 Booth Number B-07 Displayed at the booth of 'Kyoto Environmental Nanocluster (Kyoto Institute of Advanced Technology)' 【Presentation】 September 7 (Friday) Presentation Corner A 11:00-11:20 【Exhibition Content】 ☆ Live Demonstration Tabletop Vacuum Plasma Device YHS-R Rotating Vacuum Plasma Device YHS-DOS ■ Sakigake Semiconductor Special Exhibition Page http://www.sakigake-semicon.co.jp/international-industrial-fair2012_plasma.html